Patents by Inventor Dennis H. Hawkins

Dennis H. Hawkins has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Eutectic die attachment method for integrated circuits
    Patent number: 4181249
    Abstract: A method is described for attaching sapphire, quartz, Spinel, etc. die to gold pads in a ceramic package. Because sapphire is not directly bondable to or alloyable with gold, while silicon is, silicon is either evaporated or deposited onto the backside of a sapphire or silicon-on-sapphire wafer. After the wafer has been scribed into die, the die are attached to the gold pads in the ceramic package using a gold-silicon preform as an intermediate layer.
    Type: Grant
    Filed: August 26, 1977
    Date of Patent: January 1, 1980
    Assignee: Hughes Aircraft Company
    Inventors: Henry T. Peterson, Dennis H. Hawkins