Abstract: A system for applying a melted polymer/hot melt adhesive includes structure for adding one or more components to the polymer/hot melt stream at selected locations of the stream depending on the desired final characteristics of the polymer/hot melt adhesive, the heat histories of the polymer/hot melt adhesive and the modifying component, and the physical or chemical characteristics of the modifying component. The modifying component can be supplied in a fluid carrier.

Abstract: A system for applying heated compositions includes a heated supply tank for receiving and supplying a composition at a first temperature, and a heated discharge chamber for receiving the composition from the supply tank, heating it further to a desired temperature, and discharging the composition for its end use. The system may be a bulk dispenser or a hand-held glue gun. In preferred embodiments, the compositions are hot melt adhesives, particularly hot melt adhesives of reduced density.

Abstract: Hot-melt adhesives, useful for both glue-pot and glue-gun applications, are formulated so that they can be applied at temperatures no higher than 280.degree. F. and preferably at temperatures of at most 250.degree. F. The adhesive compositions have a heat resistance of at least 125.degree. F. and are readily shaped into glue sticks for use in glue guns, The adhesive for the hot-melt adhesive compositions is suitably compounded with tackifying resin and/or wax. The resulting composition has a sharp viscosity profile, which is readily achieved, e.g., by using a high melt index adhesive polymer as an essential component.

Abstract: A hot melt adhesive composition includes decorative polyester glitter flakes. The compositions are designed for use at temperatures low enough that degradation of the glitter is avoided.

Abstract: Hot-melt adhesives, useful for both glue-port and glue-gun applications, are formulated so that they can be applied at temperatures no higher than 280.degree. F. and preferably at temperatures of at most 250.degree. F. The adhesive compositions have a heat resistance of at least 125.degree. F. and are readily shaped into glue sticks for use in glue guns. The adhesive for the hot-melt adhesive compositions is suitably compounded with tackifyin resin and/or wax. The resulting composition has a shape viscosity profile, which is readily achieved, e.g., by using a high melt index adhesive polymer as an essential component.