Abstract: Apparatus is presented herein for resiliently clamping at least one semi-conductor device to a support having an upper surface and wherein the semi-conductor device includes a housing having upper and lower spaced-apart relatively flat surfaces interconnected by an upstanding cylindrical wall. A leveller is provided having an upper dome-shaped contact surface and a lower surface having a circular-shaped first recess formed therein. The first recess is shaped and is of sufficient size to receive the upper portion of the housing including the upper surface thereof and a portion of the height of the cylindrical wall while the lower surface of the housing is located on the upper surface of the support. An elongated spring overlies and is resiliently biased toward and engages the dome-shaped contact surface of the leveller.

Abstract: An N-way power combiner includes a common output port and N input ports, each adapted to be connected to an RF input signal source. N load ports are provided with each being adapted to be connected to a reject load. N first transmission lines are provided with each connected at one end to the common output port and each connected at its opposite end to a respective one of the N input ports. N Second transmission lines respectively interconnect each of the input ports with one of the load ports. Also, N third transmission lines are provided and wherein each connects a respective one of the load ports with a common point. N reject loads are provided with each connected to a different one of the N load ports for dissipating power in the event that one or more of the RF input signal sources is deactivated.