Abstract: A spread spectrum controller that adjusts frequency range subject to a bit error rate (BER). Measuring the bit error rate (BER) at different clock frequency ranges and comparing the BER to a BER threshold. Narrowing or widening the clock frequency range based on whether the BER is above or below the BER threshold to optimize a system for both performance and compliance.

Abstract: A method and components are provided for implementing EMC shielded resonance damping of a printed circuit board. The EMC shielded resonance damping component includes a capacitor and resistor formed in series combination and contained within a shielded enclosure. A pair of coaxial pads is provided for connection to the printed circuit board. The series combination of the capacitor and resistor is connected between a first pad of a pair of coaxial pads and an interior wall of the shielded enclosure. The shielded enclosure provides a return current path to a second pad of the pair of coaxial pads through the series components.

Abstract: A modular heat sink decoupling capacitor array includes a plurality of modules, each defining parallel distributed decoupling plates, and each module forming a heat sink fi. Each module includes multiple spaced apart contacts for providing low inductance connections with an associated device. A power distribution interposer module is attached to a heat sink surface of the modular decoupling capacitor. The interposer module is used for implementing power delivery without using valuable ball grid array (BGA) connections and printed circuit board (PCB) layers.

Abstract: A pneumatic switch includes a housing which presents external contacts spaced apart to engage a component site on a device such as a circuit board. A pair of components are supported on the switch housing. A flexure mounted armature or vane is biased in one direction to electrically connect one of the pair of mounted components serially between the housing external contacts, while an air flow to the switch displaces the vane to electrically connect the other of the pair of components in series between the external contacts. The electrical leads between each of the pair of components and the external contacts are of equal length. The switch external contacts may also engage the terminals of a component at a circuit site to insert the mounted components alternatively in parallel with the existing component.

Abstract: Structures are provided for implementing an integrated conductor and capacitor in a surface mounted device (SMD) package. A first pair and a second pair of contacts contained within the SMD package respectively are provided in mating engagement with a first pair and a second pair of corresponding SMD package contacts. A conductor extends between the first pair of contacts, contained within the SMD package. A capacitor is defined between the second pair of contacts, contained within the SMD package. An additional one or pair of integral capacitors optionally is provided for providing additional capacitance to ground to decouple common mode noise from the power planes.