Abstract: A portable cat carrier has a sliding floor that momentarily and mildly destabilizes a cat's footing to facilitate transferring the cat in and out of the carrier. The floor is the bottom portion of a movable insert that has a receptacle for receiving the cat. The insert has relatively low side panels to provide the cat with a calming, unrestricted side view. After the cat is lowered into the receptacle, the insert is slid horizontally into an outer housing for containing the cat. When the insert is fully inserted within the housing, a front panel of the insert closes the housing's access opening to prevent the cat from escaping. A back panel of the insert has an elevated impassable rear barrier that prevents the cat from jumping into a trapped area between the insert and the outer housing.

Abstract: A golf ball marker for use with a golf glove including a tab which spans a slit on a back portion of the glove. A top surface of a ball marker is substantially flush with a ridge on the tab. A rubber insert having a hole therein receives a back surface of the ball marker within a recessed portion defined within the ridge. A socket is located within the hole of the rubber insert to receive a prong which is connected to the back surface of the ball marker. The ball marker is formed with a recess in the bottom surface to receive a base of a stud member so that the stud extends away from the bottom surface of the ball marker and the interfacing surface of the base is substantially parallel to the bottom surface of the ball marker.

Abstract: A process, and structure, used to monitor and control the level of photoresist removed at the periphery of a photoresist coated, semiconductor substrate, has been developed. A monitoring structure comprised of a group of graduated scribe marks, laser formed near the periphery of the semiconductor, monitoring substrate, is included with product semiconductor substrates, during the application of a photoresist layer, and during the photoresist edge bead removal procedure. The width of the photoresist edge bead, removed from product semiconductor substrates is determined via examination of the monitoring semiconductor substrate, in terms of measuring the level of graduated scribe marks, now exposed. This measurement determines the status of the product semiconductor substrates, in regards to continued processing, or rework.