Patents by Inventor Dennis L. Cardoza

Dennis L. Cardoza has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multi-section package for a mold release agent and a wipe
    Patent number: 7717257
    Abstract: A sealed multi-compartment package includes a wipe and a mold release agent which are kept separate from one another until the time of use. The package includes a first compartment for containing a fabric-like wipe and a second compartment in sealed separation from the first compartment containing a mold release agent. The first and second compartments are in communication and separated by a displaceable seal. Upon displacement of the seal, the mold release agent and the wipe are brought into mutual contact.
    Type: Grant
    Filed: May 1, 2007
    Date of Patent: May 18, 2010
    Assignee: Henkel Corporation
    Inventors: Zheng Lu, Dennis L. Cardoza, Richard Varien