Abstract: Micromachining methods for fabricating micromechanical structures which include plunger elements free to reciprocate within cavities are fabricated using processing steps in common with those employed in high density interconnect (HDI) technology for multi-chip module packaging. A polymer, such as a polyimide, is utilized as a micromachinable material. In one embodiment, cavities are formed in the polymer material by laser ablation, employing a sacrificial layer as a mask. Electroplated copper may be employed as a sacrificial release layer. One particular structure is a micromechanical electric switch including an array of individual switch contacts actuatable in common.

Abstract: A microelectromechanical photonic switch includes first and second waveguides. Insulative cladding containing a gap and having a lower refractive index than the refractive indices of the first and second waveguides is situated between the first and second waveguides. One electrode comprising an at least partially transparent material is situated on the same side of the gap as the second waveguide. An additional electrode is provided either on the same side of the gap as the first waveguide or over a piezoelectric strip above a cladding layer on the second waveguide. At least one of the electrodes is capable of being advanced towards the other of the electrodes so as to cause one of the first and second waveguides to advance towards the other of the first and second waveguides.

Abstract: A microsensor or micromechanical device based upon the piezoelectric properties of thin film lead zirconate titanate (PZT) with a thickness of between 0.1 and 5 microns. The thin film PZT is sandwiched between first and second electrodes which are provided with electrical connection means for electrically connecting the electrodes to a voltage sensor or voltage source. The invention also relates to a method for making such microsensor or micromechanical device.

Abstract: A microdynamical optical switch includes a piezoelectric actuator disposed on a substrate, a mirror securely mechanically coupled to the actuator, an input connection port, and a plurality of output connection ports. The actuator displaces the mirror along a mirror displacement path such that the mirror, which is oriented at a 45.degree. angle to the path of the incident light, deflects light passing from the input connection port into an output connection port. The actuator includes a plurality of piezoelectric bars mechanically coupled together in series in a meander line geometry such that the cumulative deflection of the piezoelectric bars is used to displace the mirror. The amount of displacement of the actuator is governed by a controllable voltage source, which applies a voltage across each of the piezoelectric bars. In one embodiment the microdynamical switch has a 1.times.

Abstract: An integrated circuit pyroelectric sensor includes two MOSFETS coupled in a differential amplifier configuration, each MOSFET having a common source. A pyroelectric capacitor is coupled to the gate of a respective one of the MOSFET. A polysilicon filament is disposed between the pyroelectric capacitors which acts as a heating element when a current is passed therethrough. The voltage difference between the drain of each MOSFET is thus a function of the voltage difference between the pyroelectric capacitors. One of the pyroelectric capacitors is disposed at the leading edge of the sensor with respect to the direction of a fluid flow. The fluid flow across the sensor will cause the first capacitor to have a different temperature than the other capacitor of the trailing edge of the sensor whose temperature is a function of the temperature of the heating element.