Abstract: Epoxy-containing compounds are prepared by dehydrohalogenating the reaction product of an epihalohydrin with the reaction product of a compound containing an average of more than one aromatic hydroxyl group per molecule with an alkylene oxide wherein the ratio of moles of epihalohydrin to hydroxyl groups is at least about 1.2:1. When these epoxy containing compounds are formulated into coatings, the resultant products have improved chemical resistance to acids.

Abstract: Epoxy-containing compounds are prepared by dehydrohalogenating the reaction product of an epihalohydrin with the reaction product of a compound containing an average of more than one aromatic hydroxyl group per molecule with an alkylene oxide wherein the ratio of moles of epihalohydrin to hydroxyl groups is at least about 1.2:1. When these epoxy containing compounds are formulated into coatings, the resultant products have improved chemical resistance to acids.

Abstract: Epoxy-containing compounds are prepared by dehydrohalogenating the reaction product of an epihalohydrin with the reaction product of a compound containing an average of more than one aromatic hydroxyl group per molecule with an alkylene oxide wherein the ratio of moles of epihalohydrin to hydroxyl groups is at least about 1.2:1. When these epoxy containing compounds are formulated into coatings, the resultant products have improved chemical resistance to acids.

Abstract: Compositions comprising (A) a halogenated phenoxy resin and (B) an advanced epoxy resin are useful in the preparation of electrical laminates when admixed with a suitable curing agent such as dicyandiamide.

Abstract: Monomers and oligomers containing a plurality of vinylbenzyl ether groups are prepared by reacting a material containing a plurality of aromatic hydroxyl groups such as tetramethyltetrabromobisphenol A with a vinylbenzyl halide such as vinylbenzyl chloride in the presence of a polar aprotic solvent such as dimethylformamide. The monomers and oligomers prepared by this process have an improvement in one or more properties selected from dielectric constant (before and/or after moisture absorption) or thermal stability. Also disclosed are new monomers and oligomers containing a plurality of vinylbenzyl ether groups such as bis(vinylbenzyl)ether of dicyclopentadienyl bisdimethylphenol.

Abstract: Curable compositions are disclosed which comprise a multiglycidyl ether such as the triglycidylether of tris(hydroxyphenyl)methane and an amine substituted sulfonic acid amide such as sulfanilamide. These compositions can be cured by heating in the presence or absence of an accelerator such as 2-methyl imidazole. These compositions are particularly useful in the preparation of electrical laminates.

Abstract: Disclosed are thermosettable compositions comprising (A) an epoxy resin such as the diglycidyl ether of bisphenol A; (B) boron trifluoride complexed with a primary, secondary or tertiary amine such as monoethanolamine and (C) at least one cyclic or acyclic phosphazene having at least one pendant ##STR1## group wherein Z is an alkyl or an aryl group such as hexa(n-propylamino)cyclotriphosphazene.When cured, these compositions have an increased glass transition temperature (Tg) value as compared to a similar composition without the phosphazene compound.These compositions are useful in potting compositions, wet lay-up and pre-impregnated laminate, adhesive, molding, coating, casting, encapsulation, filament winding and transfer molding applications.