Abstract: The present disclosure generally relates to a method for fabricating a nitrogenous steel material (200). The method comprises preparing a material powder in a powder reservoir (120) of an additive manufacturing apparatus (100). The material powder comprises: a metal powder comprising iron; and an alloying powder comprising nitrogen. The method further comprises performing an additive manufacturing process under atmospheric pressure, the additive manufacturing process comprising: displacing layers of the material powder from the powder reservoir (120) to a build platform (130) of the additive manufacturing apparatus (100); and fusing the layers of material powder on the build platform (130) to fabricate the nitrogenous steel material (200).

Abstract: A physical layer transceiver of a home network station connected to a telephone medium has an architecture enabling adaptation of detection circuitry based on received network signals to enable reliable recovery of data signals. The physical layer transceiver includes an input amplifier that amplifies network signals according to one of 128 gain settings set by a receiver gain control signal. A signal conditioning circuit includes an envelope detector configured for outputting an envelope of the amplified received signal, and an energy detector configured for outputting an energy signal of the amplified received signals. The envelope signal and the energy signal are supplied to slicer threshold circuits, configured for outputting noise, peak, data event and energy event signals based on noise threshold, peak threshold, data transition threshold, and energy threshold signals, respectively.

Abstract: A high density, non-bussed semiconductor package and a full body gold (FBG) method for manufacturing semiconductor packages are provided to improve electrical and mechanical connections with semiconductors and other electronic components and devices. The semiconductor package is fabricated by developing circuitry on the wire bond side of the semiconductor package prior to developing the ball attach side. The copper circuitry on the wire bond side is fully covered and protected from the environment. Solder masks are applied directly to the semiconductor substrate or copper layer to avoid contact with gold. The ball attach area is covered and protected by metallic layers, such as nickel and gold, or an organic solderable material to eliminate weak solder mask-gold connections.

Abstract: An apparatus detects the loss of an asynchronous input signal and generates a reset signal that is synchronous to a system clock signal. The apparatus detects the loss of the input signal and generates a first output signal. The first output signal is delayed by a predetermined number of clock cycles, and a second output signal is generated to indicate a sustained loss of the input signal. A signal monitoring circuit is provided to confirm the loss of the input signal and generate a third output signal. The reset signal is generated only if the signal loss is both sustained and confirmed. Accordingly, the apparatus will not be unnecessarily reset as a result of noise that delays or accelerates the arrival of an edge of the asynchronous input signal.