Abstract: A method of fabricating a bridge beam of an inkjet printhead employs a cavity formed under the bridge beam and an etch-stop layer that limits a back-surface recess formation. The method includes forming a cavity that connects between a bottom of a pair of trenches in and extending from a front surface of a substrate and depositing an etch-stop layer at a bottom of the cavity. The method further includes forming a recess in a back surface of the substrate, the recess exposing the etch-stop layer and the etch-stop layer limiting a depth of the formed recess. The method further includes removing the exposed etch-stop layer to connect the cavity and the recess, the bridge beam being a portion of the substrate above the formed cavity and between the trenches.

Abstract: A method of fabricating a bridge beam of an inkjet printhead employs a cavity formed under the bridge beam and an etch-stop layer that limits a back-surface recess formation. The method includes forming a cavity that connects between a bottom of a pair of trenches in and extending from a front surface of a substrate and depositing an etch-stop layer at a bottom of the cavity. The method further includes forming a recess in a back surface of the substrate, the recess exposing the etch-stop layer and the etch-stop layer limiting a depth of the formed recess. The method further includes removing the exposed etch-stop layer to connect the cavity and the recess, the bridge beam being a portion of the substrate above the formed cavity and between the trenches.

Abstract: A packaged MEMS device is fabricated by providing a first substrate, forming the MEMS device on the first substrate (the MEMS device including at least one element initially held immobile by a sacrificial material), optionally removing a portion of the sacrificial material without releasing the element, providing a second substrate, forming at least one release port, bonding the second substrate to the first substrate, and removing the sacrificial material through the release port to release the element.

Abstract: A discontinuous layer is formed on a transparent substrate of a semiconductor material. Portions of the transparent substrate are exposed at discontinuities in the discontinuous layer. The discontinuous layer and the exposed portions of the transparent substrate are etched at least until the discontinuous layer is completely removed, thereby forming peaks and valleys in the substrate.

Abstract: A method of making a fuel cell includes the following steps. A pattern is placed on a base surface to create a predetermined topography on the base surface. An anode layer, a cathode layer and/or an electrolyte layer is/are deposited over the pattern. Areas of higher topography are removed from areas of lower topography using chemical mechanical planarization to form a predetermined fuel cell structure.

Abstract: Various embodiments of the invention are directed toward a fuel cell assembly comprising a fuel cell casing and one or more fuel cell elements comprised of electrode and electrolyte material. The fuel cell casing is configured with threads and the fuel cell elements can be threadingly engaged in the fuel cell casing.

Abstract: Various embodiments of the invention comprise a dual chamber fuel cell element. The fuel cell element generally comprises a dual chamber fuel cell stack layer comprising anode, cathode and electrolyte materials deposited on one side of a substrate.

Abstract: A method of forming a MEMS device includes depositing a conductive material on a substructure, forming a first sacrificial layer over the conductive material, including forming a substantially planar surface of the first sacrificial layer, and forming a first element over the substantially planar surface of the first sacrificial layer, including communicating the first element with the conductive material through the first sacrificial layer. In addition, the method includes forming a second sacrificial layer over the first element, including forming a substantially planar surface of the second sacrificial layer, forming a support through the second sacrificial layer to the first element after forming the second sacrificial layer, including, filling the support, and forming a second element over the support and the substantially planar surface of the second sacrificial layer.

Abstract: A ceramic film is useful as ion-conducting ceramics, electrodes, hard ceramic coatings, transparent conducting oxides, transparent semiconducting oxides, ferroelectric oxides, and dielectric oxides. The ceramic film may be produced from a liquid precursor solution.

Abstract: Tunnel-junction structures are fabricated by any of a set of related methods that form two or more tunnel junctions simultaneously. The fabrication methods disclosed are compatible with conventional CMOS fabrication practices, including both single damascene and dual damascene processes. The simultaneously formed tunnel junctions may have different areas. In some embodiments, tub-well structures are formed with sloped sidewalls. In some embodiments, an oxide-metal-oxide film stack on the sidewall of a tub-well is etched to form the tunnel junctions. Memory circuits, other integrated circuit structures, substrates carrying microelectronics, and other electronic devices made by the methods are disclosed.

Abstract: Various embodiments of the invention are directed toward a fuel cell assembly comprising a fuel cell casing and one or more fuel cell elements comprised of electrode and electrolyte material. The fuel cell casing is configured with threads and the fuel cell elements can be threadingly engaged in the fuel cell casing.

Abstract: A fuel cell assembly and reactant distribution structure and method of making the same.

Abstract: A method of making a fuel cell includes the following steps. A pattern is placed on a base surface to create a predetermined topography on the base surface. An anode layer, a cathode layer and/or an electrolyte layer is/are deposited over the pattern. Areas of higher topography are removed from areas of lower topography using chemical mechanical planarization to form a predetermined fuel cell structure.

Abstract: A fuel cell assembly and reactant distribution structure and method of making the same.

Abstract: Tunnel-junction structures are fabricated by any of a set of related methods that form two or more tunnel junctions simultaneously. The fabrication methods disclosed are compatible with conventional CMOS fabrication practices, including both single damascene and dual damascene processes. The simultaneously formed tunnel junctions may have different areas. In some embodiments, tub-well structures are formed with sloped sidewalls. In some embodiments, an oxide-metal-oxide film stack on the sidewall of a tub-well is etched to form the tunnel junctions. Memory circuits, other integrated circuit structures, substrates carrying microelectronics, and other electronic devices made by the methods are disclosed.

Abstract: The invention includes an electronic memory structure. The electronic memory structure includes a substrate. A substantially planar first conductor is formed adjacent to the substrate. An interconnection layer is formed adjacent to the first conductor. A phase change material element is formed adjacent to the interconnection layer. The interconnection layer includes a conductive interconnect structure extending from the first conductor to the phase change material element. The interconnect structure includes a first surface physically connected to the first conductor. The interconnect structure further includes a second surface attached to the phase change material element. The second surface area of the second surface is substantially smaller than a first surface area of the first surface. A substantially planar second conductor is formed adjacent to the phase change material element.