Patents by Inventor Dennis M. Huff

Dennis M. Huff has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electrowetting mechanism for fluid-application device
    Patent number: 8602532
    Abstract: A fluid-application mechanism is to cause fluid to be applied onto media. An electrowetting mechanism is to generate an electric field to affect the fluid applied onto the media.
    Type: Grant
    Filed: April 30, 2011
    Date of Patent: December 10, 2013
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Dustin W. Blair, Steven W. Steinfield, Stephen W. Bauer, Dennis M. Huff