Patents by Inventor Dennis M. Klesel

Dennis M. Klesel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus for the grounding of process wafers by the use of conductive regions created by ion implantation into the surface of an electrostatic clamp
    Patent number: 6552892
    Abstract: The present invention relates to an electrostatic clamp and comprises a dielectric layer overlying an electrode and a doped region in the dielectric layer. The doped region of the dielectric layer is electrically conductive, and when the doped region is coupled to a circuit ground potential, the doped region of the dielectric layer is operable to bleed off charge which accumulates on a workpiece residing thereon during processing. The present invention further comprises a method of forming an electrostatic clamp which comprises the steps of forming an electrically insulating layer over an electrode and doping a portion of the electrically insulating layer, wherein the doped portion of the electrically insulating layer becomes electrically conductive.
    Type: Grant
    Filed: May 9, 2001
    Date of Patent: April 22, 2003
    Assignee: Axcelis Technologies, Inc.
    Inventors: James C. Carroll, Dennis M. Klesel, Bryan C. Lagos, Klaus Petry
  • Method and apparatus for the grounding of process wafers by the use of conductive regions created by ion implantation into the surface of an electrostatic clamp
    Publication number: 20020167779
    Abstract: The present invention relates to an electrostatic clamp and comprises a dielectric layer overlying an electrode and a doped region in the dielectric layer. The doped region of the dielectric layer is electrically conductive, and when the doped region is coupled to a circuit ground potential, the doped region of the dielectric layer is operable to bleed off charge which accumulates on a workpiece residing thereon during processing. The present invention further comprises a method of forming an electrostatic clamp which comprises the steps of forming an electrically insulating layer over an electrode and doping a portion of the electrically insulating layer, wherein the doped portion of the electrically insulating layer becomes electrically conductive.
    Type: Application
    Filed: May 9, 2001
    Publication date: November 14, 2002
    Inventors: James C. Carroll, Dennis M. Klesel, Bryan C. Lagos, Klaus Petry