Abstract: A method for unblocking a vacuum collet channel clogged with solder includes moving a solder-clogged collet into contact with a preform of solder, and melting the solder clog and the preform into a single melted mass, cooling the melted mass to solidify it, and moving the collet away from the cooled mass, leaving the clog behind.

Abstract: A device is provided for cleaving semiconductor products or the like. The device may be formed of an inlet for receiving pressurized gas, an adjustable slot for directing the gas toward the products, and a movable flow control member. According to one aspect of the invention, the flow control member is located within a housing that also defines the inlet and the adjustable slot. A cover may be located on the front of the housing. The cover may have a lower edge that forms one side of the slot. The other side of the slot may be formed by the movable flow control member. The cleave device may have an uncomplicated, compact construction. The cleave device may be operated with a flexible product handling system. That is, the brittle products may be handled within opposed flexible sheets. The sheets may be used to locate the products over a ledge (a cleaving position) where they are bent to cause cleaving along crystal planes initiated at scribe or score lines.

Abstract: A method for fabricating a Fabry-Perot laser having a cavity length and facet reflectivity product tuned to cause the laser to exhibit a relaxation oscillation frequency of at least 10 GHz, wherein the laser is capable of being modulated at 10 Gb/sec at drive currents between about 20 and 40 mA.

Abstract: An apparatus is provided for cleaving a laser bar into semiconductor chips. The apparatus includes a supporting structure on which a member slides. The apparatus also includes a pair of film layers. The laser bar is positioned between the film layers. A chamber is sealed to the top film layer. The chamber has an inlet through which gas is input. The movement of the member and the downward force caused by the buildup of gas pressure in the chamber induce cleaving of the laser bar at predetermined locations. The laser bar may have score marks at the predetermined locations to produce weak points. Pressure pulses may be coordinated with the movement of the member to break the laser bar at the desired locations.

Abstract: A method and apparatus are provided for freeing laser bars stuck in a facet coating fixture. A roller device is provided that rolls into a facet coating fixture channel and applies a downward force to a stuck laser bar. The roller device provides an uncomplicated and reliable system for handling the bars.

Abstract: A holding apparatus including a fixture is described. The fixture of the holding apparatus, which receives a semiconductor laser bar for optical coating, includes a base and a pair of walls. The walls and the base have inner surfaces, and the walls have a top surface upon which the laser bar rests. An extending portion of the semiconductor laser bar fits in a cavity formed by the base and the walls. The facet edges of the laser bar do not extend horizontally beyond the walls of the fixture. A coating apparatus applies a coating to the facet edges of the laser bar without contacting any coating material on the extending portion.

Abstract: A coating fixture adapted to extricate a jammed connector web is described. The coating fixture includes a pair of vertical supports. Each support has a first portion spaced apart from a second portion. Springs are placed between the first and second portions to allow movement of the first portions relative to the second portions. The second portions may be anchored to prevent their movement.

Abstract: A method for testing semiconductor laser devices is described. The method includes testing a monolithically integrated semiconductor laser device via electrical contact testing and/or far field testing. These tests will provide the total performance of the entire device. Further, the method includes accurate cleaving off of a portion of the laser device and re-testing to determine the relative performance of the remainder of the device. Through comparison of the test and re-test results, it is possible to reduce the design cycle for monolithically integrated semiconductor laser devices by detecting design flaws and imperfections or by ascertaining a more advantageous design.

Abstract: A scribing machine adapter plate is configured to receive and couple a hoop assembly to a chuck on a scribing machine. The adapter plate includes an upper surface and an inner annular vacuum groove and an outer annular vacuum groove formed in the upper surface. A third vacuum groove extends radially between, and communicates with, the inner and outer grooves. The outer vacuum groove includes a vacuum inlet hole that extends from the groove through the adapter plate to provide communication between a vacuum channel in the chuck and the vacuum grooves in the plate. The polymer film of the hoop assembly is disposed on the upper surface to seal the vacuum grooves to hold the film in place during scribing of materials placed on the film.

Abstract: A system for adhering a plurality of parts to a support film is provided. The parts are positioned between a support base with a heater and a cover membrane. The cover membrane is located beneath a sealed chamber. The chamber has an inlet through which gas is input. A downward force caused by gas pressure in the chamber causes the cover membrane to contact the parts and presses the plurality of parts against the film. A heating device heats the film to cause the parts to adhere to the film.

Abstract: A storage container for semiconductor objects is disclosed. The invention has a mounting structure having an inner frame, a temperature sensitive adherent film and an outer frame. Semiconductor objects are placed on the temperature sensitive adherent and covered. The cover does not touch the semiconductor objects because it has a spacer made of non-stick material. The invention stores semiconductor objects for a relatively long period of time in a safe and secure manner with minimal threat of breakage.

Abstract: A method and apparatus utilizing a thermal release mounting material to adhere a laser wafer to a wafer support during a semiconductor fabrication process is provided. A first surface of the mounting material contains an adhesive and is adhered to a wafer support. The wafer support contains apertures for allowing air bubbles to escape while the mounting material is being applied to the wafer support, thus, ensuring that the film is planar to the support. The laser wafer is adhered to a second surface of the mounting material. The second surface of the mounting material comprises a thermal release material. After undergoing the fabrication process, the thermal release material of the mounting material is heated to a release temperature allowing the laser wafer to be readily removed from the wafer support.

Abstract: A method and apparatus are disclosed for testing individual laser chips located on a laser bar containing a plurality of chips. Laser bars are transported widthwise on a moving plastic film sheet, which is passed over an elongated pedestal which is aligned with the film sheet. The pedestal has a width which is less than the length of a laser bar, so that the unsupported portion of the plastic film under the ends of the laser bars may be drawn downward and away from the bar. This provides access to the metalized underside of the bar, which serves as a common N-contact for all of the laser chips on the bar. A probe is placed in contact with the undersurface of the bar, and at least one additional probe is placed in contact with a P-contact on one of the laser devices. A chip activation signal is applied between the two probes, and a sensor detects whether or not the chip being probed emits radiation. Failure to emit radiation or to emit radiation in an expected manner is indicative of a bad chip.

Abstract: A slot is formed behind each face of a stackable laser bar spacer of the type having a laser bar supporting face and a lower face for contacting a laser bar therebelow, each slot being generally parallel to the face in front of it and being located near an edge thereof. This produces a thin, flap-like portion at an end of each face. When it is desired to release a stuck laser bar from a face, this flap portion is caused to flex in the direction of the laser bar. The laser bar, being relatively inflexible, will be lifted away from the corresponding face, breaking free thereof. The stacked spacers may then be separated and the laser bars removed therefrom.

Abstract: A system is provided for freeing laser bars stuck in a facet coating fixture. A roller device is provided that rolls into a facet coating fixture channel and applies a downward force to a stuck laser bar. The roller device and coating fixture combination provide an uncomplicated and reliable system for handling the bars.

Abstract: A device and method for the automated rotating of semiconductor objects during the fabrication process is disclosed. The device uses a slotted base fixture with a channel, lifting members with ducts, and a vacuum. Semiconductor objects are rotated from a vertical position to a substantially horizontal essentially evenly spaced parallel configuration. The positioning of the semiconductor objects by the device is such that the facet end of each semiconductor object remains undisturbed. The configuration of the semiconductor objects allows for quick and easy transfer to a storage surface or transfer to further semiconductor processing steps.

Abstract: An apparatus and a method for non-contact cleaving a brittle, non-metallic solid material, such as semiconductor material, glass, quartz, ceramic or like material. A pulsating gas jet directs a jet of gas toward a support structure formed of a non-compliant material. The semiconductor material is positioned on the support structure between a pair of film layers. The semiconductor material is scored in at least one location on the material. A plastic buffer material is adhered to the support structure. The semiconductor material and the film layers are moved along the support structure until the score line is at a ledge of the support structure and underneath the source of gas. The jet of gas applies a sufficient force to cleave the semiconductor material as it passes off the ledge of the support structure, while minimizing vibration and/or turbulence. The buffer provides cushioning and inhibits the formation of fractures during the cleaving process.

Abstract: An apparatus and method for minimizing electrostatic discharge damage to semiconductor objects utilizes an ionized air stream to reduce electrostatic and triboelectric potential build up in and surrounding semiconductor storage containers. The ionized air stream is continuously directed to a designated area where stored semiconductor objects are being removed from. Electrostatic and triboelectric potential is greatly reduced, minimizing the threat of electrostatic discharge and damage.

Abstract: In compiling source code organized in projects, unqualified name references are bound to program objects by searching namespaces in ascending hierarchical order from a current program unit to a current project. Namespaces within projects directly referenced by the current project are then searched. The search is completed at the first namespace in the search order which contains the matching name. Thus, program objects in projects directly referenced by the current project can be referenced by an unqualified name, without import or export lists of program elements.

Abstract: A method and apparatus are provided for automated cleaving of semiconductor laser bars into laser devices. The structures to be cleaved are sandwiched between two sheets of plastic film and, while supported on a stabilizing surface, are transported between the sheets in a direction perpendicular to scribe marks defining the sides of the laser devices. At one point, the film sheets with the structures between them pass over a raised breaker assembly on the stabilizing surface. A high pressure air source above the breaker assembly provides a blast of air towards each film sheet enclosed structure as it passes over the breaker assembly. This causes the structure to fracture or cleave along the scribe line. As the film sheet pass over the breaker assembly, the structure is cleaved at each successive scribe line. Thus, downstream of the breaker assembly, there are provided a series of separated devices between the two film sheets.