Patents by Inventor Dennis Miles, JR.

Dennis Miles, JR. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10012551
    Abstract: The invention relates to a downhole measurement sensor assembly for an electrical submersible pump that is housed within a rugged, insulated and durable enclosure. The downhole measurement sensor assembly can be manufactured in accordance with the method described herein. The sensor assembly is configured to be inserted into a windings area of a downhole motor of the electrical submersible pump. The sensor assembly includes insulated lead wires that are connected to a thin-film temperature sensing element for monitoring the ESP motor operating temperature. The thin-film sensing element includes thin lead wires that are electrically connected via a connection substrate to the insulated lead wires. The thin-film sensing element is mounted the connection member, and the connection member may include attachment apertures for connecting the insulated lead wires.
    Type: Grant
    Filed: April 21, 2015
    Date of Patent: July 3, 2018
    Assignee: AUTOMATION SOLUTIONS INC.
    Inventors: Alistair G. Smith, Dennis Miles, Jr.
  • Publication number: 20160313192
    Abstract: The invention relates to a downhole measurement sensor assembly for an electrical submersible pump that is housed within a rugged, insulated and durable enclosure. The downhole measurement sensor assembly can be manufactured in accordance with the method described herein. The sensor assembly is configured to be inserted into a windings area of a downhole motor of the electrical submersible pump. The sensor assembly includes insulated lead wires that are connected to a thin-film temperature sensing element for monitoring the ESP motor operating temperature. The thin-film sensing element includes thin lead wires that are electrically connected via a connection substrate to the insulated lead wires. The thin-film sensing element is mounted the connection member, and the connection member may include attachment apertures for connecting the insulated lead wires.
    Type: Application
    Filed: April 21, 2015
    Publication date: October 27, 2016
    Inventors: Alistair G. Smith, Dennis Miles, JR.