Patents by Inventor Dennis Miller

Dennis Miller has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6355756
    Abstract: Multifunctional electroactive copolymers are provided. The copolymers may be A-B-A triblock copolymers, brush-type graft copolymers, or variations thereof. In a preferred embodiment, the copolymers are “dual use” in that they comprise both a light emitting segment and a charge transport segment. Methods of synthesizing the novel electroactive copolymers are provided as well, as are opto-electronic devices, particularly LEDs, fabricated with the novel copolymers.
    Type: Grant
    Filed: May 18, 1999
    Date of Patent: March 12, 2002
    Assignees: International Business Machines Corporation, The Board of Trustees of the Leland Stanford Junior University
    Inventors: Craig Jon Hawker, Gerrit Klaerner, Jeong-Ik Lee, Victor Yee-Way Lee, Robert Dennis Miller, John Campbell Scott
  • Patent number: 6333141
    Abstract: The invention relates to a process for forming an integrated circuit device comprising (i) a substrate; (ii) metallic circuit lines positioned on the substrate and (iii) a dielectric material positioned on the circuit lines. The dielectric material comprises porous organic polysilica.
    Type: Grant
    Filed: July 8, 1998
    Date of Patent: December 25, 2001
    Assignee: International Business Machines Corporation
    Inventors: Kenneth Raymond Carter, Richard Anthony Dipietro, Craig Jon Hawker, James Lupton Hedrick, Victor YeeWay Lee, Robert Dennis Miller, Willi Volksen, Do Yeung Yoon
  • Patent number: 6326237
    Abstract: The invention is an encapsulated circuit assembly including a chip; a substrate; at least one solder joint, wherein the solder joint spans between the chip and the substrate forming an electrically conductive connection between the chip and the substrate; and an encapsulant formed adjacent the solder joint, wherein the encapsulant comprises a hyperbranched polymer formed by the reaction of a monomer of the formula: (A)nRB, wherein A is a coupling group reactive with B, B is a coupling group reactive with A, n is greater than 1, and R is a group selected from the group consisting of an aromatic group, an aliphatic group, and mixtures thereof Also disclosed is a method of encapsulating a circuit assembly using the encapsulant of the invention.
    Type: Grant
    Filed: June 4, 1999
    Date of Patent: December 4, 2001
    Assignee: International Business Machines Corporation
    Inventors: Kenneth Raymond Carter, Craig Jon Hawker, James Lupton Hedrick, Robert Dennis Miller, Michael Anthony Gaynes, Stephen Leslie Buchwalter
  • Patent number: 6305800
    Abstract: An ophthalmic lens element having a first surface and an atoroidal or generally aspheric second surface. The second surface is described by a symmetric polynomial whose coefficients have been chosen to minimize a merit function constructed of the sum of a particular optical aberration over substantially the entire surface thereof.
    Type: Grant
    Filed: June 16, 2000
    Date of Patent: October 23, 2001
    Assignee: Sola International Holdings Ltd.
    Inventors: Anthony Dennis Miller, Saulius Raymond Varnas
  • Publication number: 20010024738
    Abstract: Multifunctional electroactive copolymers are provided. The copolymers may be A-B-A triblock copolymers, brush-type graft copolymers, or variations thereof. In a preferred embodiment, the copolymers are “dual use” in that they comprise both a light emitting segment and a charge transport segment. Methods of synthesizing the novel electroactive copolymers are provided as well, as are opto-electronic devices, particularly LEDs, fabricated with the novel copolymers.
    Type: Application
    Filed: March 27, 2001
    Publication date: September 27, 2001
    Inventors: Craig Jon Hawker, Gerrit Klaerner, Jeong-Ik Lee, Victor Yee-Way Lee, Robert Dennis Miller, John Campbell Scott
  • Publication number: 20010022057
    Abstract: A building block for constructing masonry block walls includes a concrete block formed with first, second and third spaced parallel rectangular side walls, where the second side wall is intermediate the first and third side walls. First and second vertical end cross webs connect the first and second side walls; and a notch is formed in the upper surface of each of these vertical end cross webs. First and second spaced intermediate vertical cross webs are located in planes between the planes of the end cross webs and connect the second and third side walls. These intermediate cross webs each also have a notch extending downwardly from the top thereof. A first insulating core is dimensioned to fill the space between the first and second side walls and first and second end cross webs. Ears or protrusions extend outwardly from the insulating core to fit into the notches in the end cross webs.
    Type: Application
    Filed: May 24, 2001
    Publication date: September 20, 2001
    Inventor: Dennis Miller
  • Patent number: 6204420
    Abstract: The invention relates to a synergistic mixture of A from 5 to 99% by weight of a carboxylic acid having more than 4 carbon atoms, an ethercarboxylic acid containing C18-C22-alkyl, C18-C22-alkenyl or C6-C18-alkylaryl substituents, an amidocarboxylic acid, or mixtures thereof, B from 1 to 95% by weight of a phosphoric mono- or diester, or mixtures thereof, which is substituted by C18-C22-alkyl, C18-C22-alkenyl, C6-C18-alkylaryl or alkoxylated groups, where the sum of components A and B is 100% by weight, to crude oils containing such mixtures, and to a process for dispersing asphaltenes in crude oils.
    Type: Grant
    Filed: June 24, 1999
    Date of Patent: March 20, 2001
    Assignee: Clariant GmbH
    Inventors: Dennis Miller, Axel Vollmer, Michael Feustel, Peter Klug
  • Patent number: 6180683
    Abstract: The present invention relates to a synergistic mixture comprising, as asphaltene dispersant, from 5 to 95% by weight of a compound A of the formula I or II defined in the description, and from 5 to 95% by weight of a compound B of the formula (III) defined in the description, the substituents being defined as described in the description. The mixture is an excellent asphaltene dispersant in crude oils and products derived therefrom.
    Type: Grant
    Filed: March 9, 1998
    Date of Patent: January 30, 2001
    Assignee: Clariant GmbH
    Inventors: Dennis Miller, Michael Feustel, Axel Vollmer, Reinhard Vybiral, Dieter Hoffmann
  • Patent number: 6177360
    Abstract: The invention relates to a process for making an integrated circuit device comprising (i) a substrate, (ii) metallic circuit lines positioned on the substrate, and (iii) a dielectric material positioned on the circuit lines. The dielectric material comprises the condensation product of silsesquioxane in the presence of a photosensitive or thermally sensitive base generator.
    Type: Grant
    Filed: November 6, 1997
    Date of Patent: January 23, 2001
    Assignee: International Business Machines Corporation
    Inventors: Kenneth Raymond Carter, Robert Frances Cook, Martha Alyne Harbison, Craig Jon Hawker, James Lupton Hedrick, Victor Yee-Way Lee, Eric Gerhard Liniger, Robert Dennis Miller, Willi Volksen, Do Yeung Yoon
  • Patent number: 6143643
    Abstract: The invention relates to a process for forming an integrated circuit device comprising (i) a substrate; (ii) metallic circuit lines positioned on the substrate and (iii) a dielectric material positioned on the circuit lines. The dielectric material comprises porous organic polysilica.
    Type: Grant
    Filed: July 8, 1998
    Date of Patent: November 7, 2000
    Assignee: International Business Machines Corporation
    Inventors: Kenneth Raymond Carter, Craig Jon Hawker, James Lupton Hedrick, Victor YeeWay Lee, Robert Dennis Miller, Willi Volksen, Do Yeung Yoon
  • Patent number: 6110649
    Abstract: The invention relates to a dielectric material and a process for forming an integrated circuit device comprising (i) a substrate; (ii) metallic circuit lines positioned on the substrate and (iii) a dielectric material positioned on the circuit lines. The dielectric material comprises condensed organic polysilica and porous particles.
    Type: Grant
    Filed: November 19, 1997
    Date of Patent: August 29, 2000
    Assignee: International Business Machines Corporation
    Inventors: Kenneth Raymond Carter, Craig Jon Hawker, James Lupton Hedrick, Robert Dennis Miller, Bernhard Pogge
  • Patent number: 6111323
    Abstract: The invention is an encapsulated circuit assembly including a chip; a substrate; at least one solder joint which spans between the chip and the substrate forming an electrically conductive connection between the chip and the substrate; and an encapsulant formed adjacent the solder joint, wherein the encapsulant comprises a thermoplastic polymer formed by ring opening polymerization of a cyclic oligomer.
    Type: Grant
    Filed: December 30, 1997
    Date of Patent: August 29, 2000
    Assignee: International Business Machines Corporation
    Inventors: Kenneth Raymond Carter, Craig Jon Hawker, James Lupton Hedrick, Robert Dennis Miller, Michael Anthony Gaynes, Stephen Leslie Buchwalter
  • Patent number: 6107452
    Abstract: Preparation of thermally and/or photochemically crosslinkable oligomeric precursors and the use of those oligomeric precursors in preparing crosslinked electroactive polymers are described. The oligomers, polymers, and synthetic methods find utility in the manufacture of opto-electronic devices such as light emitting diodes, photoconductors, photovoltaic cells, and the like, wherein synthesis of electroactive films and polymeric multilayers is required.
    Type: Grant
    Filed: October 9, 1998
    Date of Patent: August 22, 2000
    Assignees: International Business Machines Corporation, Board of Trustees of the Leland Stanford Junior University
    Inventors: Robert Dennis Miller, Gerrit Klaerner, John Campbell Scott
  • Patent number: 6106736
    Abstract: A method of processing an assembly to prepare the assembly for etch patterning, the assembly including a row or bar mounted on a substrate, the row or bar bordered by a recess, the method including placing the assembly within a frame; applying a contiguous adhesive film across said assembly and said frame; depositing a fluid in said frame, said fluid forming in said recess; and removing said contiguous adhesive film.
    Type: Grant
    Filed: September 4, 1997
    Date of Patent: August 22, 2000
    Assignee: International Business Machines Corporation
    Inventors: Dien LeVan, Robert Dennis Miller, Adel Issa Nazzal, Andrew Chiuyan Ting
  • Patent number: 6093636
    Abstract: The invention relates to a process for forming an integrated circuit device comprising (i) a substrate; (ii) metallic circuit lines positioned on the substrate and (iii) a dielectric material positioned on the circuit lines. The dielectric material comprises porous organic polyarylene ether.
    Type: Grant
    Filed: July 8, 1998
    Date of Patent: July 25, 2000
    Assignee: International Business Machines Corporation
    Inventors: Kenneth Raymond Carter, Daniel Joseph Dawson, Craig Jon Hawker, James Lupton Hedrick, Jeffrey Curtis Hedrick, Victor YeeWay Lee, Robert Dennis Miller, Willi Volksen, Do Yeung Yoon
  • Patent number: 6063146
    Abstract: The present invention relates to crude oils and products derived therefrom comprising, as asphaltene dispersant, ethercarboxylic acids of the formulaRO(CH.sub.2 CHR.sub.1 O).sub.x (CH.sub.2 CHR.sub.2 O).sub.y CH.sub.2 --CO.sub.2 Hwhere the substituents have the meaning defined in the description.
    Type: Grant
    Filed: July 13, 1998
    Date of Patent: May 16, 2000
    Assignee: Clariant GmbH
    Inventors: Dennis Miller, Axel Vollmer, Michael Feustel, Peter Klug
  • Patent number: 5998876
    Abstract: The invention is an encapsulated circuit assembly including a chip; a substrate; at least one solder joint, wherein the solder joint spans between the chip and the substrate forming an electrically conductive connection between the chip and the substrate; and an encapsulant formed adjacent the solder joint, wherein the encapsulant comprises a hyperbranched polymer formed by the reaction of a monomer of the formula: (A).sub.n RB, wherein A is a coupling group reactive with B, B is a coupling group reactive with A, n is greater than 1, and R is a group selected from the group consisting of an aromatic group, an aliphatic group, and mixtures thereof.
    Type: Grant
    Filed: December 30, 1997
    Date of Patent: December 7, 1999
    Assignee: International Business Machines Corporation
    Inventors: Kenneth Raymond Carter, Craig Jon Hawker, James Lupton Hedrick, Robert Dennis Miller, Michael Anthony Gaynes, Stephen Leslie Buchwalter
  • Patent number: 5998045
    Abstract: The invention relates to an organic electroluminescent device comprising a light-emitting composition disposed between a first and second electrode. The composition comprises poly(fluorene-co-anthracene).
    Type: Grant
    Filed: July 3, 1997
    Date of Patent: December 7, 1999
    Assignees: International Business Machines Corporation, The Board of Trustees of the Leland Stanford Junior University
    Inventors: Weidong Chen, Gerrit Klaerner, Robert Dennis Miller, John Campbell Scott
  • Patent number: 5962113
    Abstract: The invention relates to an integrated circuit device comprising (i) a substrate; (ii) metallic circuit lines positioned on the substrate and (iii) a dielectric material positioned on the circuit lines. The dielectric material comprises the reaction product of an organic polysilica and polyamic ester preferably terminated with an alkoxysilyl alkyl group.
    Type: Grant
    Filed: October 28, 1996
    Date of Patent: October 5, 1999
    Assignee: International Business Machines Corporation
    Inventors: Hugh Ralph Brown, Kenneth Raymond Carter, Hyuk-Jin Cha, Richard Anthony Dipietro, James Lupton Hedrick, John Patrick Hummel, Robert Dennis Miller, Do Yeung Yoon
  • Patent number: 5953627
    Abstract: The invention relates to a process for making an integrated circuit device comprising (I) a substrate, (ii) metallic circuit lines positioned on the substrate, and (iii) a dielectric material positioned on the circuit lines. The dielectric material comprises the condensation product of silsesquioxane precursor in the presence of an organic amine having a boiling point greater than 150.degree. C.
    Type: Grant
    Filed: November 6, 1997
    Date of Patent: September 14, 1999
    Assignee: International Business Machines Corporation
    Inventors: Kenneth Raymond Carter, Robert Francis Cook, Martha Alyne Harbison, Craig Jon Hawker, James Lupton Hedrick, Sung-Mog Kim, Eric Gerhard Liniger, Robert Dennis Miller, Willi Volksen, Do Yeung Yoon