Abstract: This invention resides in a curing process for adhesive on a housing member of a tape automated bonding section (TAB section). A force is applied to the housing member and then the entire TAB section is heated to a sufficient temperature and for a sufficient duration to cure the adhesive. The applied force, coupled with the heat squeezes a portion of the adhesive out from between the TAB section and the housing member and onto an inner portion of the outer leads before the adhesive cures. This embeds the inner portion of the outer leads with adhesive so that they are retained in alignment with and electrically isolated from each other.The manner in which the force is applied to the housing member during the curing process is also a novel feature of the invention. The TAB section within the carrier frame is placed on a pedestal in a mounting fixture. A compressor block is then disposed against the TAB section.

Abstract: This invention involves the selective plating of the outer leads in tape automated bonding section (TAB section). An inner and an outer gasket are mounted over, respectively, an inner and an outer portion of the outer leads and a voltage is applied to a common plane conductor. A barrier material, usually nickel, is applied to the outer leads protruding between the inner and the outer leads and then solder is applied over the nickel layer. The debus areas which connect all the outer leads to the common plane conductor are then excised from the TAB section which is now ready for final test.