Abstract: A method for manufacturing memory card structure comprises the steps of. Providing a carry has an upper surface, which is coated with adhered glue, and a lower surface. Providing a substrate has a first surface, which is formed with first electrodes, and a lower surface, a golden finger is formed on the substrate, and is electrically connected to the first electrodes. Providing a passive component is mounted on the first surface of the substrate. Separating the substrate and the carry. Providing a chip is mounted on the first surface of the substrate. Providing a plurality of wires is electrically connected the chip to the first electrodes of the substrate. Providing a compound resin is covered on the chip and wires.

Abstract: A memory card structure includes a substrate, B-Stage glue, an adhered layer, a chip, wires, and a compound layer. The substrate has an upper surface, which is formed with first electrodes and golden fingers electrically connected to the first electrodes. The B-Stage glue is coated on the periphery of upper surface of the substrate. The adhered layer is coated on the upper surface of the substrate. The chip is formed with bonding pads, and is adhered on the upper surface of the substrate by the B-Stage glue and the adhered layer. The plurality of wires are electrically connected the bonding pads of the chip to the first electrodes of the substrate. And the compound layer is encapsulated on the chip and the wires.

Abstract: A method for re-forming BGA of a semiconductor package includes the steps of, providing a semiconductor package element formed with balls grid array, at least one of diameter of the ball is larger than the others ; providing a jig formed with penetrated holes corresponding to the each of balls of the semiconductor package element ; providing the jig mounted to the semiconductor package element, each of balls is located within the corresponding to the penetrated holes, the at least one of bigger ball is exposed from the surface of the penetrated holes of the jig; grinding the exposed part of the balls to exact size; and re-working the processes of manufacturing BGA.

Abstract: A jig structure for manufacturing a stacked memory card, wherein the stacked memory card has a substrate forming with a package area and at least a electrical element, the jig structure is formed with a penetrated slot corresponding to the mounted area of the substrate and at least a protection cover corresponding to the electrical element.

Abstract: A structure of stacked memory card, the structure includes a substrate, a lower chip, wires, adhered element, upper chip, and compound resin. The substrate has an upper surface formed with a plurality of first electrodes, and a lower surface. The B-stage glue is coated on the upper surface of the substrate. The lower chip is arranged on the upper surface of the substrate, and is located on the B-stage glue. The plurality of wires are electrically connected the lower chip to the first electrode of the substrate. The adhesive element includes adhesive agent and filling elements is coated on the lower chip. The upper chip is adhered on the lower chip by adhesive element, and is spaced with the lower chip through the filling element, then is electrically connected to the first electrode of the substrate by wires. The compound resin is encapsulated on the upper chip, lower chip, and wires.

Abstract: A chip package structure includes a substrate, a chip, a plurality of wires and an expose resin. The substrate is formed with a top surface, a bottom surface, and a long slot penetrating from the top surface to the bottom surface, at the periphery of the long slot of the bottom surface is forming with a plurality of connect points and at least a first ground point. The chip, on which at least a second ground point is formed at the periphery of the chip, and a plurality of bonding pads is located on the central of the chip, a conductive glue is printed to the periphery the chip, and electrically connected to the second ground point, since the chip mounted on the upper surface of the substrate, the plurality of bonding pads of the chip are exposed via the long slot of the substrate.

Abstract: A method for removing an image sensor from a printed circuit board. The printed circuit board has a first surface and a second surface. The image sensor is welded to the first surface, and the method includes the steps of: supplying a hot air stream to the first surface of the printed circuit board so as to distribute the hot air stream over a periphery of the image sensor and to melt solder; and providing a heater to heat the second surface of the printed circuit board and to raise a temperature of the second surface of the printed circuit board.

Abstract: An image sensor includes a substrate, a coating layer, a frame layer, a photosensitive chip, multiple wires, and a transparent layer. The substrate has an upper surface formed with first terminals projecting over the upper surface, and a lower surface formed with second terminals. The coating layer is applied to the upper surface to fill between any two adjacent first terminals and to flatten the first terminals. The frame layer is adhered to the coating layer so as to form a cavity together with the substrate. The photosensitive chip has bonding pads and is mounted to the upper surface and within the cavity. The wires electrically connect the bonding pads to the first terminals, respectively. The transparent layer is arranged on the frame layer to cover the photosensitive chip so that the photosensitive chip may receive optical signals passing through the transparent layer.