Abstract: A docking apparatus for printed circuit boards including a cassette housing, having a housing base, a housing cover and a housing wall, wherein the housing base and the housing wall are disposed relative to each other so as to define a housing cavity for containing a printed circuit card and wherein the housing wall includes a cable opening disposed so as to be communicated with the housing cavity, a housing bezel, disposed relative to the cassette housing so as to be associated with the cable opening, the housing bezel includes an outer bezel having a first plurality of openings and an inner bezel having a second plurality of apertures, the inner bezel in electrical communication with the printed circuit card, wherein said housing bezel is removable, and an EMC gasket disposed between the outer and inner bezels of said housing bezel, the EMC gasket configured to provide a removable EMC seal proximate the cable opening while still allowing airflow through the first and second plurality of apertures having the

Abstract: An electromagnetic shield system for cartridge-based printed circuit cards inserted into a printed circuit mother board comprises a card level system and a board level system which are electrically connected upon card insertion to provide more effective EMI shielding system. Prongs on a card level tab provide continuous EMI shielding even as card insertion operations are taking place. The principal linkage between the card level and board level systems is provided by a flexible shield strip which mates with apertures in a conductive board stiffener and simultaneously contacts not only a conductive cartridge bezel, but also contacts an EMI shield plate disposed on the printed circuit card.

Abstract: A docking apparatus for printed circuit boards including a cassette housing, having a housing base, a housing cover and a housing wall, wherein the housing base and the housing wall are disposed relative to each other so as to define a housing cavity for containing a printed circuit board and wherein the housing wall includes a cable opening disposed so as to be communicated with the housing cavity, a linkage mechanism, wherein the linkage mechanism includes an engagement configuration and a disengagement configuration and wherein the linkage mechanism is disposed so as to be associated with the cassette housing and a housing bezel, wherein the housing bezel is disposed relative to the cassette housing so as to be associated with the cable opening.

Abstract: A docking apparatus for printed circuit boards including a cassette housing, having a housing base, a housing cover and a housing wall, wherein the housing base and the housing wall are disposed relative to each other so as to define a housing cavity for containing a printed circuit board and wherein the housing wall includes a cable opening disposed so as to be communicated with the housing cavity, a linkage mechanism, wherein the linkage mechanism includes an engagement configuration and a disengagement configuration and wherein the linkage mechanism is disposed so as to be associated with the cassette housing and a housing bezel, wherein the housing bezel is disposed relative to the cassette housing so as to be associated with the cable opening.

Abstract: A printed circuit board employs a rigid toothed drive arm driven by an exterior spur gear to actuate a pair of levers pivotably attached to one end of the drive arm. Spur gear rotation moves the drive arm and variously moves the drive arm and levers into “Y” or “T” configurations, and in doing so, pushes against exteriorly mounted cabinet or enclosure pins to effect inward and outward motion of the entire board, even when it is fully populated with printed circuit cards contained in cooperatively acting cartridges.

Abstract: An electronic printed board assembly comprises a printed circuit board which employs printed circuit card connectors electrically connected to components mounted on the board. The printed circuit board includes board level guides with slots for receiving correspondingly shaped ridges disposed on outer, lower portions of printed circuit card-bearing cartridges. The guides are preferably provided on only one side for each cartridge to improve packaging density. The surface guides, together with the cartridge design, eliminate the need for physical contact with surrounding enclosures or cabinets.

Abstract: An electromagnetic shield system for cartridge-based printed circuit cards inserted into a printed circuit mother board comprises a card level system and a board level system which are electrically connected upon card insertion to provide more effective EMI shielding system. Prongs on a card level tab provide continuous EMI shielding even as card insertion operations are taking place. The principal linkage between the card level and board level systems is provided by a flexible shield strip which mates with apertures in a conductive board stiffener and simultaneously contacts not only a conductive cartridge bezel, but also contacts an EMI shield plate disposed on the printed circuit card.

Abstract: A contact pin holder designs which enable the provision of more contact points in a test head space while maintaining economical and convenient pin replaceability, precise pin alignment and appropriate electrical environment. The contact pin holder enables these benefits by an improved contact pin holder design which is generally characterized by an engagement structure at the periphery of a opening in a contact support housing which engagement structure releasable engages one or more modules containing one or more contact pins.

Abstract: An electronic printed board assembly comprises a printed circuit board which employs printed circuit card connectors electrically connected to components mounted on the board. The printed circuit board includes board level guides with slots for receiving correspondingly shaped ridges disposed on outer, lower portions of printed circuit card-bearing cartridges. The guides are preferably provided on only one side for each cartridge to improve packaging density. The surface guides, together with the cartridge design, eliminate the need for physical contact with surrounding enclosures or cabinets.

Abstract: A printed circuit board assembly which is capable of being inserted and removed from the system to which it is electrically connected, even when fully populated with connected printed circuit cards, comprises a multilayer structure. A middle layer printed board is sandwiched between a nonconductive base on the bottom and a stiffener disposed on the top. The stiffener is preferably electrically conductive to provide an EMI (electromagnetic interference) shielding function. The base support and stiffener together support a mechanism for insertion and removal of the entire board via an edge connector disposed along a back edge of the board.

Abstract: An electromagnetic shield system for cartridge-based printed circuit cards inserted into a printed circuit mother board comprises a card level system and a board level system which are electrically connected upon card insertion to provide more effective EMI shielding system. Prongs on a card level tab provide continuous EMI shielding even as card insertion operations are taking place. The principal linkage between the card level and board level systems is provided by a flexible shield strip which mates with apertures in a conductive board stiffener and simultaneously contacts not only a conductive cartridge bezel, but also contacts an EMI shield plate disposed on the printed circuit card.

Abstract: A printed circuit board employs a rigid toothed drive arm driven by an exterior spur gear to actuate a pair of levers pivotably attached to one end of the drive arm. Spur gear rotation moves the drive arm and variously moves the drive arm and levers into “Y” or “T” configurations, and in doing so, pushes against exteriorly mounted cabinet or enclosure pins to effect inward and outward motion of the entire board, even when it is fully populated with printed circuit cards contained in cooperatively acting cartridges.

Abstract: A cartridge is provided for the insertion and removal of printed circuit cards from a printed circuit board. The cartridges are self-contained and employ board level guides for establishing a position from which the force of card insertion can be withstood. The cartridges include an external actuating lever which also preferably operates a portion of an EMI shield system which is integrated with the circuit board. The cartridge tops also interlock to provide additional overall structural rigidity.

Abstract: A guide structure and matching printed circuit card carrying cartridge provides hot pluggability functionality even when electronic circuit components need to be disposed in very tight spaces. The guide structure includes front and rear portions linked by slot-defining rungs. Front and rear apertures provide alignment and/or locking functions. The guide structure is easily manufacturable from a single sheet of metal which is stamped and formed to meet all desirable design specifications. A matching self-contained docking cartridge is provided with mating parts for these apertures. EMI shielding and cooling functions are also accommodated.

Abstract: A preferred embodiment of an easily loadable self-contained cartridge for printed circuit card insertion and removal comprises a top wall and a front conductive bezel which is pivoted at its top with the top of the box wall. A set of three linked arms with an actuating arm extending through and affixed to the bezel provides a mechanism for moving a card-bearing movable carrier. One end of the set of linked arms is affixed to the top wall and a middle arm includes a pin which rides in a slot in the carrier to effect the desired vertical carrier motion which moves a printed circuit card edge connector into and out of a board level connector. The carrier includes slotted clips for holding the printed circuit card at one or more corners. The carrier is adjustable. A side wall includes a ridge which mates with board level guides.

Abstract: An apparatus for simultaneously testing or burning in a large number of the integrated circuit chips on a product wafer includes probes mounted on a first board and tester chips mounted on a second board, there being electrical connectors connecting the two boards. The tester chips are for distributing power to the product chips or for testing the product chips. The probes and thin film wiring to which they are attached are personalized for the pad footprint of the particular wafer being probed. The base of the first board and the second board both remain the same for all wafers in a product family. The use of two boards provides that the tester chip is kept at a substantially lower temperature than the product chips during burn-in to extend the lifetime of tester chips. A gap can be used as thermal insulation between the boards, and the gap sealed and evacuated for further thermal insulation.

Abstract: An apparatus for simultaneously testing or burning in a large number of the integrated circuit chips on a product wafer includes probes mounted on a first board and tester chips mounted on a second board, there being electrical connectors connecting the two boards. The tester chips are for distributing power to the product chips or for testing the product chips. The probes and thin film wiring to which they are attached are personalized for the pad footprint of the particular wafer being probed. The base of the first board and the second board both remain the same for all wafers in a product family. The use of two boards provides that the tester chip is kept at a substantially lower temperature than the product chips during burning to extend the lifetime of tester chips. A gap can be used as thermal insulation between the boards, and the gap sealed and evacuated for further thermal insulation.

Abstract: An exemplary embodiment of the invention is a fixture for mounting a pin grid array device. The fixture includes a base plate and a first support plate movably mounted to the base plate. The first support plate has a hole therein for receiving a pin on the pin grid array device. The hole has a longitudinal axis in a first direction. A contact is positioned in the hole a drive mechanism moves the first support plate in a second direction substantially perpendicular to the first direction to move the contact. The contact engages the pin of the pin grid array device to establish electrical contact.

Abstract: A fixture to hold an electronic substrate having probe areas on a top surface. The top surface of the electronic substrate is left open to provide a maximum area to couple interconnect wires for a device under test. In addition, a bottom surface of the substrate is left open to provide a maximum area to couple with a probe card in one embodiment, or a test head in another embodiment. This open bottom and open top minimize the mechanical interference with electrical connections. The substrate is planarized to a frame by one or more clamps that are attached to the frame. The clamps provide adjustment of the pressure down on the substrate in a Z-axis direction which is normal to the top surface of the substrate for providing a good connection with a planar card. In addition, the clamps provide adjustment in the an X-Y plane parallel to the frame and rotational correction about the Z-axis.

Abstract: An improved design for establishing contact between the device under test (DUT) and electrical contacts contained in the test head structure enables the provision of more contact points and/or the accommodation of a larger DUT. The test head includes an in-board mechanism to couple and decouple the movement of an engaging/releasing member with a holder (stiffener/clamp) for a DUT whereby the DUT is brought into and out of contact with electrical contacts in the test head. The mechanism preferably includes gripper pins in the holder (stiffener/clamp) which are coupled or decoupled from a pull arm using a combination of spring clips and spreader pins.