Patents by Inventor Dennis R Esterberg
Dennis R Esterberg has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11975547Abstract: In one example in accordance with the present disclosure, a fluid ejection controller is described. The fluid ejection controller includes a firing board to pass control signals to a fluid ejection device to eject fluid from the fluid ejection device. A mount pivotally holds the firing board between a disengaged position where electrical pins of the firing board are not in contact with electrical pads of the fluid ejection device and an engaged position where the electrical pins are in contact with the electrical pads. The mount includes a slot to receive the fluid ejection device and at least one biasing spring to bias the firing board away from the fluid ejection device during insertion of the fluid ejection device. The fluid ejection controller also includes a handle coupled to a cam shaft to move the firing board between the disengaged position and the engaged position.Type: GrantFiled: July 1, 2019Date of Patent: May 7, 2024Assignee: Hewlett-Packard Development Company, L.P.Inventors: Vignesh Kannan, Dennis R. Esterberg, Christie Dudenhoefer, Kenneth Ward, Matthew David Smith, Daniel Fradl
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Patent number: 11774463Abstract: In one example, dispenser stages described herein may include a dispenser platform comprising: a stage coupled to a rail system to move the stage in a first plane and a second plane, an alignment feature coupled to the stage to align a substrate nest coupled to the stage with a dispenser positioned above the stage, and a releasable fastener to couple the substrate nest to the stage.Type: GrantFiled: January 26, 2018Date of Patent: October 3, 2023Assignee: Hewlett-Packard Development Company, L.P.Inventors: Dennis R. Esterberg, Christie Dudenhoefer
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Patent number: 11639056Abstract: In one example in accordance with the present disclosure, a fluidic ejection controller is described. The fluidic ejection controller includes a firing board to pass electrical control signals for ejecting fluid from a fluidic ejection device. An ejection board of the fluidic ejection controller is electrically coupled to, and selectively removable from, the firing board to pass the electrical control signals to the fluidic ejection device. Electrical pins are disposed on the ejection board in a pattern that matches a pattern of electrical pads on the fluidic ejection device. The electrical pins interface with corresponding electrical pads to pass the electrical control signals from the ejection board to the fluidic ejection device.Type: GrantFiled: December 15, 2017Date of Patent: May 2, 2023Assignee: Hewlett-Packard Development Company, L.P.Inventors: Matthew David Smith, Dennis R. Esterberg, Jeffrey A. Nielsen
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Patent number: 11609241Abstract: In one example, a dispenser platform can include an enclosure that includes a first actuator to move a support in a first plane, wherein a portion of the support extends outside the enclosure, and a second actuator coupled to the portion of the support that extends outside the enclosure to move a stage coupled to the support in a second plane.Type: GrantFiled: January 26, 2018Date of Patent: March 21, 2023Assignee: Hewlett-Packard Development Company, L.P.Inventors: Dennis R. Esterberg, Christie Dudenhoefer
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Publication number: 20220322538Abstract: In one example in accordance with the present disclosure, a fluid ejection controller is described. The fluid ejection controller includes a firing board to pass control signals to a fluid ejection device to eject fluid from the fluid ejection device. A mount pivotally holds the firing board between a disengaged position where electrical pins of the firing board are not in contact with electrical pads of the fluid ejection device and an engaged position where the electrical pins are in contact with the electrical pads. The mount includes a slot to receive the fluid ejection device and at least one biasing spring to bias the firing board away from the fluid ejection device during insertion of the fluid ejection device. The fluid ejection controller also includes a handle coupled to a cam shaft to move the firing board between the disengaged position and the engaged position.Type: ApplicationFiled: July 1, 2019Publication date: October 6, 2022Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.Inventors: Vignesh KANNAN, Dennis R. ESTERBERG, Christie DUDENHOEFER, Kenneth WARD, Matthew David SMITH, Daniel FRADL
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Patent number: 11235331Abstract: A fluid ejection device may include a blank cassette that includes a substrate, a die coupled to the substrate, a number of assigned electrical traces formed on the substrate, and a number of unassigned electrical traces formed on the substrate. At least one wirebond may couple at least one of the unassigned electrical traces to the die thereby assigning at least one function to the fluid ejection device.Type: GrantFiled: February 3, 2017Date of Patent: February 1, 2022Assignee: Hewlett-Packard Development Company, L.P.Inventors: Gary G. Lutnesky, Dennis R. Esterberg, Matthew David Smith
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Patent number: 11207680Abstract: A cassette may include, in an example, a substrate, a die coupled to the substrate, and a reservoir defined in the substrate exposing a proximal side of the die to an external atmosphere wherein at least a portion of the die is proud relative to at least one surface of the substrate.Type: GrantFiled: February 3, 2017Date of Patent: December 28, 2021Assignee: Hewlett-Packard Development Company, L.P.Inventors: Gary G. Lutnesky, Dennis R. Esterberg
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Patent number: 11065619Abstract: A cassette may include a substrate, a die coupled to the substrate, and an electrical interconnection pad layout formed on a first side of the substrate. The electrical interconnection pad layout may include a first row of interconnect pads including at least one interconnect pad. Each interconnect pad of the first row of interconnect pads may be electrically coupled to one of a first set of vias. The electrical interconnection pad layout may also include a second row of interconnection pads including at least one interconnect pad. Each interconnect pad of the second row of interconnect pads being electrically coupled to one of a second set of vias. The second set of vias electrically coupled to the second row of interconnect pads are offset relative to an alignment of the interconnect pads of the first and second rows.Type: GrantFiled: February 3, 2017Date of Patent: July 20, 2021Assignee: Hewlett-Packard Development Company, L.P.Inventors: Gary G. Lutnesky, Matthew David Smith, Dennis R. Esterberg
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Publication number: 20210172971Abstract: In one example, a dispenser platform can include an enclosure that includes a first actuator to move a support in a first plane, wherein a portion of the support extends outside the enclosure, and a second actuator coupled to the portion of the support that extends outside the enclosure to move a stage coupled to the support in a second plane.Type: ApplicationFiled: January 26, 2018Publication date: June 10, 2021Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.Inventors: Dennis R. ESTERBERG, Christie DUDENHOEFER
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Publication number: 20210011043Abstract: A reagent substrate may include a reagent sample deposition area on which a sample of a reagent is deposited, and a number of diagnostic regions on which a diagnostic sample of the reagent is deposited for verification of deposition of the diagnostic sample. A reagent dispensing system may include a conveyor surface to convey a number of substrates, at least one reagent module located in-line with respect to the conveyor surface where the reagent module includes at least one reagent dispensing device to dispense a reagent on the substrates, and at least one optical sensor to verify the dispensing of the reagent at a number of diagnostic regions of the substrate.Type: ApplicationFiled: July 18, 2017Publication date: January 14, 2021Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.Inventors: Suzanne Mirashrafi, Christie Dudenhoefer, Heather B. Louderback, Craig Olbrich, Dennis R. Esterberg, Jeffrey A. Nielsen
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Publication number: 20210011042Abstract: An integrated cartridge service station may include a reagent module comprising at least one reagent ejection device, and a service module integrated with the reagent module. The service module may include at least one service device. The reagent module and the service module are movable with respect to one another within a reagent dispensing system. The at least one reagent ejection device is movable between an in-line position and an off-line position within the reagent dispensing system.Type: ApplicationFiled: July 18, 2017Publication date: January 14, 2021Applicant: HEWLETT-PACKARD DEVELOPMENT COMPNANY, L.P.Inventors: Craig Olbrich, Heather B. Louderback, Christie Dudenhoefer, Dennis R. Esterberg
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Publication number: 20200384457Abstract: In one example in accordance with the present disclosure, a fluid ejection device is described. The fluid ejection device includes a vertical support and an interface movably coupled to the vertical support. The interface is to receive an ejection head. The fluid ejection device also includes a manual adjustment device associated with the interface to adjust a distance between the interface and a substrate stage.Type: ApplicationFiled: January 30, 2018Publication date: December 10, 2020Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.Inventors: Dennis R. Esterberg, Christie Dudenhoefer, Kenneth Duda, Ed M. Grenier, David H. Ochs, Joshua M. Yu, Matthew David Smith
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Publication number: 20200353457Abstract: In one example in accordance with the present disclosure, a fluid ejection device is described. The fluid ejection device includes a vertical support and an interface movably coupled to the vertical support. The interface is to receive an ejection head. The fluid ejection device also includes an ionizer coupled to the interface to electrostatically neutralize a substrate.Type: ApplicationFiled: January 30, 2018Publication date: November 12, 2020Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.Inventors: Dennis R. ESTERBERG, Christie DUDENHOEFER
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Patent number: 10800176Abstract: An example printhead assembly includes a housing, nozzles and a collapsible container within the housing to supply ink to the nozzles. The collapsible container includes a top wall, a bottom wall, first and second side walls that form an interior and a spring assembly within the interior. The first flexible wall includes a first amount of excess material. The second flexible wall includes a second amount of excess material less than the first amount of excess material such that motion of the first flexible wall of the collapsible container is constrained against movement to a lesser extent as compared to the second flexible wall. The first flexible wall faces the sensor. A sensor assembly is coupled to the housing and includes a sensor to provide a sensor signal indicating the amount of ink within the collapsible container.Type: GrantFiled: October 23, 2019Date of Patent: October 13, 2020Assignee: Hewlett-Packard Development Company, L.P.Inventors: Dennis R Esterberg, Matthew J Janssen, Jeffrey A Nielsen, Norman L Berger
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Publication number: 20200316592Abstract: A cassette may include a substrate, a die coupled to the substrate, and an electrical interconnection pad layout formed on a first side of the substrate. The electrical interconnection pad layout may include a first row of interconnect pads including at least one interconnect pad. Each interconnect pad of the first row of interconnect pads may be electrically coupled to one of a first set of vias. The electrical interconnection pad layout may also include a second row of interconnection pads including at least one interconnect pad. Each interconnect pad of the second row of interconnect pads being electrically coupled to one of a second set of vias. The second set of vias electrically coupled to the second row of interconnect pads are offset relative to an alignment of the interconnect pads of the first and second rows.Type: ApplicationFiled: February 3, 2017Publication date: October 8, 2020Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.Inventors: Gary G. Lutnesky, Matthew David Smith, Dennis R. Esterberg
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Publication number: 20200292569Abstract: In one example, dispenser stages described herein may include a dispenser platform comprising: a stage coupled to a rail system to move the stage in a first plane and a second plane, an alignment feature coupled to the stage to align a substrate nest coupled to the stage with a dispenser positioned above the stage, and a releasable fastener to couple the substrate nest to the stage.Type: ApplicationFiled: January 26, 2018Publication date: September 17, 2020Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.Inventors: Dennis R. ESTERBERG, Christie DUDENHOEFER
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Publication number: 20200282725Abstract: In one example in accordance with the present disclosure, a fluidic ejection controller is described. The fluidic ejection controller includes a firing board to pass electrical control signals for ejecting fluid from a fluidic ejection device. An ejection board of the fluidic ejection controller is electrically coupled to, and selectively removable from, the firing board to pass the electrical control signals to the fluidic ejection device. Electrical pins are disposed on the ejection board in a pattern that matches a pattern of electrical pads on the fluidic ejection device. The electrical pins interface with corresponding electrical pads to pass the electrical control signals from the ejection board to the fluidic ejection device.Type: ApplicationFiled: December 15, 2017Publication date: September 10, 2020Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.Inventors: Matthew David Smith, Dennis R. Esterberg, Jeffrey A. Nielsen
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Patent number: D917066Type: GrantFiled: April 29, 2019Date of Patent: April 20, 2021Assignee: Hewlett-Packard Development Company, L.P.Inventors: Dennis R. Esterberg, Vignesh Kannan, Kenneth Ward, Christie Dudenhoefer
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Patent number: D919000Type: GrantFiled: December 17, 2018Date of Patent: May 11, 2021Assignee: Hewlett-Packard Development Company, L.P.Inventor: Dennis R. Esterberg
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Patent number: D963743Type: GrantFiled: March 20, 2020Date of Patent: September 13, 2022Assignee: Hewlett-Packard Development Company, L.P.Inventors: Dennis R. Esterberg, Vignesh Kannan, Kenneth Joseph Duda