Abstract: A process is described for etching a tapered point on a cylindrically symmetric body using an inert liquid layer on top of the etching solution. The process is extremely useful for etching tapered points on optical fibers prior to melt-back to form a small lens to couple light from laser to optical fiber. The process produces excellent tapered points rapidly and reproducibly with a minimum of operator attention and without etch marks above the taper.

Abstract: A procedure is described for recovering gold from rinse water. The recovery procedure involves electrochemical removal of the gold from the rinse water and is particularly advantageous for removing gold in low concentrations from rinse water.

Abstract: An apparatus and process are described in which a multiple continuous electrochemical procedure is carried out on a metallic strip. Included in this procedure is a gold-plating step with a specially designed gold-plating cell. Also, the gold electroplating is limited to certain areas of the metallic strip where required for a particular application. Particularly important is the design of the various electrochemical processing cells so that continuous processing may be carried out on a continuous moving metal strip. Also, compatibility with other electrochemical and chemical processes carried out on the continuous strip line, is desirable.

Abstract: A gold plating cell and process are described which are particularly useful for continuous gold plating procedures. Advantages of the use of this gold plating cell is the rapid plating possible without degradation of the quality of the plated gold. Rapid plating is desirable economically because of greater product throughput. Also, the cell and process is such as to concentrate the gold plating in areas of the strip where it is most needed. This is also economically advantageous since it reduces the amount of gold used.

Abstract: An apparatus and process are described for plating tin-lead solder on metallic surfaces. Particularly significant is the high plating rate and the limited amount of plating in designated areas of the metallic surface. Solder is introduced into the plating solution from anode baskets holding tin-lead solder. This apparatus and process are particularly adaptable for continuous strip plating on metallic electrical connectors.

Abstract: An apparatus and process are described in which a multiple continuous electrochemical procedure is carried out on a metallic strip. Included in this procedure are both cleaning and electropolishing steps prior to plating on the metallic strip. Particularly important is the design of the various electrochemical processing cells so that continuous processing may be carried out on a continuous moving metal strip. Also, compatibility with other electrochemical and chemical processes carried out on the continuous strip line is desirable.