Patents by Inventor Dennis Rafferty

Dennis Rafferty has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11365870
    Abstract: The holiday light attachment system is an extension structure. The holiday light attachment system includes an elevated anchor, a cable holder, a shaft mount, an extension shaft, and a light string. The cable holder attaches the light string to the elevated anchor. The shaft mount attaches to the extension shaft. The shaft mount is a tool that secures the cable holder to the elevated anchor. The holiday light attachment system attaches the light string to an elevated structure. By elevated structure is meant a surface that is above the reach of an individual. The holiday light attachment system allows the individual to attach the light string to the elevated structure without having to change the elevation of the individual.
    Type: Grant
    Filed: May 25, 2021
    Date of Patent: June 21, 2022
    Inventor: Dennis Rafferty
  • Patent number: 6861937
    Abstract: An enhanced inductive coil design for use in data storage magnetic disk drives with areal density over 35 Gb/in2, features a double wound twin coil that is able to achieve a yoke length of 15 ?m or less by reducing the insulation spacing between the two coils. The coil further presents improved reliability by reducing the possibility of occurrence of electrical shorting. The coil is made by forming two interleafing conductors on the same layer with a demesne process. A tri-level process is implemented in the layout of the first conductor to ensure that the coil width and spacing are uniform and even, in order for the second conductor to be wound therebetween. A conformal dielectric layer of approximately 0.1 to 0.2 ?m in thickness is deposited between the two conductors and serves as insulation. The two conductors are formed by a copper seed layer plating process that eliminates potential damage to the conductors during production.
    Type: Grant
    Filed: June 25, 2002
    Date of Patent: March 1, 2005
    Assignee: Western Digital (Fremont), Inc.
    Inventors: Aiguo Feng, Dennis Rafferty, Wei Xiong, Yiming Huai