Abstract: A hybrid shaft assembly for use in controlled atmosphere chambers, such as by way of example heated pedestals for semiconductor manufacturing, includes a substrate, a hub having an upper portion and a lower portion, the upper portion being secured to the substrate with an upper joining layer, and a shaft secured to the lower portion of the hub with a lower joining layer. The shaft comprises a material having a thermal conductivity lower than a material of the hub and a material of the substrate.

Abstract: A layered assembly for use in a controlled atmosphere chamber includes a plurality of substrates and an electrically functioning layer embedded between two adjacent substrates of the plurality of substrates, the electrically functioning layer being a material configured to secure the two adjacent substrates together using a solid-state bonding process. An electrical termination area is integral with the electrically functioning layer, and a peripheral sealing band is embedded between and extends around a periphery of internal faces of the two adjacent substrates, the peripheral sealing band being a material configured to secure and seal the two adjacent substrates together using the solid-state bonding process. Dielectric regions are present between the two adjacent substrates and between edge boundaries of the electrically functioning layer, the dielectric regions being sealed between the two adjacent substrates by the peripheral sealing band.

Abstract: A modular insert and monolithic structure is disclosed where the inserts are embedded in a slot in the monolithic structure to allow MSM components to be mounted directly to the planar surface of the monolithic structure.

Abstract: A modular insert and monolithic structure is disclosed where the inserts are embedded in a slot in the monolithic structure to allow MSM components to be mounted directly to the planar surface of the monolithic structure.

Abstract: A modular insert and monolithic structure is disclosed where the inserts are embedded in a slot in the monolithic structure to allow MSM components to be mounted directly to the planar surface of the monolithic structure.

Abstract: A modular insert and monolithic structure is disclosed where the inserts are embedded in a slot in the monolithic structure to allow MSM components to be mounted directly to the planar surface of the monolithic structure.

Abstract: A block for a modular fluid block assembly is disclosed. The block includes first and second opposed faces and first and second apertures from the first face to the second face for receiving a fastener. Each aperture includes a first end and a second end and a head receiving cavity disposed adjacent the first end. The block further includes a fluidic passage passing from the first face to the second face and a pair of fastener receiver cavities in the first face. The block further includes a pair of head receiving cavities in the second face.

Abstract: an adapter in accordance with the present invention comprises a male member joined to a female member. The male member includes a plug portion having a plurality of spaced slots into which a plurality of blade contacts are respectively inserted, the blade contacts making electrical connection with conductors positioned within troughs that respectively communicate with the slots. Each conductor is doubled over within its associated trough, and both ends of each conductor are terminated with a wire spring contact. The contacts at one end of these conductors are mounted in a first contact carrier, while the contacts at the other end are mounted in a second contact carrier. In addition, a plurality of conductors, also terminated at both ends with wire spring contacts, extend directly between the carriers.