Abstract: A low profile double impedance bond for placement between a pair of rails and for electrical connection to opposite sides of a pair of insulated breaks on the pair of rails, the impedance bond comprising a rectangular enclosure attachable to ties supporting the pair of rails, the enclosure having a pair of ends and a pair of sides, each side for alignment parallel to one of the rails, the impedance bond having four coils each formed of a strip of copper foil with two ends wound in a spiral configuration about a core, the impedance bond having a terminal connection array formed of a plurality of copper conductors, the conductors, cores, and coils are arranged in a low profile manner on a single platform allowing quick installation inbetween rails.

Abstract: A low profile double impedance bond for placement between a pair of rails and for electrical connection to opposite sides of a pair of insulated breaks on the pair of rails, the impedance bond comprising a rectangular enclosure attachable to ties supporting the pair of rails, the enclosure having a pair of ends and a pair of sides, each side for alignment parallel to one of the rails, the impedance bond having four coils each formed of a strip of copper foil with two ends wound in a spiral configuration about a core, the impedance bond having a terminal connection array formed of a plurality of copper conductors, the conductors, cores, and coils are arranged in a low profile manner on a single platform allowing quick installation inbetween rails.