Abstract: A packaging process of a circuit board involves a first step in which the circuit board is provided with a predetermined number of pins and is then arranged in the lower mold of a first molding tool. The upper mold of the first molding tool is joined with the lower mold before the resin is injected. The mold is then opened to remove therefrom a semifinished product, which is provided with a metal passivation layer and is subsequently placed in a second molding tool to carry out a second packaging operation. The second molding tool is opened to remove therefrom a finished product.

Abstract: A circuit board packaging process comprises the steps of: (a) connecting a circuit board with a plurality of pins by soldering; (b) attaching a metal housing to the cavity of the lower mold of a molding tool, the lower mold cavity has a resin feeding port; the metal housing has a through hole corresponding in location to the resin feeding port; (c) attaching a metal piece to the upper mold of the molding tool; the metal piece has a plurality of through holes for receiving therethrough the pins; the upper mold cavity has a plurality of insertion holes corresponding in location to the through holes; the circuit board is retained under the metal piece such that the pins are inserted into the insertion holes via the through holes; (d) closing the upper and the lower molds to enable the circuit board to be located between the metal piece and the metal housing; (e) injecting resin toward the through hole from the resin feeding port; (f) upon completion of the cooling of the molding tool, removing a finished product

Abstract: An outer cover shell and plate member soldering method includes the steps of: (a) applying a predetermined thickness of soldering material to the border of the plate member, (b) pressing the outer cover shell on the plate member in the platform of a high-frequency heating machine, (c) lifting the platform to let the outer cover shell be coupled to the induction coil of the high-frequency heating machine, (d) driving the high-frequency heating machine to output an oscillating current, causing a high temperature to be produced around the border of the outer cover shell within the induction coil, (e) letting the soldering material be melted due to the thermal effect of the outer cover shell, so that the outer cover shell and the plate member are bonded together.

Abstract: A packaging process of a circuit board involves a first step in which the circuit board is provided with a predetermined number of pins and is then arranged in the lower mold of a first molding tool. The upper mold of the first molding tool is joined with the lower mold before the resin is injected. The mold is then opened to remove therefrom a semifinished product, which is provided with a metal passivation layer and is subsequently placed in a second molding tool to carry out a second packaging operation. The second molding tool is opened to remove therefrom a finished product.