Abstract: A fiber array connector is passively self-aligned to provide optical coupling between a first N×M array of optical fibers and a second N×M array of optical fibers. Each fiber array is inserted in a separate half of the connector, where each individual fiber is then supported through an aperture in a fiber array connector piece part. The connector piece part comprises a stack of substrate members, processed to include apertures for supporting the fibers in an array formation. The top substrate member of each stack is further processed to include alignment apertures so that as the two fiber array connector halves are mated the alignment fiducials on the connector piece parts will mate and self-align the fiber arrays.

Abstract: A fiber array connector is passively self-aligned to provide optical coupling between a first N×M array of optical fibers and a second N×M array of optical fibers. Each fiber array is inserted in a separate half of the connector, where each individual fiber is then supported through an aperture in a fiber array connector piece part. The connector piece part comprises a stack of substrate members, processed to include apertures for supporting the fibers in an array formation. The top substrate member of each stack is further processed to include alignment apertures so that as the two fiber array connector halves are mated the alignment fiducials on the connector piece parts will mate and self-align the fiber arrays.

Abstract: A fiber array connector is passively self-aligned to provide optical coupling between a first N×M array of optical fibers and a second N×M array of optical fibers. Each fiber array is inserted in a separate half of the connector, where each individual fiber is then supported through an aperture in a fiber array connector piece part. The connector piece part comprises a stack of substrate members, processed to include apertures for supporting the fibers in an array formation. The top substrate member of each stack is further processed to include alignment apertures so that as the two fiber array connector halves are mated the alignment fiducials on the connector piece parts will mate and self-align the fiber arrays.

Abstract: A self-aligned 1×N fiber optic switch uses silicon optical bench technology to provide the alignment between the single fiber and the “selected” one-out-of-N fibers. A first substrate stack is used to support the single fiber, using a via etched through the thickness of the stack, and includes alignment fiducials formed on the top surface thereof. A second substrate stack is used to similarly support an array of N fibers, the array disposed in a circular arrangement with respect to the top surface of the second substrate stack. A set of alignment fiducials is also formed on the top surface of the second substrate stack. One alignment feature includes a “centering” fiducial to allow for the two stacks to be properly aligned. Another alignment fiducial includes a circular channel, having a diameter greater than that of a fiber array, and allowing for alignment sphere to “rest” in the channel when the substrate stacks are mated.

Abstract: An optical communication arrangement is disclosed which utilizes a combination of leadframe and package molding technology to reduce the complexity of the arrangement. In general, a leadframe is utilized for the placement and connection of the required electronic circuitry. A first molding operation is then performed to encapsulate the electronics. If necessary, a metallic plate may then be attached to the housed electronics to provide EMI shielding. An optical device is then coupled to the leadframe, where a separate subassembly may be used to house the optical device. The encapsulated electronics and optics are then simultaneously covered during a second molding operation to form the final package. In one embodiment, an optical subassembly incorporating a connector receptacle may be utilized, where the second molding operation is performed such that the connector receptacle remains exposed. Alternatively, the molded outer package may be configured to include the connector receptacle.