Patents by Inventor Dennis Tak Kit Tong
Dennis Tak Kit Tong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9739958Abstract: An optical subassembly includes: a TSV submount layer carrying an active optical component and a sandwich cap bonded to the TSV submount layer. The sandwich cap includes a bottom spacer layer disposed above the TSV submount layer, a glass layer above the bottom spacer layer, and an upper spacer layer above the glass layer. A cavity is defined in the bottom spacer layer and configured for accommodating the active optical component. At least one first lens is formed on the glass layer and is opposite to the active optical component. An alignment feature is formed in the upper spacer layer.Type: GrantFiled: July 4, 2016Date of Patent: August 22, 2017Assignee: SAE Magnetics (H.K.) Ltd.Inventors: Wei Ma, Wai Hung, Francis Guillen Gamboa, Xiaoming Yu, Dennis Tak Kit Tong
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Patent number: 9679784Abstract: A wafer-level packaged optical subassembly includes: a substrate element, the substrate element including a top layer and a base layer being bonded with the top layer; a top window cover being bonded with the top layer of the substrate element; and a plurality of active optoelectronic elements disposed within the substrate element. At least one primary cavity is defined in the substrate element by the top layer and the base layer, and configured for accommodating the active optoelectronic elements. A plurality of peripheral cavities are defined around the at least one primary cavity as alignment features for external opto-mechanical parts.Type: GrantFiled: May 4, 2015Date of Patent: June 13, 2017Assignee: SAE Magnetics (H.K.) Ltd.Inventors: Dennis Tak Kit Tong, Vincent Wai Hung
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Patent number: 9671576Abstract: A CWDM transceiver module includes: a substrate; a plurality of light sources disposed on the substrate; a spacer layer disposed above the substrate, a cavity being defined in the space layer to accommodate the light sources; a cap layer transparent to light emitted from the light sources and disposed on the spacer layer, a notch for assembling a waveguide being formed in the cap layer; a plurality of lenses disposed on the cap layer facing the light sources; reflector coating and filter coating disposed on surfaces of the cap layer; an active alignment element disposed on the cap layer; and a reflector disposed at bottom of the notch.Type: GrantFiled: April 8, 2016Date of Patent: June 6, 2017Assignee: SAE MAGNETICS (H.K.) LTD.Inventors: Dennis Tak Kit Tong, Vivian Wei Ma, Vincent Wai Hung
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Publication number: 20160313514Abstract: An optical subassembly includes: a TSV submount layer carrying an active optical component and a sandwich cap bonded to the TSV submount layer. The sandwich cap includes a bottom spacer layer disposed above the TSV submount layer, a glass layer above the bottom spacer layer, and an upper spacer layer above the glass layer. A cavity is defined in the bottom spacer layer and configured for accommodating the active optical component. At least one first lens is formed on the glass layer and is opposite to the active optical component. An alignment feature is formed in the upper spacer layer.Type: ApplicationFiled: July 4, 2016Publication date: October 27, 2016Inventors: Wei Ma, Wai Hung, Francis Guillen Gamboa, Xiaoming Yu, Dennis Tak Kit Tong
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Patent number: 9429727Abstract: An optical subassembly includes: a TSV submount layer carrying an active optical component and a sandwich cap bonded to the TSV submount layer. The sandwich cap includes a bottom spacer layer disposed above the TSV submount layer, a glass layer above the bottom spacer layer, and an upper spacer layer above the glass layer. A cavity is defined in the bottom spacer layer and configured for accommodating the active optical component. At least one first lens is formed on the glass layer and is opposite to the active optical component. An alignment feature is formed in the upper spacer layer.Type: GrantFiled: November 6, 2014Date of Patent: August 30, 2016Assignee: SAE MAGNETICS (H.K.) LTD.Inventors: Wei Ma, Wai Hung, Francis Guillen Gamboa, Xiaoming Yu, Dennis Tak Kit Tong
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Publication number: 20160131861Abstract: An optical subassembly includes: a TSV submount layer carrying an active optical component and a sandwich cap bonded to the TSV submount layer. The sandwich cap includes a bottom spacer layer disposed above the TSV submount layer, a glass layer above the bottom spacer layer, and an upper spacer layer above the glass layer. A cavity is defined in the bottom spacer layer and configured for accommodating the active optical component. At least one first lens is formed on the glass layer and is opposite to the active optical component. An alignment feature is formed in the upper spacer layer.Type: ApplicationFiled: November 6, 2014Publication date: May 12, 2016Inventors: Wei Ma, Wai Hung, Francis Guillen Gamboa, Xiaoming Yu, Dennis Tak Kit Tong
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Publication number: 20150348953Abstract: An optoelectronic package includes a substrate and a cover element bonded onto the substrate. The cover element defines a cavity for accommodating semiconductor chips and optoelectronic components. The cover element includes a first adhesive bonding area configured for receiving a first adhesive and being bonded with a predetermined region of the substrate by the first adhesive. The engagement of the cover element and the substrate defines a second adhesive bonding area. The second adhesive bonding area is configured for receiving a second adhesive and confining the second adhesive within a localized area. A method for making an optoelectronic package is also provided.Type: ApplicationFiled: August 7, 2015Publication date: December 3, 2015Inventors: Dennis Tak Kit Tong, Vincent Wai Hung, Danny Chih Hsun Lin, Francis Guillen Gamboa
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Patent number: 9142693Abstract: An optoelectronic package includes a substrate and a cover element bonded onto the substrate. The cover element defines a cavity for accommodating semiconductor chips and optoelectronic components. The cover element includes a first adhesive bonding area configured for receiving a first adhesive and being bonded with a predetermined region of the substrate by the first adhesive. The engagement of the cover element and the substrate defines a second adhesive bonding area. The second adhesive bonding area is configured for receiving a second adhesive and confining the second adhesive within a localized area. A method for making an optoelectronic package is also provided.Type: GrantFiled: April 11, 2013Date of Patent: September 22, 2015Assignee: SAE MAGNETICS (H.K.) LTD.Inventors: Dennis Tak Kit Tong, Vincent Wai Hung, Danny Chih Hsun Lin, Francis Guillen Gamboa
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Publication number: 20150235870Abstract: A wafer-level packaged optical subassembly includes: a substrate element, the substrate element including a top layer and a base layer being bonded with the top layer; a top window cover being bonded with the top layer of the substrate element; and a plurality of active optoelectronic elements disposed within the substrate element. At least one primary cavity is defined in the substrate element by the top layer and the base layer, and configured for accommodating the active optoelectronic elements. A plurality of peripheral cavities are defined around the at least one primary cavity as alignment features for external opto-mechanical parts.Type: ApplicationFiled: May 4, 2015Publication date: August 20, 2015Inventors: Dennis Tak Kit Tong, Vincent Wai Hung
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Patent number: 9052476Abstract: A wafer-level packaged optical subassembly includes: a substrate element, the substrate element including a top layer and a base layer being bonded with the top layer; a top window cover being bonded with the top layer of the substrate element; and a plurality of active optoelectronic elements disposed within the substrate element. At least one primary cavity is defined in the substrate element by the top layer and the base layer, and configured for accommodating the active optoelectronic elements. A plurality of peripheral cavities are defined around the at least one primary cavity as alignment features for external opto-mechanical parts.Type: GrantFiled: July 2, 2013Date of Patent: June 9, 2015Assignee: SAE MAGNETICS (H.K.) LTD.Inventors: Dennis Tak Kit Tong, Vincent Wai Hung
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Patent number: 8998649Abstract: A serial electrical connector includes a connector plug and a connector jack. The connector plug includes an audio plug with a hollow cylindrical space formed in the center thereof; a coaxial cable being inserted into and filling the space; and an engagement element being disposed at a tip of the audio plug and configured to electrically connect the audio plug to the connector jack.Type: GrantFiled: March 12, 2013Date of Patent: April 7, 2015Assignee: SAE Magnetics (H.K.) Ltd.Inventors: Fuk Ming Lam, Francis Guillen Gamboa, Vincent Wai Hung, Dennis Tak Kit Tong
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Patent number: 8807846Abstract: A pluggable optical transceiver includes: a top housing; a bottom housing; and an optical-electrical assembly enclosed by the top housing and the bottom housing. The optical-electrical assembly includes a substrate; at least a transmitting optoelectronic component disposed on the substrate; at least a receiving optoelectronic component disposed on the substrate; interface integrated circuits disposed on the substrate; a pluggable electrical interface disposed on the substrate and electrically connected with the interface integrated circuits; and a coupling optical system.Type: GrantFiled: February 25, 2013Date of Patent: August 19, 2014Assignee: SAE Magnetics (H.K.) Ltd.Inventors: Vincent Wai Hung, Francis Guillen Gamboa, Amanda Tin Hoi Siu, Dennis Tak Kit Tong
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Patent number: 8708575Abstract: An active optical connector using an audio port includes a plug insertable into a jack having an optical transceiver module. A conductor is mounted on the plug. Optical fibers extend through a central bore of the plug and have front ends held in a fiber ferrule. The jack has a terminal for contacting the conductor on the plug. The optical transceiver module has a receptacle for receiving the fiber ferrule. A light source emits light to an optical fiber, and a photo-detector receives light from another optical fiber. A controller chip has a converting circuit configured to convert electrical signals into optical signal and optical signals into electrical signals.Type: GrantFiled: November 12, 2012Date of Patent: April 29, 2014Assignee: SAE Magnetics (H.K.) Ltd.Inventors: Vincent Wai Hung, Francis Guillen Gamboa, Fuk Ming Lam, Victor Pak Hong Ng, Dennis Tak Kit Tong
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Publication number: 20140010496Abstract: A wafer-level packaged optical subassembly includes: a substrate element, the substrate element including a top layer and a base layer being bonded with the top layer; a top window cover being bonded with the top layer of the substrate element; and a plurality of active optoelectronic elements disposed within the substrate element. At least one primary cavity is defined in the substrate element by the top layer and the base layer, and configured for accommodating the active optoelectronic elements. A plurality of peripheral cavities are defined around the at least one primary cavity as alignment features for external opto-mechanical parts.Type: ApplicationFiled: July 2, 2013Publication date: January 9, 2014Inventors: Dennis Tak Kit TONG, Vincent Wai Hung
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Publication number: 20130270584Abstract: An optoelectronic package includes a substrate and a cover element bonded onto the substrate. The cover element defines a cavity for accommodating semiconductor chips and optoelectronic components. The cover element includes a first adhesive bonding area configured for receiving a first adhesive and being bonded with a predetermined region of the substrate by the first adhesive. The engagement of the cover element and the substrate defines a second adhesive bonding area. The second adhesive bonding area is configured for receiving a second adhesive and confining the second adhesive within a localized area. A method for making an optoelectronic package is also provided.Type: ApplicationFiled: April 11, 2013Publication date: October 17, 2013Applicant: SAE Magnetics (H.K.) Ltd.Inventors: Dennis Tak Kit TONG, Vincent Wai HUNG, Danny Chih Hsun LIN, Francis Guillen GAMBOA
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Publication number: 20130244485Abstract: A serial electrical connector includes a connector plug and a connector jack. The connector plug includes an audio plug with a hollow cylindrical space formed in the center thereof; a coaxial cable being inserted into and filling the space; and an engagement element being disposed at a tip of the audio plug and configured to electrically connect the audio plug to the connector jack.Type: ApplicationFiled: March 12, 2013Publication date: September 19, 2013Applicant: SAE MAGNETICS (H.K.) LTD.Inventors: Fuk Ming LAM, Francis Guillen GAMBOA, Vincent Wai HUNG, Dennis Tak Kit TONG
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Publication number: 20130230278Abstract: A pluggable optical transceiver includes: a top housing; a bottom housing; and an optical-electrical assembly enclosed by the top housing and the bottom housing. The optical-electrical assembly includes a substrate; at least a transmitting optoelectronic component disposed on the substrate; at least a receiving optoelectronic component disposed on the substrate; interface integrated circuits disposed on the substrate; a pluggable electrical interface disposed on the substrate and electrically connected with the interface integrated circuits; and a coupling optical system.Type: ApplicationFiled: February 25, 2013Publication date: September 5, 2013Applicant: SAE Magnetics (H.K) Ltd.Inventors: Vincent Wai HUNG, Francis Guillen GAMBOA, Amanda Tin Hoi SIU, Dennis Tak Kit TONG
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Patent number: 7940500Abstract: Certain example embodiments disclosed herein relate to multi-chip module (MCM) packages that include external and internal electrostatic discharge (ESD) protection circuits, and/or methods of making the same. In certain example embodiments, ESD protection circuits are located under the IO pads in the MCM package, the size of the internal dies' ESD circuits are reduced (e.g., by making them as small as possible in certain example implementations), and high-immunity ESD circuits are provided to the IO pads where they are exposed to the external environment. The external ESD protection circuits may provide a higher level of voltage protection than the internal ESD protection circuits. Thus, the external ESD protection circuits may provide shock protection from human body model shocks, whereas the internal ESD protection circuits may provide protection from machine or assembly model shocks.Type: GrantFiled: May 23, 2008Date of Patent: May 10, 2011Assignee: SAE Magnetics (H.K.) Ltd.Inventors: Michael Shih Chiang Yang, Dennis Tak Kit Tong
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Publication number: 20090290271Abstract: Certain example embodiments disclosed herein relate to multi-chip module (MCM) packages that include external and internal electrostatic discharge (ESD) protection circuits, and/or methods of making the same. In certain example embodiments, ESD protection circuits are located under the IO pads in the MCM package, the size of the internal dies' ESD circuits are reduced (e.g., by making them as small as possible in certain example implementations), and high-immunity ESD circuits are provided to the IO pads where they are exposed to the external environment. The external ESD protection circuits may provide a higher level of voltage protection than the internal ESD protection circuits. Thus, the external ESD protection circuits may provide shock protection from human body model shocks, whereas the internal ESD protection circuits may provide protection from machine or assembly model shocks.Type: ApplicationFiled: May 23, 2008Publication date: November 26, 2009Applicant: SAE Magnetics (H.K.) Ltd.Inventors: Michael Shih Chiang Yang, Dennis Tak Kit Tong