Abstract: A thermal management device includes a wicking heat spreader and a boiling enhancement surface feature positioned on at least one interior surface of the wicking heat spreader.

Abstract: A method of thermal management of a computing device includes immersing a first electronic component of the computing device in a first working fluid contained in a first volume, immersing a second electronic component of the computing device in a second working fluid contained in a second volume, and changing a pressure in the first volume to alter a boiling temperature of the first working fluid in the first volume.

Abstract: The discussion relates to busbars that are protected from unintentional contact. One example includes a liquid immersion tank and a protected automatic busbar assembly positioned in the liquid immersion tank. The protected automatic busbar assembly can include a conductor and a deployable protector biased over the conductor. The example can include a computer that includes a device controller and an electrical connector. The device controller can be configured to overcome the bias and cause the deployable protector to transition away from the conductor to allow the conductor to be engaged by the electrical connector to couple the computer to the conductor of the protected automatic busbar assembly.

Abstract: A thermal management device is described. The device includes a substrate having a spreader surface and a plurality of thermal features connected to the spreader surface of the substrate. At least one thermal feature includes a body having a longitudinal axis and a hollow bore having an inner diameter perpendicular to the longitudinal axis and an opening at a distal end distal from the substrate.

Abstract: A vapor recovery system comprises an inlet located at a first end of a fluid path configured to receive a fluid vapor to the vapor recovery system. The vapor recovery system comprises a condenser located on the fluid path and a scrubber located on the fluid path. The vapor recovery system comprises a composition sensor located on the fluid path between the scrubber and a second end of the fluid path. The composition sensor is configured to measure a composition of the fluid vapor. The vapor recovery system comprises an exhaust located at the second end of the fluid path configured to exhaust at least a portion of the fluid vapor from the fluid path at a composition having an amount of a working fluid below a working fluid threshold.

Abstract: The description relates to cooling electronic components, such as computing devices. One example includes a rack defining a volume and multiple sealed chassis modules removably fluidly coupled to a two-phase condenser tank via a vapor coupler and a liquid coupler. Individual sealed chassis modules can contain one or more electronic components immersed in two-phase coolant that when heated by operation of the electronic components experiences a phase change from a liquid phase to a gas phase and travels to the two-phase condenser tank via the vapor coupler and is cooled in the two-phase condenser tank until experiencing a phase change back into the liquid phase. Individual sealed chassis modules can be decoupled from the two-phase condenser tank without releasing two-phase coolant and an entirety of the multiple sealed chassis modules and the condenser tank are contained in the volume of the rack.

Abstract: A processor includes a first die, a second die connected to the first die with a microfluidic volume positioned between the first die and the second die, at least one pin fin positioned in the microfluidic volume, and a boiling enhancement surface feature positioned on a pin surface of the pin fin.

Abstract: A processor includes a first die, a second die connected to the first die with a microfluidic volume positioned between the first die and the second die, a wicking heat spreader positioned in the microfluidic volume; and a boiling enhancement surface feature positioned on at least one surface of the wicking heat spreader.

Abstract: A thermal management device includes a wicking heat spreader and a boiling enhancement surface feature positioned on at least one interior surface of the wicking heat spreader.

Abstract: A heat sink includes a body with an expansion chamber therein. The body is configured to receive heat from a heat source. The expansion chamber is configured to expand a working fluid from an inlet port to an outlet port of the heat sink. An immersion system includes a heat sink and a pressurizing mechanism for pressurizing the working fluid prior to the inlet port.

Abstract: A method of thermal management of a computing device includes immersing a first electronic component of the computing device in a first working fluid contained in a first volume, immersing a second electronic component of the computing device in a second working fluid contained in a second volume, and changing a pressure in the first volume to alter a boiling temperature of the first working fluid in the first volume.

Abstract: A device for simulating thermal loads includes a platform and a plurality of nodes supported by the platform. At least one node is a movable node connected to the platform by a movable stage to move the movable node relative to the platform.

Abstract: An immersion cooling thermal management system includes a heat duct thermally coupled to a heat-generating electronic component. The heat duct has an inlet at a first longitudinal end of a channel and an outlet at an opposite second longitudinal end of the channel. The heat-generating electronic component is thermally coupled with the channel longitudinally between the inlet and the outlet. The outlet of the channel is higher than the inlet relative to a direction of gravity.

Abstract: A pump tray has a liquid pump with an inlet and outlet. A blindly matable liquid coupler fluidicly couples with the pump inlet and a blindly matable liquid coupler fluidicly couples with the pump outlet. A chassis of the pump tray has an alignment member configured to removably engage with another device and to restrict, to a limited number of degrees-of-freedom, movement of the chassis relative to the other device (e.g., a liquid pumping unit). The blindly matable liquid couplers are so physically coupled with the chassis as to inhibit movement of them relative to the chassis. A liquid pumping unit also has a chassis defining a bay configured to receive a pump tray, a liquid inlet coupler and a liquid outlet coupler, and a reservoir fluidicly coupled with the liquid inlet coupler. A blindly-matable liquid coupler fluidicly couples with the reservoir outlet and a blindly-matable liquid coupler fluidicly couples with the liquid outlet coupler.

Abstract: The description relates to cooling electronic components, such as computing devices. One example includes a rack defining a volume and multiple sealed chassis modules removably fluidly coupled to a two-phase condenser tank via a vapor coupler and a liquid coupler. Individual sealed chassis modules can contain one or more electronic components immersed in two-phase coolant that when heated by operation of the electronic components experiences a phase change from a liquid phase to a gas phase and travels to the two-phase condenser tank via the vapor coupler and is cooled in the two-phase condenser tank until experiencing a phase change back into the liquid phase. Individual sealed chassis modules can be decoupled from the two-phase condenser tank without releasing two-phase coolant and an entirety of the multiple sealed chassis modules and the condenser tank are contained in the volume of the rack.

Abstract: A pump tray has a liquid pump with an inlet and outlet. A blindly matable liquid coupler fluidicly couples with the pump inlet and a blindly matable liquid coupler fluidicly couples with the pump outlet. A chassis of the pump tray has an alignment member configured to removably engage with another device and to restrict, to a limited number of degrees-of-freedom, movement of the chassis relative to the other device (e.g., a liquid pumping unit). The blindly matable liquid couplers are so physically coupled with the chassis as to inhibit movement of them relative to the chassis. A liquid pumping unit also has a chassis defining a bay configured to receive a pump tray, a liquid inlet coupler and a liquid outlet coupler, and a reservoir fluidicly coupled with the liquid inlet coupler. A blindly-matable liquid coupler fluidicly couples with the reservoir outlet and a blindly-matable liquid coupler fluidicly couples with the liquid outlet coupler.

Abstract: A pump tray has a liquid pump with an inlet and outlet. A blindly matable liquid coupler fluidicly couples with the pump inlet and a blindly matable liquid coupler fluidicly couples with the pump outlet. A chassis of the pump tray has an alignment member configured to removably engage with another device and to restrict, to a limited number of degrees-of-freedom, movement of the chassis relative to the other device (e.g., a liquid pumping unit). The blindly matable liquid couplers are so physically coupled with the chassis as to inhibit movement of them relative to the chassis. A liquid pumping unit also has a chassis defining a bay configured to receive a pump tray, a liquid inlet coupler and a liquid outlet coupler, and a reservoir fluidicly coupled with the liquid inlet coupler. A blindly-matable liquid coupler fluidicly couples with the reservoir outlet and a blindly-matable liquid coupler fluidicly couples with the liquid outlet coupler.