Patents by Inventor Dennis Ty

Dennis Ty has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190262141
    Abstract: An expandable interbody fusion device includes superior and inferior endplates that are configured to receive a sequentially inserted stack of interlocking expansion members or wafers. The like-configured wafers include features on their top and bottom surfaces that interlock the wafers in multiple degrees of freedom so that the wafer stack is not disrupted when the fusion device is fully expanded. One of the interlocking features includes a plurality of prongs projecting from an upper surface of the wafers and into a recess defined in the lower surface of an adjacent previously inserted like-configured wafer. The prongs and recesses are configured to prevent retrograde movement of each new wafer in a direction opposite the direction of insertion. Other interlocking features prevent movement in the direction of insertion, transverse to the insertion direction and vertically within the stack.
    Type: Application
    Filed: May 9, 2019
    Publication date: August 29, 2019
    Inventors: Peter Barreiro, Dennis TY, Michael E. Landry
  • Patent number: 10292835
    Abstract: An expandable interbody fusion device includes superior and inferior endplates that are configured to receive a sequentially inserted stack of interlocking expansion members or wafers. The like-configured wafers include features on their top and bottom surfaces that interlock the wafers in multiple degrees of freedom so that the wafer stack is not disrupted when the fusion device is fully expanded. One of the interlocking features includes a plurality of prongs projecting from an upper surface of the wafers and into a recess defined in the lower surface of an adjacent previously inserted like-configured wafer. The prongs and recesses are configured to prevent retrograde movement of each new wafer in a direction opposite the direction of insertion. Other interlocking features prevent movement in the direction of insertion, transverse to the insertion direction and vertically within the stack.
    Type: Grant
    Filed: May 25, 2018
    Date of Patent: May 21, 2019
    Assignee: SPINE WAVE, INC.
    Inventors: Peter Barreiro, Dennis Ty, Michael E. Landry
  • Publication number: 20190029845
    Abstract: The present invention provides an orthopedic surgical tool for moving an implant to a surgical sight and installing the implant. The tool allows the surgeon the ability to navigate the implant through a surgical tube, then rotate the implant after reaching the sight and effect installation of the implant, and then effect its release from the tool. The implant can be rotated at any time during its installation within the constraints of other surgical devices.
    Type: Application
    Filed: October 1, 2018
    Publication date: January 31, 2019
    Inventors: Dennis Ty, Dale Mitchell
  • Patent number: 10085855
    Abstract: The present invention provides an orthopedic surgical tool for moving an implant to a surgical sight and installing the implant. The tool allows the surgeon the ability to navigate the implant through a surgical tube, then rotate the implant after reaching the sight and effect installation of the implant, and then effect its release from the tool. The implant can be rotated at any time during its installation within the constraints of other surgical devices.
    Type: Grant
    Filed: September 30, 2016
    Date of Patent: October 2, 2018
    Assignee: Beacon Biomedical, LLC
    Inventors: Dennis Ty, Dale Mitchell
  • Publication number: 20180271671
    Abstract: An expandable interbody fusion device includes superior and inferior endplates that are configured to receive a sequentially inserted stack of interlocking expansion members or wafers. The like-configured wafers include features on their top and bottom surfaces that interlock the wafers in multiple degrees of freedom so that the wafer stack is not disrupted when the fusion device is fully expanded. One of the interlocking features includes a plurality of prongs projecting from an upper surface of the wafers and into a recess defined in the lower surface of an adjacent previously inserted like-configured wafer. The prongs and recesses are configured to prevent retrograde movement of each new wafer in a direction opposite the direction of insertion. Other interlocking features prevent movement in the direction of insertion, transverse to the insertion direction and vertically within the stack.
    Type: Application
    Filed: May 25, 2018
    Publication date: September 27, 2018
    Inventors: Peter Barreiro, Dennis TY, Michael E. Landry
  • Publication number: 20180235643
    Abstract: Joint fixation systems and methods enabling machining of a plurality of overlapping bores in an articulated skeletal joint with at least one bore on each side of abutting surfaces at the joint. An implant is secured to bones on opposite sides of the joint to immobilize the joint in order to effect fusion of the joint. A jig is used to effect a desired location of the overlapping bores during machining.
    Type: Application
    Filed: February 2, 2018
    Publication date: August 23, 2018
    Inventors: Robert E. Lins, Dennis Ty
  • Patent number: 9980827
    Abstract: An expandable interbody fusion device includes superior and inferior endplates that are configured to receive a sequentially inserted stack of interlocking expansion members or wafers. The like-configured wafers include features on their top and bottom surfaces that interlock the wafers in multiple degrees of freedom so that the wafer stack is not disrupted when the fusion device is fully expanded. One of the interlocking features includes a plurality of prongs projecting from an upper surface of the wafers and into a recess defined in the lower surface of an adjacent previously inserted like-configured wafer. The prongs and recesses are configured to prevent retrograde movement of each new wafer in a direction opposite the direction of insertion. Other interlocking features prevent movement in the direction of insertion, transverse to the insertion direction and vertically within the stack.
    Type: Grant
    Filed: March 24, 2017
    Date of Patent: May 29, 2018
    Assignee: SPINE WAVE, INC.
    Inventors: Peter Barreiro, Dennis Ty, Michael E. Landry
  • Publication number: 20170196700
    Abstract: An expandable interbody fusion device includes superior and inferior endplates that are configured to receive a sequentially inserted stack of interlocking expansion members or wafers. The like-configured wafers include features on their top and bottom surfaces that interlock the wafers in multiple degrees of freedom so that the wafer stack is not disrupted when the fusion device is fully expanded. One of the interlocking features includes a plurality of prongs projecting from an upper surface of the wafers and into a recess defined in the lower surface of an adjacent previously inserted like-configured wafer. The prongs and recesses are configured to prevent retrograde movement of each new wafer in a direction opposite the direction of insertion. Other interlocking features prevent movement in the direction of insertion, transverse to the insertion direction and vertically within the stack.
    Type: Application
    Filed: March 24, 2017
    Publication date: July 13, 2017
    Inventors: Peter Barreiro, Dennis TY, Michael E. Landry
  • Publication number: 20170112635
    Abstract: The present invention provides an orthopedic surgical tool for moving an implant to a surgical sight and installing the implant. The tool allows the surgeon the ability to navigate the implant through a surgical tube, then rotate the implant after reaching the sight and effect installation of the implant, and then effect its release from the tool. The implant can be rotated at any time during its installation within the constraints of other surgical devices.
    Type: Application
    Filed: September 30, 2016
    Publication date: April 27, 2017
    Inventors: Dennis Ty, Dale Mitchell
  • Patent number: 9610175
    Abstract: An expandable interbody fusion device includes superior and inferior endplates that are configured to receive a sequentially inserted stack of interlocking expansion members or wafers. The like-configured wafers include features on their top and bottom surfaces that interlock the wafers in multiple degrees of freedom so that the wafer stack is not disrupted when the fusion device is fully expanded. One of the interlocking features includes a plurality of prongs projecting from an upper surface of the wafers and into a recess defined in the lower surface of an adjacent previously inserted like-configured wafer. The prongs and recesses are configured to prevent retrograde movement of each new wafer in a direction opposite the direction of insertion. Other interlocking features prevent movement in the direction of insertion, transverse to the insertion direction and vertically within the stack.
    Type: Grant
    Filed: June 27, 2016
    Date of Patent: April 4, 2017
    Assignee: Spine Wave, Inc.
    Inventors: Peter Barreiro, Dennis Ty, Michael E. Landry
  • Publication number: 20160302939
    Abstract: An expandable interbody fusion device includes superior and inferior endplates that are configured to receive a sequentially inserted stack of interlocking expansion members or wafers. The like-configured wafers include features on their top and bottom surfaces that interlock the wafers in multiple degrees of freedom so that the wafer stack is not disrupted when the fusion device is fully expanded. One of the interlocking features includes a plurality of prongs projecting from an upper surface of the wafers and into a recess defined in the lower surface of an adjacent previously inserted like-configured wafer. The prongs and recesses are configured to prevent retrograde movement of each new wafer in a direction opposite the direction of insertion. Other interlocking features prevent movement in the direction of insertion, transverse to the insertion direction and vertically within the stack.
    Type: Application
    Filed: June 27, 2016
    Publication date: October 20, 2016
    Inventors: PETER BARREIRO, DENNIS TY, MICHAEL E. LANDRY
  • Patent number: 9381094
    Abstract: An expandable interbody fusion device includes superior and inferior endplates that are configured to receive a sequentially inserted stack of interlocking expansion members or wafers. The like-configured wafers include features on their top and bottom surfaces that interlock the wafers in multiple degrees of freedom so that the wafer stack is not disrupted when the fusion device is fully expanded. One of the interlocking features includes a plurality of prongs projecting from an upper surface of the wafers and into a recess defined in the lower surface of an adjacent previously inserted like-configured wafer. The prongs and recesses are configured to prevent retrograde movement of each new wafer in a direction opposite the direction of insertion. Other interlocking features prevent movement in the direction of insertion, transverse to the insertion direction and vertically within the stack.
    Type: Grant
    Filed: July 28, 2015
    Date of Patent: July 5, 2016
    Assignee: SPINE WAVE, INC.
    Inventors: Peter Barreiro, Dennis Ty, Michael E. Landry
  • Publication number: 20150328014
    Abstract: An expandable interbody fusion device includes superior and inferior endplates that are configured to receive a sequentially inserted stack of interlocking expansion members or wafers. The like-configured wafers include features on their top and bottom surfaces that interlock the wafers in multiple degrees of freedom so that the wafer stack is not disrupted when the fusion device is fully expanded. One of the interlocking features includes a plurality of prongs projecting from an upper surface of the wafers and into a recess defined in the lower surface of an adjacent previously inserted like-configured wafer. The prongs and recesses are configured to prevent retrograde movement of each new wafer in a direction opposite the direction of insertion. Other interlocking features prevent movement in the direction of insertion, transverse to the insertion direction and vertically within the stack.
    Type: Application
    Filed: July 28, 2015
    Publication date: November 19, 2015
    Inventors: PETER BARREIRO, DENNIS TY, MICHAEL E. LANDRY
  • Patent number: 9095447
    Abstract: An expandable interbody fusion device includes superior and inferior endplates that are configured to receive a sequentially inserted stack of interlocking expansion members or wafers. The like-configured wafers include features on their top and bottom surfaces that interlock the wafers in multiple degrees of freedom so that the wafer stack is not disrupted when the fusion device is fully expanded. One of the interlocking features includes a plurality of prongs projecting from an upper surface of the wafers and into a recess defined in the lower surface of an adjacent previously inserted like-configured wafer. The prongs and recesses are configured to prevent retrograde movement of each new wafer in a direction opposite the direction of insertion. Other interlocking features prevent movement in the direction of insertion, transverse to the insertion direction and vertically within the stack.
    Type: Grant
    Filed: November 19, 2014
    Date of Patent: August 4, 2015
    Assignee: SPINE WAVE, INC.
    Inventors: Peter Barreiro, Dennis Ty, Michael E. Landry
  • Publication number: 20150073553
    Abstract: An expandable interbody fusion device includes superior and inferior endplates that are configured to receive a sequentially inserted stack of interlocking expansion members or wafers. The like-configured wafers include features on their top and bottom surfaces that interlock the wafers in multiple degrees of freedom so that the wafer stack is not disrupted when the fusion device is fully expanded. One of the interlocking features includes a plurality of prongs projecting from an upper surface of the wafers and into a recess defined in the lower surface of an adjacent previously inserted like-configured wafer. The prongs and recesses are configured to prevent retrograde movement of each new wafer in a direction opposite the direction of insertion. Other interlocking features prevent movement in the direction of insertion, transverse to the insertion direction and vertically within the stack.
    Type: Application
    Filed: November 19, 2014
    Publication date: March 12, 2015
    Inventors: PETER BARREIRO, DENNIS TY, MICHAEL E. LANDRY
  • Patent number: 8900313
    Abstract: An expandable interbody fusion device includes superior and inferior endplates that are configured to receive a sequentially inserted stack of interlocking expansion members or wafers. The like-configured wafers include features on their top and bottom surfaces that interlock the wafers in multiple degrees of freedom so that the wafer stack is not disrupted when the fusion device is fully expanded. One of the interlocking features includes a plurality of prongs projecting from an upper surface of the wafers and into a recess defined in the lower surface of an adjacent previously inserted like-configured wafer. The prongs and recesses are configured to prevent retrograde movement of each new wafer in a direction opposite the direction of insertion. Other interlocking features prevent movement in the direction of insertion, transverse to the insertion direction and vertically within the stack.
    Type: Grant
    Filed: November 5, 2013
    Date of Patent: December 2, 2014
    Assignee: Spine Wave, Inc.
    Inventors: Peter Barreiro, Dennis Ty, Michael E. Landry
  • Publication number: 20140107788
    Abstract: An expandable interbody fusion device includes superior and inferior endplates that are configured to receive a sequentially inserted stack of interlocking expansion members or wafers. The like-configured wafers include features on their top and bottom surfaces that interlock the wafers in multiple degrees of freedom so that the wafer stack is not disrupted when the fusion device is fully expanded. One of the interlocking features includes a plurality of prongs projecting from an upper surface of the wafers and into a recess defined in the lower surface of an adjacent previously inserted like-configured wafer. The prongs and recesses are configured to prevent retrograde movement of each new wafer in a direction opposite the direction of insertion. Other interlocking features prevent movement in the direction of insertion, transverse to the insertion direction and vertically within the stack.
    Type: Application
    Filed: November 5, 2013
    Publication date: April 17, 2014
    Applicant: SPINE WAVE, INC.
    Inventors: PETER BARREIRO, DENNIS TY, MICHAEL E. LANDRY
  • Patent number: 8574299
    Abstract: An expandable interbody fusion device includes superior and inferior endplates that are configured to receive a sequentially inserted stack of interlocking expansion members or wafers. The like-configured wafers include features on their top and bottom surfaces that interlock the wafers in multiple degrees of freedom so that the wafer stack is not disrupted when the fusion device is fully expanded. One of the interlocking features includes a plurality of prongs projecting from an upper surface of the wafers and into a recess defined in the lower surface of an adjacent previously inserted like-configured wafer. The prongs and recesses are configured to prevent retrograde movement of each new wafer in a direction opposite the direction of insertion. Other interlocking features prevent movement in the direction of insertion, transverse to the insertion direction and vertically within the stack.
    Type: Grant
    Filed: January 8, 2013
    Date of Patent: November 5, 2013
    Assignee: Spine Wave, Inc.
    Inventors: Peter Barreiro, Dennis Ty, Michael E. Landry
  • Publication number: 20130131811
    Abstract: An expandable interbody fusion device includes superior and inferior endplates that are configured to receive a sequentially inserted stack of interlocking expansion members or wafers. The like-configured wafers include features on their top and bottom surfaces that interlock the wafers in multiple degrees of freedom so that the wafer stack is not disrupted when the fusion device is fully expanded. One of the interlocking features includes a plurality of prongs projecting from an upper surface of the wafers and into a recess defined in the lower surface of an adjacent previously inserted like-configured wafer. The prongs and recesses are configured to prevent retrograde movement of each new wafer in a direction opposite the direction of insertion. Other interlocking features prevent movement in the direction of insertion, transverse to the insertion direction and vertically within the stack.
    Type: Application
    Filed: January 8, 2013
    Publication date: May 23, 2013
    Applicant: SPINE WAVE, INC.
    Inventors: PETER BARREIRO, DENNIS TY, MICHAEL E. LANDRY
  • Patent number: 8349014
    Abstract: An expandable interbody fusion device includes superior and inferior endplates that are configured to receive a sequentially inserted stack of interlocking expansion members or wafers. The like-configured wafers include features on their top and bottom surfaces that interlock the wafers in multiple degrees of freedom so that the wafer stack is not disrupted when the fusion device is fully expanded. One of the interlocking features includes a plurality of prongs projecting from an upper surface of the wafers and into a recess defined in the lower surface of an adjacent previously inserted like-configured wafer. The prongs and recesses are configured to prevent retrograde movement of each new wafer in a direction opposite the direction of insertion. Other interlocking features prevent movement in the direction of insertion, transverse to the insertion direction and vertically within the stack.
    Type: Grant
    Filed: June 22, 2011
    Date of Patent: January 8, 2013
    Assignee: Spine Wave, Inc.
    Inventors: Peter Barreiro, Dennis Ty, Michael E. Landry