Patents by Inventor Dennis W. Anderson

Dennis W. Anderson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10106932
    Abstract: A multi-ply paper substrate is provided, which comprises at least two plies bonded to one another by an adhesive; a basis weight of 80-200 gsm; an internal bond of 10-180 milli-ft.-lb/sq. in. as measured by TAPPI method 541; an MD tensile of 20-300 lbf/inch width as measured by TAPPI method 494; and a CD tensile of 10-300 lbf/inch width as measured by TAPPI method 494. Methods of making and using the paper substrate, products made therefrom, and uses of the paper substrate are also provided.
    Type: Grant
    Filed: April 8, 2015
    Date of Patent: October 23, 2018
    Assignee: INTERNATIONAL PAPER COMPANY
    Inventors: Dennis W. Anderson, James E. Sealey
  • Publication number: 20160236498
    Abstract: An article in the form of a packaging material having a water vapor transportation rate of about 500 g/m2/day or less. The packaging material has a paper substrate and a print-receptive layer which is positioned over the outer surface of the paper substrate. The packaging material also has a moisture barrier layer positioned over the print-receptive layer. The moisture barrier layer is formed from one or more energy-cured polymers. Also, methods for preparing these packaging materials, including printed packaging materials.
    Type: Application
    Filed: April 28, 2016
    Publication date: August 18, 2016
    Inventors: DENNIS W. ANDERSON, PATRICIA L. EWING, TIMOTHY J. BRADFORD, MICHAEL J. MURPHY
  • Publication number: 20160237626
    Abstract: An article in the form of recyclable packaging material having a water vapor transportation rate of about 500 g/m2/day or less. The packaging material has a paper substrate of recyclable paper fibers and a print-receptive layer which is positioned over the outer surface of the paper substrate and has a Parker Print Smoothness value of about 1.5 or less. The packaging material also has a moisture barrier layer positioned over the print-receptive layer. The moisture barrier layer is formed from one or more energy-cured polymers. Also, methods for preparing these packaging materials, including printed packaging materials.
    Type: Application
    Filed: April 28, 2016
    Publication date: August 18, 2016
    Inventors: DENNIS W. ANDERSON, PATRICIA L. EWING, TIMOTHY J. BRADFORD, MICHAEL J. MURPHY
  • Patent number: 9365980
    Abstract: An article in the form of recyclable packaging material having a water vapor transportation rate of about 500 g/m2/day or less. The packaging material has a paper substrate of recyclable paper fibers and a print-receptive layer which is positioned over the outer surface of the paper substrate and has a Parker Print Smoothness value of about 1.5 or less. The packaging material also has a moisture barrier layer positioned over the print-receptive layer. The moisture barrier layer is formed from one or more energy-cured polymers. Also, methods for preparing these packaging materials, including printed packaging materials.
    Type: Grant
    Filed: November 4, 2011
    Date of Patent: June 14, 2016
    Assignee: International Paper Company
    Inventors: Dennis W. Anderson, Patricia L. Ewing, Timothy J. Bradford, Michael J. Murphy
  • Patent number: 9358576
    Abstract: An article in the form of a packaging material having a water vapor transportation rate of about 500 g/m2/day or less. The packaging material has a paper substrate and a print-receptive layer which is positioned over the outer surface of the paper substrate. The packaging material also has a moisture barrier layer positioned over the print-receptive layer. The moisture barrier layer is formed from one or more energy-cured polymers. Also, methods for preparing these packaging materials, including printed packaging materials.
    Type: Grant
    Filed: November 7, 2011
    Date of Patent: June 7, 2016
    Assignee: International Paper Company
    Inventors: Dennis W. Anderson, Patricia L. Ewing, Timothy J. Bradford, Michael J. Murphy
  • Patent number: 9309626
    Abstract: This invention relates to a paper substrate containing high surface sizing and low internal sizing and having high dimensional stability, as well as methods of making and using the composition.
    Type: Grant
    Filed: June 24, 2014
    Date of Patent: April 12, 2016
    Assignee: International Paper Company
    Inventors: Kapil M. Singh, Dennis W. Anderson, Peter M. Froass, Yaoliang Hong, Kosaraju Krishna Mohan, Thomas R. Arnson, Yan C. Huang
  • Publication number: 20150376838
    Abstract: This invention relates to paper products and/or substrates suitable for being made into wallboard tape (also may be known as joint tape and/or drywall tape) and having improved reduction or inhibition in the growth of microbes, mold and/or fungus. The paper substrate is characterized by its excellent physical properties including cross direction (CD) tensile, machine (MD) tensile, internal bond, wet tensile, hygroexpansivity, curl, bonding properties, bonding of joint tape to joint compound, etc. The paper product of the invention contains a sizing agent and an antimicrobial compound as well as other optional components including without limitation a binder. The paper product of the invention may be produced by contacting the plurality of cellulose fibers with each of the sizing agent, antimicrobial compound, and optional components at any point in the papermaking process, converting process, and/or post-converting process. Finally, the invention relates to methods of using the paper substrate.
    Type: Application
    Filed: September 14, 2015
    Publication date: December 31, 2015
    Inventors: DENNIS W. ANDERSON, BIANCA A. MORGANROTH, WILLIAM A. PAYNE
  • Publication number: 20150211189
    Abstract: A multi-ply paper substrate is provided, which comprises at least two plies bonded to one another by an adhesive; a basis weight of 80-200 gsm; an internal bond of 10-180 milli-ft.-lb/sq. in. as measured by TAPPI method 541; an MD tensile of 20-300 lbf/inch width as measured by TAPPI method 494; and a CD tensile of 10-300 lbf/inch width as measured by TAPPI method 494. Methods of making and using the paper substrate, products made therefrom, and uses of the paper substrate are also provided.
    Type: Application
    Filed: April 8, 2015
    Publication date: July 30, 2015
    Inventors: DENNIS W. ANDERSON, JAMES E. SEALEY
  • Patent number: 9017803
    Abstract: A multi-ply paper substrate is provided, which comprises at least two plies bonded to one another by an adhesive; a basis weight of 80-200 gsm; an internal bond of 10-180 milli-ft.-lb/sq. in. as measured by TAPPI method 541; an MD tensile of 20-300 lbf/inch width as measured by TAPPI method 494; and a CD tensile of 10-300 lbf/inch width as measured by TAPPI method 494. Methods of making and using the paper substrate, products made therefrom, and uses of the paper substrate are also provided.
    Type: Grant
    Filed: July 19, 2012
    Date of Patent: April 28, 2015
    Assignee: International Paper Company
    Inventors: Dennis W. Anderson, James E. Sealey
  • Publication number: 20150034264
    Abstract: This invention relates to paper products and/or substrates suitable for being made and/or converted into wallboard tape; which also may be known as joint tape and/or drywall tape, having a pH of at least 7.0 and containing a plurality of cellulose fibers, a wet strength additive, an alkaline sizing agent, and an anionic promoter, as well as methods of making and using the same.
    Type: Application
    Filed: October 17, 2014
    Publication date: February 5, 2015
    Inventors: Stephen A. BUZZA, Dennis W. ANDERSON, Yufeng XU, Bruce Richard MC GAFFIN, Christopher Michael WILSON
  • Publication number: 20140299286
    Abstract: This invention relates to a paper substrate containing high surface sizing and low internal sizing and having high dimensional stability, as well as methods of making and using the composition.
    Type: Application
    Filed: June 24, 2014
    Publication date: October 9, 2014
    Inventors: KAPIL M. SINGH, DENNIS W. ANDERSON, PETER M. FROASS, YAOLIANG HONG, KOSARAJU KRISHNA MOHAN, THOMAS R. ARNSON, YAN C. HUANG
  • Patent number: 8758565
    Abstract: This invention relates to a paper substrate containing high surface sizing and low internal sizing and having high dimensional stability, as well as methods of making and using the composition.
    Type: Grant
    Filed: February 1, 2013
    Date of Patent: June 24, 2014
    Assignee: International Paper Company
    Inventors: Kapil M. Singh, Dennis W. Anderson, Peter M. Froass, Yaoliang Hong, Kosaraju K. Mohan, Thomas R. Arnson, Yan C. Huang
  • Publication number: 20140034539
    Abstract: One embodiment of a wrapping film comprises a polymer film having, on at least one surface thereof, at least one sealing area comprising at least one varnished area; and a plurality of individual unvarnished areas; wherein, within the sealing area, the area ratio of the unvarnished areas to the varnished area (PV:V) is ?1; and wherein, within the sealing area, the largest individual unvarnished area is ?30 mm2. Other embodiments are described.
    Type: Application
    Filed: October 9, 2013
    Publication date: February 6, 2014
    Applicant: INTERNATIONAL PAPER COMPANY
    Inventors: DENNIS W. ANDERSON, PATTI L. EWING
  • Patent number: 8613829
    Abstract: This invention relates to paper products and/or substrates suitable for being made into wallboard tape (also may be known as joint tape and/or drywall tape) and having improved reduction or inhibition in the growth of microbes, mold and/or fungus. The paper substrate is characterized by its excellent physical properties including cross direction (CD) tensile, machine (MD) tensile, internal bond, wet tensile, hygroexpansivity, curl, bonding properties, bonding of joint tape to joint compound, etc. The paper product of the invention contains a sizing agent and an antimicrobial compound as well as other optional components including without limitation a binder. The paper product of the invention may be produced by contacting the plurality of cellulose fibers with each of the sizing agent, antimicrobial compound, and optional components at any point in the papermaking process, converting process, and/or post-converting process. Finally, the invention relates to methods of using the paper substrate.
    Type: Grant
    Filed: July 9, 2010
    Date of Patent: December 24, 2013
    Assignee: International Paper Company
    Inventors: Dennis W. Anderson, Bianca A. Morganroth, William A. Payne
  • Publication number: 20130333323
    Abstract: This invention relates to paper products and/or substrates suitable for being made into wallboard tape (also may be known as joint tape and/or drywall tape) and having improved reduction or inhibition in the growth of microbes, mold and/or fungus. The paper substrate is characterized by its excellent physical properties including cross direction (CD) tensile, machine (MD) tensile, internal bond, wet tensile, hygroexpansivity, curl, bonding properties, bonding of joint tape to joint compound, etc. The paper product of the invention contains a sizing agent and an antimicrobial compound as well as other optional components including without limitation a binder. The paper product of the invention may be produced by contacting the plurality of cellulose fibers with each of the sizing agent, antimicrobial compound, and optional components at any point in the papermaking process, converting process, and/or post-converting process. Finally, the invention relates to methods of using the paper substrate.
    Type: Application
    Filed: August 26, 2013
    Publication date: December 19, 2013
    Applicant: INTERNATIONAL PAPER COMPANY
    Inventors: DENNIS W. ANDERSON, BIANCA A. MORGANROTH, WILLIAM A. PAYNE
  • Patent number: 8568842
    Abstract: One embodiment of a wrapping film comprises a polymer film having, on at least one surface thereof, at least one sealing area comprising at least one varnished area; and a plurality of individual unvarnished areas; wherein, within the sealing area, the area ratio of the unvarnished areas to the varnished area (PV:V) is ?1; and wherein, within the sealing area, the largest individual unvarnished area is ?30 mm2. Other embodiments are described.
    Type: Grant
    Filed: December 28, 2010
    Date of Patent: October 29, 2013
    Assignee: International Paper Company
    Inventors: Dennis W. Anderson, Patti L. Ewing
  • Publication number: 20130087268
    Abstract: A multi-ply paper substrate is provided, which comprises at least two plies bonded to one another by an adhesive; a basis weight of 80-200 gsm; an internal bond of 10-180 milli-ft.-lb/sq. in. as measured by TAPPI method 541; an MD tensile of 20-300 lbf/inch width as measured by TAPPI method 494; and a CD tensile of 10-300 lbf/inch width as measured by TAPPI method 494. Methods of making and using the paper substrate, products made therefrom, and uses of the paper substrate are also provided.
    Type: Application
    Filed: July 19, 2012
    Publication date: April 11, 2013
    Applicant: INTERNATIONAL PAPER COMPANY
    Inventors: DENNIS W. ANDERSON, JAMES E. SEALEY
  • Patent number: 8388802
    Abstract: This invention relates to paper products and/or substrates suitable for being made and/or converted into wallboard tape; which also may be known as joint tape and/or drywall tape, having a pH of at least 7.0 and containing a plurality of cellulose fibers, a wet strength additive, an alkaline sizing agent, and an anionic promoter, as well as methods of making and using the same.
    Type: Grant
    Filed: April 5, 2012
    Date of Patent: March 5, 2013
    Assignee: International Paper Company
    Inventors: Stephen A. Buzza, Dennis W. Anderson, Yufeng Xu, Bruce Richard McGaffin, Christopher Michael Wilson
  • Patent number: 8377526
    Abstract: This invention relates to composition containing expandable microspheres and at least one ionic compound and having a zeta potential that is greater than or equal to zero mV at a pH of about 9.0 or less at an ionic strength of from 10?6 M to 0.1M, as well as methods of making and using the composition.
    Type: Grant
    Filed: July 26, 2011
    Date of Patent: February 19, 2013
    Assignee: International Paper Company
    Inventors: Krishna K. Mohan, Cynthia A. Goliber, Yaoliang Hong, Peter M. Froass, Herbert Young, Dennis W. Anderson, Richard D. Faber
  • Patent number: 8372243
    Abstract: This invention relates to a paper substrate containing high surface sizing and low internal sizing and having high dimensional stability, as well as methods of making and using the composition.
    Type: Grant
    Filed: June 10, 2011
    Date of Patent: February 12, 2013
    Assignee: International Paper Company
    Inventors: Kapil M. Singh, Dennis W. Anderson, Peter M. Froass, Yaoliang Hong, Krishna K. Mohan, Thomas R. Arnson, Yan C. Huang