Abstract: Porous metal-containing materials are provided for a variety of uses including filters, electrodes for batteries and fuel cells, light weight structural materials, heat exchangers and catalysts. A method is provided for making the porous metal-containing materials involving vapor phase sintering of a metal oxide green form followed by reduction to form a porous metal-containing material, typically without any significant shrinkage of the sample occurring during processing. The porous metal-containing materials may have porosities of from about 40 percent to as high as 90% in some embodiments. Furthermore, the pore volume is highly interconnected, which is particularly advantageous for many applications.

Abstract: A process for sealing a ceramic filter by infiltrating a metal into an end of the filter is disclosed. The process includes the steps of contacting the end of a porous ceramic filter with a molten metal, whereby the metal enters into the ceramic matrix to substantially fill the void space. The ceramic filter is cooled to form a filter having a ceramic-metal composite portion. The present invention also provides a filter having an infiltrated metal seal. Methods for joining infiltrated ends are also provided.

Abstract: The present invention relates to electronic components and in particular relates to ceramic-based electronic components wherein a portion of the component comprises a metal-infiltrated ceramic. In a preferred embodiment, the metal-infiltrated ceramic comprises copper metal.

Abstract: A process for sealing a ceramic filter by infiltrating a metal into an end of the filter. The process includes the steps of contacting the end of a porous ceramic filter with a molten metal, whereby the metal enters into the ceramic matrix to substantially fill the void space. The ceramic filter is cooled to form a filter having a ceramic-metal composite portion. The present invention also provides a filter having an infiltrated metal seal. Methods for joining infiltrated ends are also provided.

Abstract: A process for sealing a ceramic filter by infiltrating a metal into an end of the filter. The process includes the steps of contacting the end of a porous ceramic filter with a molten metal, whereby the metal enters into the ceramic matrix to substantially fill the void space. The ceramic filter is cooled to form a filter having a ceramic-metal composite portion. The present invention also provides a filter having an infiltrated metal seal. Methods for joining infiltrated ends are also provided.

Abstract: The present invention relates to electronic components and in particular relates to ceramic-based electronic components wherein a portion of the component comprises a metal-infiltrated ceramic. In a preferred embodiment, the metal-infiltrated ceramic comprises copper metal.

Abstract: The present invention is directed to a process for fabricating ceramic-metal composites having continuous ceramic and metal phases. The process includes the steps of contacting a porous ceramic matrix material with a molten metal whereby capillary action pulls the metal into the ceramic matrix to substantially fill the void space. The present invention also provides a ceramic-metal composite having continuous metal and ceramic phases.

Abstract: A process for sealing a ceramic filter by infiltrating a metal into an end of the filter. The process includes the steps of contacting the end of a porous ceramic filter with a molten metal, whereby the metal enters into the ceramic matrix to substantially fill the void space. The ceramic filter is cooled to form a filter having a ceramic-metal composite portion. The present invention also provides a filter having an infiltrated metal seal.

Abstract: A process for fabricating ceramic-metal composites having continuous ceramic and metallic phases. The process includes the steps of contacting a porous ceramic matrix material having the general shape of an article of manufacture with molten metal whereby capillary action pulls the metal into the open porosity of the ceramic matrix to substantially fill the open void space. The present invention also provides a ceramic-metal composite having continuous metal and ceramic phases.

Abstract: A method for fabricating ceramic-metal composites having continuous ceramic and metallic phases. In one embodiment, the metal phase includes copper metal. The method can include the steps of contacting a porous ceramic matrix material with molten metal whereby capillary action pulls the metal into the ceramic matrix to substantially fill the open void space. The present invention also provides a ceramic-metal composite having continuous metal and ceramic phases.

Abstract: The present invention relates to electronic components and in particular relates to ceramic-based electronic components wherein a portion of the component comprises a metal-infiltrated ceramic. In a preferred embodiment, the metal-infiltrated ceramic comprises copper metal.

Abstract: A process for fabricating ceramic-metal composites having ceramic and metal phases wherein the ceramic to metal ratio changes within the ceramic. The process includes the steps of contacting a porous ceramic matrix material with a molten metal whereby capillary action pulls the metal into the ceramic matrix to substantially fill the void space. The ceramic matrix has a porosity gradient wherein the infiltrated composite has a varying ratio of ceramic to metal.

Abstract: Ceramic-metal composites are used in the fabrication of components for engines, particularly internal combustion engines. The composites are formed by infiltrating a molten metal into a porous ceramic matrix and cooling the metal to form a composite. Numerous engine components can be fabricated using this technique including valves, valve seats, exhaust port liners, pistons and rocker arms.

Abstract: A group of dielectric compounds and mixtures of dielectric compounds with useful properties at microwave frequencies is disclosed. The dielectric materials are temperature compensated, have relatively high dielectric constants, and comprise the group of BaTi.sub.4 O.sub.9, and mixtures of Li.sub.2 TiO.sub.3 and Li.sub.4 Ti.sub.5 O.sub.12, MgTi.sub.2 O.sub.5 and TiO.sub.2, Zn.sub.2 TiO.sub.4 and TiO.sub.2, and BaTi.sub.4 O.sub.9 and TiO.sub.2.