Abstract: An apparatus to wash a vehicle that typically includes: a trolley frame having a first support beam and a second support beam, the trolley frame defining a first reference frame; a first translation beam extending from the first support beam to the second support beam, where the first translation beam is at an angle with respect to the first reference frame; a second translation beam extending from the first support beam to the second support beam, where the second translation beam is at an angle with respect to the first reference frame; a first brush extending downward from a first trolley, the first trolley movably disposed on the first translation beam; and a second brush extending downwardly from a second trolley, the second trolley movably disposed on the second translation beam. The second trolley typically moves independently from the first trolley using different and independent drive systems or motors.

Abstract: A virtualizable automated test equipment architecture includes a circuit assembly. The circuit assembly includes a number of signal paths that extend between a front plane and a backplane. The signal paths can be continuous and isolated from other signal paths of the plurality of signal paths. The circuit assembly also includes an impedance disposed along a signal path of the plurality of signal paths. A plurality of software-configurable physical disconnects may be arranged within the circuit assembly to form a switching matrix. The plurality of signal paths can be associated with a plurality of software-configurable physical disconnects, which can be configured to open and close signal paths of the plurality of signal paths based on the predetermined test requirements. The circuit assembly also includes a plurality of external device connections, at least one of which may be configured to interface with a unit under test (UUT). The software configurable physical disconnects may be configurable at runtime.

Abstract: A virtualizable automated test equipment architecture includes a circuit assembly. The circuit assembly includes a number of signal paths that extend between a front plane and a backplane. The signal paths can be continuous and isolated from other signal paths of the plurality of signal paths. The circuit assembly also includes an impedance disposed along a signal path of the plurality of signal paths. A plurality of software-configurable physical disconnects may be arranged within the circuit assembly to form a switching matrix. The plurality of signal paths can be associated with a plurality of software-configurable physical disconnects, which can be configured to open and close signal paths of the plurality of signal paths based on the predetermined test requirements. The circuit assembly also includes a plurality of external device connections, at least one of which may be configured to interface with a unit under test (UUT). The software configurable physical disconnects may be configurable at runtime.

Abstract: A virtualizable automated test equipment architecture includes a circuit assembly. The circuit assembly includes a number of signal paths that extend between a front plane and a backplane. The signal paths can be continuous and isolated from other signal paths of the plurality of signal paths. The circuit assembly also includes an impedance disposed along a signal path of the plurality of signal paths. A plurality of software-configurable physical disconnects may be arranged within the circuit assembly to form a switching matrix. The plurality of signal paths can be associated with a plurality of software-configurable physical disconnects, which can be configured to open and close signal paths of the plurality of signal paths based on the predetermined test requirements. The circuit assembly also includes a plurality of external device connections, at least one of which may be configured to interface with a unit under test (UUT). The software configurable physical disconnects may be configurable at runtime.

Abstract: A virtualizable automated test equipment architecture includes a circuit assembly. The circuit assembly includes a number of signal paths that extend between a front plane and a backplane. The signal paths can be continuous and isolated from other signal paths of the plurality of signal paths. The circuit assembly also includes an impedance disposed along a signal path of the plurality of signal paths. A plurality of software-configurable physical disconnects may be arranged within the circuit assembly to form a switching matrix. The plurality of signal paths can be associated with a plurality of software-configurable physical disconnects, which can be configured to open and close signal paths of the plurality of signal paths based on the predetermined test requirements. The circuit assembly also includes a plurality of external device connections, at least one of which may be configured to interface with a unit under test (UUT). The software configurable physical disconnects may be configurable at runtime.

Abstract: A virtualizable automated test equipment architecture includes a circuit assembly. The circuit assembly includes a number of signal paths that extend between a front plane and a backplane. The signal paths can be continuous and isolated from other signal paths of the plurality of signal paths. The circuit assembly also includes an impedance disposed along a signal path of the plurality of signal paths. A plurality of software-configurable physical disconnects may be arranged within the circuit assembly to form a switching matrix. The plurality of signal paths can be associated with a plurality of software-configurable physical disconnects, which can be configured to open and close signal paths of the plurality of signal paths based on the predetermined test requirements. The circuit assembly also includes a plurality of external device connections, at least one of which may be configured to interface with a unit under test (UUT). The software configurable physical disconnects may be configurable at runtime.

Abstract: Methods and apparatus for the installation of VIV suppression during the S-Lay installation of a subsea pipeline. A locking member will be interposed between a pipe and a fairing rotatably mounted on the pipe, sufficient to bias the fairing against rotating. Upon marine application, the locking member will degrade, thereby releasing the fairing.

Abstract: There is provided a process for making a multicolor organic light-emitting diode. The diode has a plurality of first subpixel areas and a plurality of second subpixel areas. In the process, a patterned anode is formed on a substrate and a non-patterned continuous hole injection layer is formed over the anode. There is substantially no crosstalk observable between the first subpixels and the second subpixels. There is also provided the above process with the additional steps of forming a non-patterned continuous primer layer over the hole injection layer, depositing a first electroluminescent material from a first liquid composition in the first subpixel areas, depositing a second electroluminescent material from a second liquid composition in the second subpixel areas, and depositing a cathode. The first and second electroluminescent materials emit light of different colors.

Abstract: An electronic device includes a substrate, a first layer, a first pixel, and a patterned reactive surface-active layer. The first pixel includes a first pixel driving circuit that overlies the substrate and includes a first electronic component. The first electronic component includes a first electrode and a second layer. The first electrode overlies at least a part of the first pixel driving circuit. The patterned reactive surface-active layer has a lower surface energy than the first layer. A process for forming an electronic device includes forming a first pixel driving circuit over a substrate, forming a first electrode of a first electronic component over the substrate, forming a first layer, forming a patterned reactive surface-active layer, and forming a second layer over the first electrode of the first electronic component.

Abstract: An electronic device includes a substrate and a structure overlying the substrate and defining an array of openings arranged in a set of vectors. At first locations between openings along a first vector of the set of vectors, first heights at the first locations are substantially equal to one another. The electronic device also includes an organic layer in the geometric shape of a line that at least partially lies within the openings along the first vector and overlies the structure at the locations between the openings along the first vector.

Abstract: An electronic device includes an array. In one embodiment, a process for forming an electronic device includes the array, which includes electronic components, can include printing one or more layers as a series of segments onto a workpiece. In one embodiment, a process includes printing a layer onto the workpiece and at least one exposed portion of the chuck. In still another embodiment, a printing head is greater than 0.5 mm from the workpiece. In a further embodiment, “hybrid” printing can be used to help form a thicker layer having a relatively thinner width. In a further embodiment, processes can be used to reduce the likelihood of a stitching defect, nonuniformity of a layer across an array, or a combination thereof. A printing apparatus can be modified to achieve more flexibility in liquid compositions, temperatures or other conditions used in printing a layer.

Abstract: An electronic device includes a printed layer. In one embodiment, a process for forming the electronic device includes placing a workpiece over a chuck within a printing apparatus. A temperature difference is established between the workpiece and a liquid composition. The process further includes continuously printing the liquid composition over the workpiece. A viscosity of the liquid composition is allowed to increase at a rate significantly higher than an ambient viscosity increase rate. In another embodiment, the workpiece is allowed to cool to a temperature significantly below an ambient temperature before printing occurs. In still another embodiment, a printing apparatus is used for continuously printing the liquid composition over the workpiece. The printing apparatus includes the chuck, a printing head, a container, a feed line, and a first temperature-adjusting element thermally coupled to the chuck, the printing head, the container the feed line, or a combination thereof.

Abstract: An apparatus includes a first continuous dispense nozzle and a chuck configured to receive a substrate for an electronic device. The first continuous dispense nozzle, the chuck, or both are configured to move along at least two different axes during a continuous dispense action.

Abstract: Methods for remotely installing vortex-induced vibration (VIV) reduction and drag reduction devices on elongated structures in flowing fluid environments. The devices installed can include clamshell-shaped strakes, shrouds, fairings, sleeves and flotation modules.