Abstract: A method, apparatus and system are provided for relieving stress in the via structures of semiconductor structures whenever a linewidth below a via is larger than a ground-rule, including providing a via at least as large as the groundrule, providing a landing pad above the via, providing a via bar in place of a via, slotting the metal linewidth below the via, or providing an oversize via with a sidewall spacer.

Abstract: A method and system for delivering news reports based on the occurrence of predefined events in a predetermined news domain. The method comprises acts of collecting domain-specific news information; monitoring the domain-specific news information for the occurrence of one or more predefined events; and upon the occurrence of one of said predefined events, generating a news report relating the predefined event in prose assembled from pre-established templates. Generating a news report may comprise relating the predefined events in prose assembled from pre-established templates in multiple languages.

Abstract: A system and method for forming features on a semiconductor wafer is provided. A reticle is part of the present system. The reticle includes a plurality of open design areas, which are used in combination with each other to form a feature on a semiconductor substrate.