Abstract: The present invention relates to a hitch receiver alignment system having a first opening extending through and arranged upon a surface of the hitch receiver, a piston, a cylinder having a second opening adjoined to the hitch receiver, and a cylinder head having a third opening that is adapted to receive an alignment member that is manually adjusted by a user to contact the piston. As the user manually adjusts the alignment member, the piston consequentially is moved within a first opening extending through the hitch receiver. With the hitch being locked within the hitch receiver by a hitch pin, as the piston contacts the hitch within the hitch receiver the hitch is rotated about the hitch pin and a gap between the hitch and the hitch receiver is eliminated.

Abstract: The present invention relates to a hitch receiver alignment system having a first opening extending through and arranged upon a surface of the hitch receiver, a piston, a cylinder having a second opening adjoined to the hitch receiver, and a cylinder head having a third opening that is adapted to receive an alignment member that is manually adjusted by a user to contact the piston. As the user manually adjusts the alignment member, the piston consequentially is moved within a first opening extending through the hitch receiver. With the hitch being locked within the hitch receiver by a hitch pin, as the piston contacts the hitch within the hitch receiver the hitch is rotated about the hitch pin and a gap between the hitch and the hitch receiver is eliminated.

Abstract: A method of forming a planar surface for a semiconductor device structure. The method comprises forming a particle film comprising a plurality of discrete particles on a non-planar surface of a semiconductor device structure. The semiconductor device structure is subjected to at least one chemical-mechanical polishing process after forming the particle film on the non-planar surface of the semiconductor device structure. Methods of forming a semiconductor device structure are also described.

Abstract: A method of forming a forming a semiconductor device comprises forming at least one semiconductor device structure over a surface of a wafer. An opposing surface of the wafer is subjected to at least one chemical-mechanical polishing process to form a modified opposing surface of the wafer comprising at least one recessed region and at least one elevated region. Additional methods of forming a semiconductor device, and methods of reducing stress on a wafer are also described.

Abstract: A method of forming a planar surface for a semiconductor device structure. The method comprises forming a particle film comprising a plurality of discrete particles on a non-planar surface of a semiconductor device structure. The semiconductor device structure is subjected to at least one chemical-mechanical polishing process after forming the particle film on the non-planar surface of the semiconductor device structure. Methods of forming a semiconductor device structure are also described.

Abstract: Compositions and methods of removing debris including organic debris from a hydrophobic surface during semiconductor processing are disclosed. The method includes exposing a semiconductor wafer having debris, including organic debris, thereon to a cleaning solution including an oxidizing agent and at least one surfactant.

Abstract: A metallic joist is provided comprising cold-formed top and bottom chords, and cold-formed metallic truss web members arranged in a vertical and diagonal fashion shop welded to the chords. End connections, or “seats” are each shop welded to the top chord and to one of the webs. Each seat comprises a pair of vertical metallic planes that act as shear plates, welded to and extending outwardly and upwardly of the end portion of the top chord of the joist, and portions extending horizontally either side of the chord and punched with holes for easy field bolting to beams or other supporting elements. Each of the chords comprises a planar base and a pair of legs. Each leg comprises a chamfered portion extending downward and outward from one edge of the base at an acute angle to the horizontal; e.g., about 45 degrees, for stiffening the longitudinal edges of the base, to accommodate axial and moment forces.