Abstract: In a first aspect, a method is provided for terminating a shield of a cable. The method includes the steps of (1) exposing a periphery region of the shield along a first portion of the cable; (2) coupling an electrically-conductive housing including an electrically-conductive gasket around the exposed periphery region; (3) applying a force to and maintaining the force on the gasket such that the gasket is forced against and remains in contact with an interior region of the housing and the exposed periphery region of the shield; and (4) coupling an exterior region of the housing to an electrically-conductive enclosure of an electronic product to which the cable is coupled. Numerous other aspects are provided.

Abstract: A modular heat sink and semiconductor chip assembly includes a semiconductor chip, a base plate disposed in a heat conducting relationship with the semiconductor chip and containing a plurality of slots extending through the base plate, a plurality of fins individually passed through a number of the plurality of slots and containing voltage less input/output connections to facilitate grounding with the chip, and at least one electrical component passed through one of the plurality of slots and containing a high-density input/output structure on one edge and is electrically connected to the semiconductor chip.

Abstract: In a first aspect, a method is provided for terminating a shield of a cable. The method includes the steps of (1) exposing a periphery region of the shield along a first portion of the cable; (2) coupling an electrically-conductive housing including an electrically-conductive gasket around the exposed periphery region; (3) applying a force to and maintaining the force on the gasket such that the gasket is forced against and remains in contact with an interior region of the housing and the exposed periphery region of the shield; and (4) coupling an exterior region of the housing to an electrically-conductive enclosure of an electronic product to which the cable is coupled. Numerous other aspects are provided.

Abstract: In a first aspect, a first apparatus for providing radiated emission suppression in cabling is provided. The first apparatus includes (1) at least one cable; (2) one or more ferrite elements each substantially surrounding a length of the at least one cable; and (3) a capacitive sleeve element substantially surrounding a length of the at least one cable and the one or more ferrite elements. The capacitive sleeve element includes a conducting material adapted to be connected to a ground. Numerous other aspects are provided.

Abstract: In a first aspect, a first apparatus for providing radiated emission suppression in cabling is provided. The first apparatus includes (1) at least one cable; (2) one or more ferrite elements each substantially surrounding a length of the at least one cable; and (3) a capacitive sleeve element substantially surrounding a length of the at least one cable and the one or more ferrite elements. The capacitive sleeve element includes a conducting material adapted to be connected to a ground. Numerous other aspects are provided.

Abstract: A modular heat sink decoupling capacitor array includes a plurality of modules, each defining parallel distributed decoupling plates, and each module forming a heat sink fin. Each module includes multiple spaced apart contacts for providing low inductance connections with an associated device. A power distribution interposer module is attached to a heat sink surface of the modular decoupling capacitor. The interposer module is used for implementing power delivery without using valuable ball grid array (BGA) connections and printed circuit board (PCB) layers.

Abstract: A method and components are provided for implementing EMC shielded resonance damping of a printed circuit board. The EMC shielded resonance damping component includes a capacitor and resistor formed in series combination and contained within a shielded enclosure. A pair of coaxial pads is provided for connection to the printed circuit board. The series combination of the capacitor and resistor is connected between a first pad of a pair of coaxial pads and an interior wall of the shielded enclosure. The shielded enclosure provides a return current path to a second pad of the pair of coaxial pads through the series components.