Abstract: The invention is directed to a die cutter monitoring system. In an exemplary embodiment the system includes a frame that supports a die. A counter plate is located opposite and aligned with the die. A substrate is placed between the counter plate and die. The counter plate forces the substrate into contact with the die. A force measuring device measures the force of the cutting stroke. The force measuring device generates an output signal. The output signal is analyzed relative to acceptable conditions and operating parameters. If the die cutter is operating outside of acceptable limits, an adjustment signal is generated and sent to the die cutter control system or operator.

Abstract: The invention is directed to a die cutter monitoring system. In an exemplary embodiment the system includes a frame that supports a die. A counter plate is located opposite and aligned with the die. A substrate is placed between the counter plate and die. The counter plate forces the substrate into contact with the die. A force measuring device measures the force of the cutting stroke. The force measuring device generates an output signal. The output signal is analyzed relative to acceptable conditions and operating parameters. If the die cutter is operating outside of acceptable limits, an adjustment signal is generated and sent to the die cutter control system or operator.