Patents by Inventor Denver Zhu

Denver Zhu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit packaging system with package-on-package and method of manufacture thereof
    Patent number: 8207015
    Abstract: A method of manufacture of an integrated circuit packaging system includes: applying a conductive material on a support structure; providing a bottom integrated circuit package having a bottom lead extended therefrom; attaching the bottom lead to the conductive material; stacking a top integrated circuit package over the bottom integrated circuit package, the top integrated circuit package having a top lead extending therefrom and the top lead over the bottom lead; attaching a conductive paste at an end portion of the top lead; and forming a stacking joint by flowing the conductive paste and the conductive material, the stacking joint below the top lead as well as below and above the bottom lead.
    Type: Grant
    Filed: April 30, 2010
    Date of Patent: June 26, 2012
    Assignee: STATS ChipPAC Ltd.
    Inventors: Guo Qiang Shen, Jae Hak Yee, Denver Zhu
  • INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PACKAGE-ON-PACKAGE AND METHOD OF MANUFACTURE THEREOF
    Publication number: 20110266664
    Abstract: A method of manufacture of an integrated circuit packaging system includes: applying a conductive material on a support structure; providing a bottom integrated circuit package having a bottom lead extended therefrom; attaching the bottom lead to the conductive material; stacking a top integrated circuit package over the bottom integrated circuit package, the top integrated circuit package having a top lead extending therefrom and the top lead over the bottom lead; attaching a conductive paste at an end portion of the top lead; and forming a stacking joint by flowing the conductive paste and the conductive material, the stacking joint below the top lead as well as below and above the bottom lead.
    Type: Application
    Filed: April 30, 2010
    Publication date: November 3, 2011
    Inventors: Guo Qiang Shen, Jae Hak Yee, Denver Zhu