Patents by Inventor Deok Chun Jang
Deok Chun Jang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11791183Abstract: A unit sorting system comprising: a net table for receiving units and a unit lifter for depositing said units on the net table; the net table having a first and second zone; wherein the unit lifter is arranged to engage a batch of units and then deposit a first half of the batch to the first zone and deposit a first half of the batch to the second zone.Type: GrantFiled: December 13, 2021Date of Patent: October 17, 2023Assignee: Rokko Systems Pte LtdInventors: Jong Jae Jung, Yun Suk Shin, Deok Chun Jang
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Patent number: 11706875Abstract: An IC unit unloading system including a chute and a drawer. The chute has a plurality of channels each arranged to receive a unit. The drawer is arranged to move along the chute and has a gate with a unit contact face proximate a top surface of the chute. The contact face is arranged to draw the units along the respective channel as the drawer moves along the chute, and to allow the units to slide laterally across the contact face from a first pitch of each channel to a second pitch. A method for washing a plurality of PCB units, the method comprising the steps of: receiving a plurality of PCB units, said PCB units arranged with a bump face projecting downwards; washing the bump face of the PCB units, then; flipping the PCB units so as to project the ball face downwards, then; washing the ball face.Type: GrantFiled: August 7, 2018Date of Patent: July 18, 2023Assignee: Rokko Systems Pte LtdInventors: Yun Suk Shin, Jong Jae Jung, Deok Chun Jang
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Patent number: 11476150Abstract: A process for sputtering a plurality of integrated circuit (“IC”) units, the process having at least the steps of: applying a layer to a holding ring; cutting an array of apertures in the layer; transferring the holding ring to a template positioned within a placement station; aligning the array of apertures with an array of recesses in the template; delivering IC units to the holding ring, each IC unit corresponding to an aligned aperture and recess, and then; applying a sputtering process to the IC units engaged with the holding ring.Type: GrantFiled: February 20, 2020Date of Patent: October 18, 2022Assignee: Rokko Systems PTE LTDInventors: Jong Jae Jung, Yun Suk Shin, Deok Chun Jang
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Publication number: 20220189805Abstract: A unit sorting system comprising: a net table for receiving units and a unit lifter for depositing said units on the net table; the net table having a first and second zone; wherein the unit lifter is arranged to engage a batch of units and then deposit a first half of the batch to the first zone and deposit a first half of the batch to the second zone.Type: ApplicationFiled: December 13, 2021Publication date: June 16, 2022Applicant: Rokko Systems Pte LtdInventors: Jong Jae JUNG, Yun Suk SHIN, Deok Chun JANG
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Patent number: 11183413Abstract: A method for preparing a stencil to receive a plurality of IC units, the method comprising the steps of: providing a metal substrate having an array of apertures; applying an adhesive surface to said substrate; removing portions of said adhesive surface corresponding to the apertures in the metal substrate.Type: GrantFiled: November 18, 2016Date of Patent: November 23, 2021Assignee: Rokko Systems Pte LtdInventors: Seung Ho Baek, Deok Chun Jang, Jong Jae Jung
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Patent number: 10907247Abstract: A method for preparing a film carrier for sputtering of IC units placed thereon, the method comprising the steps of: providing a carrier of IC units; removing said units from the carrier; delivering said IC units to a flipper; inverting and delivering said units to a sputtering film frame; placing the units on said sputtering film frame in an array having a pre-determined clearance about adjacent units.Type: GrantFiled: August 12, 2015Date of Patent: February 2, 2021Assignee: ROKKO SYSTEMS PTE LTDInventors: Chong Chen Gary Lim, Seung Ho Baek, Jong Jae Jung, Yun Suk Shin, Deok Chun Jang
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Publication number: 20200286771Abstract: A process for sputtering a plurality of integrated circuit (“IC”) units, the process having at least the steps of: applying a layer to a holding ring; cutting an array of apertures in the layer; transferring the holding ring to a template positioned within a placement station; aligning the array of apertures with an array of recesses in the template; delivering IC units to the holding ring, each IC unit corresponding to an aligned aperture and recess, and then; applying a sputtering process to the IC units engaged with the holding ring.Type: ApplicationFiled: February 20, 2020Publication date: September 10, 2020Inventors: Jong Jae JUNG, Yun Suk SHIN, Deok Chun JANG
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Publication number: 20200170119Abstract: A method for washing a plurality of PCB units, the method comprising the steps of: receiving a plurality of PCB units, said PCB units arranged with a bump face projecting downwards; washing the bump face of the PCB units, then; flipping the PCB units as to project a ball face downwards, then; washing the ball face.Type: ApplicationFiled: August 7, 2018Publication date: May 28, 2020Applicant: Rokko Systems Pte LtdInventors: Yun Suk SHIN, Jong Jae JUNG, Deok Chun JANG
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Publication number: 20170260623Abstract: A method for preparing a film carrier for sputtering of IC units placed thereon, the method comprising the steps of: providing a carrier of IC units; removing said units from the carrier; delivering said IC units to a flipper; inverting and delivering said units to a sputtering film frame; placing the units on said sputtering film frame in an array having a pre-determined clearance about adjacent units.Type: ApplicationFiled: August 12, 2015Publication date: September 14, 2017Inventors: Chong Chen Gary LIM, Seung Ho James BAEK, Jong Jae JUNG, Yun Suk SHIN, Deok Chun JANG
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Publication number: 20170162412Abstract: A method for preparing a stencil to receive a plurality of IC units, the method comprising the steps of: providing a metal substrate having an array of apertures; applying an adhesive surface to said substrate; removing portions of said adhesive surface corresponding to the apertures in the metal substrate.Type: ApplicationFiled: November 18, 2016Publication date: June 8, 2017Inventors: Seung Ho BAEK, Deok Chun JANG, Jong Jae JUNG
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Patent number: 8997592Abstract: A picker assembly includes a plurality of pickers in selective variable spaced relation, a shaft having a plurality of cam plates, the cam plates co-axial with said shaft and having a variable thickness. The cam plates are in engagement with the pickers and positioned in interstitial spaces between the pickers. The selective variability in spacing is provided by rotation of the shaft such that thickness variation of the cam plates move the respective pickers along an axis parallel to the shaft.Type: GrantFiled: December 23, 2010Date of Patent: April 7, 2015Assignee: Rokko Systems Pte LtdInventors: Hae Choon Yang, Jong Jae Jung, Deok Chun Jang, Chong Chen Gary Lim
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Patent number: 8890018Abstract: A method for inspecting and sorting a plurality of IC units comprising the steps of: delivering a frame containing said IC units to a unit picking station; conducting a first inspection of said units during the delivering step and recording the subsequent result; removing said units from the frame, and moving said units from the unit picking station to a flipping station; conducting a second inspection of said units during the moving step and recording the subsequent result; flipping said units to expose an opposed face said units; conducting a third inspection of said opposed face and recording the subsequent result, then; sorting said units into categories based on the recorded results from the first, second and third inspecting steps.Type: GrantFiled: November 30, 2010Date of Patent: November 18, 2014Assignee: Rokko Systems Pte Ltd.Inventors: Jong Jae Jung, Yun Suk Shin, Hae Choon Yang, Deok Chun Jang
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Publication number: 20130209205Abstract: A shuttle table assembly comprising a shuttle table for receiving a plurality of IC units at a first position and for offloading said units at a second position, said shuttle table movable from said first to second position; a cover assembly mounted to said shuttle table, the cover assembly having at least one cover movable from an open position to a closed position, said closed position covering said units on the shuttle table; wherein the cover assembly is coupled to a guide for closing the cover as the shuttle table moves from the first to the second position.Type: ApplicationFiled: July 26, 2011Publication date: August 15, 2013Applicant: Rokko Ventures Pte Ltd.Inventors: Hae Choon Yang, Deok Chun Jang
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Publication number: 20130008836Abstract: A method for inspecting and sorting a plurality of IC units comprising the steps of: delivering a frame containing said IC units to a unit picking station; conducting a first inspection of said units during the delivering step and recording the subsequent result; removing said units from the frame, and moving said units from the unit picking station to a flipping station; conducting a second inspection of said units during the moving step and recording the subsequent result; flipping said units to expose an opposed face said units; conducting a third inspection of said opposed face and recording the subsequent result, then; sorting said units into categories based on the recorded results from the first, second and third inspecting steps.Type: ApplicationFiled: November 30, 2010Publication date: January 10, 2013Applicant: ROKKO SYSTEMS PTE LTDInventors: Jong Jae Jung, Yun Suk Shin, Hae Choon Yang, Deok Chun Jang
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Publication number: 20120184086Abstract: A punching system for singulating IC units comprising: a punching assembly arranged to receive a substrate and singulate said substrate into the IC units; a rotary carrier rotatable from a first position to a second position said rotary carrier arranged to receive said units at the first position and carry said units to the second position through rotation; wherein said rotary carrier includes recesses for receiving at least a portion of the units. A punching assembly comprising a die block having recesses for receiving selectively replaceable inserts wherein said inserts correspond to a punch pattern specific to a predetermined IC package arrangement.Type: ApplicationFiled: September 24, 2010Publication date: July 19, 2012Inventors: Hae Choon Yang, Xue Fang Shen, Deok Chun Jang, Chong Chen Lim, Siok Chun Lim, Yun Suk Shin
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Publication number: 20110036339Abstract: A system for cutting a plurality of substrates of integrated circuit units comprising a plurality of tables (40, 55), each table including a plurality of trays (37A, 37B, 57A, 57B), each tray arranged to receive one of said substrates; each of said tables selectively movable between a respective loading station (20) for receiving said substrates and a cutting station for cutting the substrates, and a substrate placement device (35) for placing the substrates on the respective trays of said tables; wherein the substrate placement device is arranged to sequentially place substrates on said tables with said tables arranged to sequentially move to the cutting station after receiving the substrates and then return to their respective loading stations for placement of additional substrates.Type: ApplicationFiled: May 4, 2009Publication date: February 17, 2011Inventors: Jong Jae Jung, Deok Chun Jang, Chang Hwan Ha, Chong Chen Lim, Seung Ho Baek