Patents by Inventor Deok Soon KWON

Deok Soon KWON has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Embedded printed circuit board
    Patent number: 9629248
    Abstract: Provided is an embedded printed circuit board, including: a first insulating substrate including a first cavity and a second cavity; a first element disposed in the first cavity; an adhesive layer for adhering the first insulating substrate to the first element and including an opening to which the first element is exposed; and an second insulating substrate forming a bonding layer of a lower surface of the first insulating substrate and a bottom surface of the second cavity.
    Type: Grant
    Filed: February 4, 2015
    Date of Patent: April 18, 2017
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Deok Soon Kwon, Sang Hyuck Nam, Won Suk Jung
  • EMBEDDED PRINTED CIRCUIT BOARD
    Publication number: 20150223342
    Abstract: Provided is an embedded printed circuit board, including: a first insulating substrate including a first cavity and a second cavity; a first element disposed in the first cavity; an adhesive layer for adhering the first insulating substrate to the first element and including an opening to which the first element is exposed; and an second insulating substrate forming a bonding layer of a lower surface of the first insulating substrate and a bottom surface of the second cavity.
    Type: Application
    Filed: February 4, 2015
    Publication date: August 6, 2015
    Inventors: Deok Soon KWON, Sang Hyuck NAM, Won Suk JUNG