Patents by Inventor Deon Eugene Campbell

Deon Eugene Campbell has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6398964
    Abstract: A process for treating aqueous waste comprising a copper plating waste stream, a copper rinse stream containing organic carbon and solid particles, and a copper chemical mechanical planarization stream (CMP) containing solid particles is provided. This process includes electrowinning the copper plating waste stream to remove copper and create a blow down stream, filtering the rinse stream to remove solid particles, adding the blow down stream to the CMP stream, treating the blow down stream and the CMP stream with a flocculant or coagulant to form larger solid particles, removing the larger solid particles from the CMP stream and separating the resulting stream into a liquid containing copper, a concentrated regenerant, and a dilute regenerant, adding the concentrated regenerant to the waste stream before the electrowinning step, adding the dilute regenerant to the rinse stream before filtering to remove solid particles, and adding the liquid containing copper to the CMP stream during the treating step.
    Type: Grant
    Filed: August 19, 1999
    Date of Patent: June 4, 2002
    Assignee: Koch Microelectronic Service Company, Inc.
    Inventors: Daun Marie Brady, Michael Andrew Frisch, Deon Eugene Campbell, Thuy Nguyen, Dustin Kimbel James
  • Patent number: 6338803
    Abstract: A process for treating waste water containing hydrofluoric acid, mixed acid etchant waste, dissolved silica, and solid particles is provided. This process involves adjusting the pH of the waste water to about 7 or above, filtering the waste water to remove solid particles, adding an anti-scalant to the waste water, and feeding the waste water through a reverse osmosis membrane. The reverse osmosis membrane separates the waste water into a permeate stream, which is the product, and a reject stream. Another aspect of the present invention is a system for performing this process.
    Type: Grant
    Filed: August 30, 1999
    Date of Patent: January 15, 2002
    Assignee: Koch Microelectronic Service Co., Inc.
    Inventors: Deon Eugene Campbell, Dustin Kimbel James, Jereme Francis, Thomas Stocker
  • Patent number: 6203705
    Abstract: A process for treating waste water containing copper and other particles from a chemical mechanical planarization (CMP) process is provided. This process includes adjusting the pH of the waste water to between about 3 and 4, adding a coagulant or flocculating polymer to the waste water to generate larger particles, filtering the waste water through a filtration unit to produce a permeate and solids, feeding the permeate through a carbon bed to remove total organic carbon, and feeding the carbon bed treated permeate through an ion exchange column to remove copper from the permeate. This process may further involve washing sludge collected in a concentration tank with the treated stream exiting the ion exchange column. Still further, another aspect of the present invention is a system for performing the process described above.
    Type: Grant
    Filed: October 22, 1999
    Date of Patent: March 20, 2001
    Assignee: Koch Microelectronic Service Company, Inc.
    Inventors: Dustin Kimbel James, Deon Eugene Campbell, Thuy Nguyen