Abstract: The present application belongs to the technical field of cell phone accessories and relates to a waterproof bag for a cell phone, waterproof bag for a cell phone comprising a bag body, an airtight zipper, and a buoyancy enhancement component; wherein the bag body is provided with an opening, the airtight zipper is mounted to the opening, the buoyancy enhancement component is provided on the bag body to provide buoyancy for the waterproof bag for a cell phone, and the buoyancy enhancement component enables the waterproof bag for the cell phone and a medium-sized or large-sized cell phone in the bag to float on the water surface.

Abstract: The present application belongs to the technical field of cell phone accessories, and the waterproof bag for cell phones includes an airtight zipper, an auxiliary pulling structure, and a bag body having an opening, with a first transparent film and a second transparent film relatively disposed on the bag body; the airtight zipper is mounted on the bag body at the opening; and the auxiliary pulling structure is disposed on the bag body; among other things, the airtight zipper can cooperate with the auxiliary pulling structure to open or close the opening easily.

Abstract: The present disclosure provides a thermal treatment chamber. The thermal treatment chamber includes a wafer holder to hold a to-be-processed wafer; a heat reservoir located under the wafer holder, but being separated from the wafer holder, for adjusting a temperature of the wafer holder based on the to-be-processed wafer; and a first driving unit connected to the heat reservoir for adjusting a distance between the wafer holder and the heat reservoir to adjust the temperature of the wafer holder.

Abstract: The present disclosure provides a thermal treatment chamber. The thermal treatment chamber includes a wafer holder to hold a to-be-processed wafer; a heat reservoir located under the wafer holder, but being separated from the wafer holder, for adjusting a temperature of the wafer holder based on the to-be-processed wafer; and a first driving unit connected to the heat reservoir for adjusting a distance between the wafer holder and the heat reservoir to adjust the temperature of the wafer holder.