Patents by Inventor Der Min Liou

Der Min Liou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR COMPONENT HAVING AN ESD PROTECTION DEVICE
    Publication number: 20180374931
    Abstract: A semiconductor component and a method for manufacturing the semiconductor component, wherein the semiconductor component includes a transient voltage suppression structure that includes at least two diodes and a Zener diode. In accordance with embodiments, a semiconductor material is provided that includes an epitaxial layer. The at least two diodes and the Zener diode are created at the surface of the epitaxial layer, where the at least two diodes may be adjacent to the Zener diode.
    Type: Application
    Filed: August 14, 2018
    Publication date: December 27, 2018
    Applicant: Semiconductor Components Industries, LLC
    Inventors: Umesh SHARMA, Harry Yue GEE, Der Min LIOU, David D. MARREIRO, Sudhama C. SHASTRI
  • Method for manufacturing a semiconductor device
    Patent number: 10109718
    Abstract: A semiconductor component and a method for manufacturing the semiconductor component, wherein the semiconductor component includes a transient voltage suppression structure that includes at least two diodes and a Zener diode. In accordance with embodiments, a semiconductor material is provided that includes an epitaxial layer. The at least two diodes and the Zener diode are created at the surface of the epitaxial layer, where the at least two diodes may be adjacent to the Zener diode.
    Type: Grant
    Filed: May 1, 2014
    Date of Patent: October 23, 2018
    Assignee: Semiconductor Components Industries, LLC
    Inventors: Umesh Sharma, Harry Yue Gee, Der Min Liou, David D Marreiro, Sudhama C Shastri
  • Method of manufacturing a semiconductor component and structure
    Patent number: 9419069
    Abstract: A semiconductor component and methods for manufacturing the semiconductor component that includes a three dimensional helically shaped common mode choke. In accordance with embodiments, a transient voltage suppression device may be coupled to the monolithically integrated common mode choke.
    Type: Grant
    Filed: June 27, 2014
    Date of Patent: August 16, 2016
    Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventors: Phillip Holland, Rong Liu, Umesh Sharma, David D Marreiro, Der Min Liou, Sudhama C Shastri
  • Method for manufacturing a semiconductor component that includes a common mode choke and structure
    Patent number: 8999807
    Abstract: A semiconductor component and methods for manufacturing the semiconductor component that includes a monolithically integrated common mode choke. In accordance with embodiments, a transient voltage suppression device may be coupled to the monolithically integrated common mode choke.
    Type: Grant
    Filed: May 27, 2010
    Date of Patent: April 7, 2015
    Assignee: Semiconductor Components Industries, LLC
    Inventors: Li Jiang, Ryan J. Hurley, Sudhama C. Shastri, Yenting Wen, Wang-Chang Albert Gu, Phillip Holland, Der Min Liou, Rong Liu, Wenjiang Zeng
  • METHOD OF MANUFACTURING A SEMICONDUCTOR COMPONENT AND STRUCTURE
    Publication number: 20140308795
    Abstract: A semiconductor component and methods for manufacturing the semiconductor component that includes a three dimensional helically shaped common mode choke. In accordance with embodiments, a transient voltage suppression device may be coupled to the monolithically integrated common mode choke.
    Type: Application
    Filed: June 27, 2014
    Publication date: October 16, 2014
    Inventors: Phillip Holland, Rong Liu, Umesh Sharma, David D Marreiro, Der Min Liou, Sudhama C. Shastri
  • METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE
    Publication number: 20140242771
    Abstract: A semiconductor component and a method for manufacturing the semiconductor component, wherein the semiconductor component includes a transient voltage suppression structure that includes at least two diodes and a Zener diode. In accordance with embodiments, a semiconductor material is provided that includes an epitaxial layer. The at least two diodes and the Zener diode are created at the surface of the epitaxial layer, where the at least two diodes may be adjacent to the Zener diode.
    Type: Application
    Filed: May 1, 2014
    Publication date: August 28, 2014
    Applicant: Semiconductor Components Industries, LLC
    Inventors: Umesh Sharma, Harry Yue Gee, Der Min Liou, David D Marreiro, Sudhama C Shastri
  • Method of manufacturing a semiconductor component and structure
    Patent number: 8766401
    Abstract: A semiconductor component and methods for manufacturing the semiconductor component that includes a three dimensional helically shaped common mode choke. In accordance with embodiments, a transient voltage suppression device may be coupled to the monolithically integrated common mode choke.
    Type: Grant
    Filed: October 1, 2010
    Date of Patent: July 1, 2014
    Assignee: Semiconductor Components Industries, LLC
    Inventors: Phillip Holland, Rong Liu, Umesh Sharma, Der Min Liou, David D. Marreiro, Sudhama C. Shastri
  • ESD DEVICE AND METHOD
    Publication number: 20120080769
    Abstract: A semiconductor component and a method for manufacturing the semiconductor component, wherein the semiconductor component includes a transient voltage suppression structure that includes at least two diodes and a Zener diode. In accordance with embodiments, a semiconductor material is provided that includes an epitaxial layer. The at least two diodes and the Zener diode are created at the surface of the epitaxial layer, where the at least two diodes may be adjacent to the Zener diode.
    Type: Application
    Filed: October 1, 2010
    Publication date: April 5, 2012
    Inventors: Umesh Sharma, Harry Yue Gee, Der Min Liou, David D. Marreiro, Sudhama C. Shastri
  • METHOD OF MANUFACTURING A SEMICONDUCTOR COMPONENT AND STRUCTURE
    Publication number: 20120080803
    Abstract: A semiconductor component and methods for manufacturing the semiconductor component that includes a three dimensional helically shaped common mode choke. In accordance with embodiments, a transient voltage suppression device may be coupled to the monolithically integrated common mode choke.
    Type: Application
    Filed: October 1, 2010
    Publication date: April 5, 2012
    Inventors: Phillip Holland, Rong Liu, Umesh Sharma, Der Min Liou, David D. Marreiro, Sudhama C. Shastri
  • METHOD OF MANUFACTURING A SEMICONDUCTOR COMPONENT AND STRUCTURE
    Publication number: 20110291231
    Abstract: A semiconductor component and methods for manufacturing the semiconductor component that includes a monolithically integrated common mode choke. In accordance with embodiments, a transient voltage suppression device may be coupled to the monolithically integrated common mode choke.
    Type: Application
    Filed: May 27, 2010
    Publication date: December 1, 2011
    Inventors: Li Jiang, Ryan J. Hurley, Sudhama C. Shastri, Yenting Wen, Wang-Chang Albert Gu, Phillip Holland, Der Min Liou, Rong Liu, Wenjiang Zeng