Patents by Inventor Der Shyn

Der Shyn has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070117367
    Abstract: A fluid injection apparatus is disclosed. A chamber wall is disposed overlying the substrate to define an area. A nozzle plate comprising a nozzle is disposed overlying the chamber wall to form a chamber on the area, wherein the chamber wall and the nozzle plate are integrated into a structure layer. A manifold is disposed in the substrate, communicated with the chamber.
    Type: Application
    Filed: November 21, 2006
    Publication date: May 24, 2007
    Applicant: BENQ CORPORATION
    Inventors: Der Shyn, Wei Chen, Fan Tseng, Wen Chuang, Guang Shen
  • Publication number: 20070109361
    Abstract: A fluid injection apparatus is disclosed. A manifold connects a plurality of fluid chambers to supply fluids thereto. A plurality of nozzles are connected to the fluid chambers respectively to eject the fluids, wherein at least two of the nozzles are not disposed along a column or a row, and distances between the nozzles and the manifold are substantially the same.
    Type: Application
    Filed: November 13, 2006
    Publication date: May 17, 2007
    Applicant: BENQ CORPORATION
    Inventors: Wei Chen, Der Shyn, Fan Tseng
  • Publication number: 20060238573
    Abstract: A method for fabricating a monolithic fluid ejection device. The method includes providing a substrate with a signal transmitting circuit and a heating element. A protective layer is formed to cover the signal transmitting circuit and a heating element. A first patterned resistive layer is formed to define a predetermined sacrificial layer area. A sacrificial layer is formed on the predetermined sacrificial layer area. After removing the first resistive layer, a second patterned resistive layer is formed to define a predetermined structural layer area. After forming a structural layer, the second resistive layer is removed. A manifold is formed by etching from the back of the substrate to expose the sacrificial layer. Finally, a chamber is formed by removing the sacrificial layer.
    Type: Application
    Filed: April 25, 2006
    Publication date: October 26, 2006
    Applicant: BENQ CORPORATION
    Inventors: Hung Hu, Wei Chen, Der Shyn