Patents by Inventor Der-Yun Liu

Der-Yun Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Dual cup spin coating system
    Patent number: 6596082
    Abstract: A dual cup spin coating system for capturing a discharged flowable coating material in a spin coating process including a first outer cup and a second outer cup said first outer cup concentrically disposed around the second outer cup forming a first capture space arranged for capturing at least a portion of a discharged flowable coating material discharged from a process substrate at a first positive angle with respect to the process substrate in a spin coating process; and, an inner cup disposed concentrically within the second outer cup forming a second capture space arranged for capturing at least a second portion of the discharged flowable coating material discharged from the process substrate at a second positive angle less than about the first positive angle with respect to the process substrate in a spin coating process.
    Type: Grant
    Filed: November 30, 2001
    Date of Patent: July 22, 2003
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd
    Inventors: Chih-Chen Chuang, Cheng-Hsiang Huang, Der-Yun Liu
  • DUAL CUP SPIN COATING SYSTEM
    Publication number: 20030101928
    Abstract: A dual cup spin coating system for capturing a discharged flowable coating material in a spin coating process including a first outer cup and a second outer cup said first outer cup concentrically disposed around the second outer cup forming a first capture space arranged for capturing at least a portion of a discharged flowable coating material discharged from a process substrate at a first positive angle with respect to the process substrate in a spin coating process; and, an inner cup disposed concentrically within the second outer cup forming a second capture space arranged for capturing at least a second portion of the discharged flowable coating material discharged from the process substrate at a second positive angle less than about the first positive angle with respect to the process substrate in a spin coating process.
    Type: Application
    Filed: November 30, 2001
    Publication date: June 5, 2003
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chih-Chen Chuang, Cheng-Hsiang Huang, Der-Yun Liu