Abstract: A computer program product and system of providing a dynamic sampling plan for integrated metrology is disclosed. The computer program product may include a computer readable medium that includes a computer readable program, wherein the computer readable program when executed on a computer causes the computer to: model a sampling plan for use with a factory level advanced processing control (FL-APC) system; receive a request for a sampling plan; and send a recommended sampling plan, based upon the request and the modeling. The recommended sampling plan may be sent to an equipment interface (EI) and on to a tool for implementation in a manufacturing environment.

Abstract: A method and system for reducing the variation in film thickness on a plurality of semiconductor wafers having multiple deposition paths in a semiconductor manufacturing process is disclosed. A film of a varying input thickness is applied to semiconductor wafers moving through various film deposition paths. The deposition path of each of the semiconductor wafers is recorded. A subset of semiconductor wafers is measured and an average film input thickness corresponding to each of the film deposition paths is calculated. If semiconductor wafer in the specific film deposition path does not have measurement data, by default it uses historical measurement data. The average film input thickness of the deposition path corresponding to a given semiconductor wafer is then used to modify the recipe of a process tool, such as a Chemical Mechanical Planarization (CMP) Process Tool. An improved manufacturing process is achieved without the use of excess measurements.

Abstract: A computer program product and system of providing a dynamic sampling plan for integrated metrology is disclosed. The computer program product may include a computer readable medium that includes a computer readable program, wherein the computer readable program when executed on a computer causes the computer to: model a sampling plan for use with a factory level advanced processing control (FL-APC) system; receive a request for a sampling plan; and send a recommended sampling plan, based upon the request and the modeling. The recommended sampling plan may be sent to an equipment interface (EI) and on to a tool for implementation in a manufacturing environment.

Abstract: A method and system of providing a dynamic sampling plan for integrated metrology is disclosed. The method may include modeling a sampling plan for use with a factory level advanced processing control (FL-APC) system and sending a recommended sampling plan, in response to receiving a request for a sampling plan, wherein the recommended sampling plan is based upon the modeling and the request. The recommended sampling plan may be sent to an equipment interface (EI) and on to a tool for implementation in a manufacturing environment.

Abstract: A method and system for reducing the variation in film thickness on a plurality of semiconductor wafers having multiple deposition paths in a semiconductor manufacturing process is disclosed. A film of a varying input thickness is applied to semiconductor wafers moving through various film deposition paths. The deposition path of each of the semiconductor wafers is recorded. A subset of semiconductor wafers is measured and an average film input thickness corresponding to each of the film deposition paths is calculated. If semiconductor wafer in the specific film deposition path does not have measurement data, by default it uses historical measurement data. The average film input thickness of the deposition path corresponding to a given semiconductor wafer is then used to modify the recipe of a process tool, such as a Chemical Mechanical Planarization (CMP) Process Tool. An improved manufacturing process is achieved without the use of excess measurements.

Abstract: A method and system of providing a dynamic sampling plan for integrated metrology is disclosed. The method may include modeling a sampling plan for use with a factory level advanced processing control (FL-APC) system and sending a recommended sampling plan, in response to receiving a request for a sampling plan, wherein the recommended sampling plan is based upon the modeling and the request. The recommended sampling plan may be sent to an equipment interface (EI) and on to a tool for implementation in a manufacturing environment.