Patents by Inventor Derek Hinkle
Derek Hinkle has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7321160Abstract: A multi-part lead frame semiconductor device assembly is disclosed including a die bonded to a die paddle. A second lead frame including leads is superimposed and bonded onto the first lead frame. Also disclosed is a method for fabricating the multi-part lead frame semiconductor device assembly which utilizes equipment designed for single lead frame processing. If desired, the materials for the multi-part lead frame may be dissimilar.Type: GrantFiled: May 25, 2005Date of Patent: January 22, 2008Assignee: Micron Technology, Inc.Inventors: S. Derek Hinkle, Jerry M. Brooks, David J. Corisis
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Patent number: 7199464Abstract: Semiconductor device structures include protective layers that are formed from healable or healed materials. The healable materials are configured to eliminate cracks and delamination, including singulation-induced cracks and delamination. The protective layers may be formed by applying a layer of protective material to surfaces of semiconductor device components that are carried by a fabrication substrate. The layer of protective material is then severed and the fabrication substrate is at least partially severed. Cracks and delaminated regions that are formed during severing are then healed. If a curable polymer is employed as the protective material, it may be partially cured before severing is effected, then self-healed before being fully cured. Alternatively, a thermoplastic material may be used as the protective material, with healing being effected by heating at least regions of the thermoplastic material.Type: GrantFiled: February 8, 2005Date of Patent: April 3, 2007Assignee: Micron Technology, Inc.Inventors: Shijian Luo, Tongbi Jiang, S. Derek Hinkle
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Patent number: 6946722Abstract: A multi-part lead frame semiconductor device assembly is disclosed including a die bonded to a die paddle. A second lead frame including leads is superimposed and bonded onto the first lead frame. Also disclosed is a method for fabricating the multi-part lead frame semiconductor device assembly which utilizes equipment designed for single lead frame processing. If desired, the materials for the multi-part lead frame may be dissimilar.Type: GrantFiled: May 22, 2003Date of Patent: September 20, 2005Assignee: Micron Technology, Inc.Inventors: S. Derek Hinkle, Jerry M. Brooks, David J. Corisis
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Patent number: 6902952Abstract: A multi-part lead frame die assembly is disclosed including a die bonded to a die paddle. A second lead frame including leads is superimposed and bonded onto the first lead frame. Also disclosed is a method for fabricating the multi-part lead frame assembly which utilizes equipment designed for single lead frame processing. If desired, the materials for the multi-part lead frame may be dissimilar.Type: GrantFiled: February 14, 2002Date of Patent: June 7, 2005Assignee: Micron Technology, Inc.Inventors: S. Derek Hinkle, Jerry M. Brooks, David J. Corisis
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Patent number: 6886247Abstract: Methods to singulate circuit forming regions of a circuit board substrate assembly includes providing a plurality of circuit forming regions including at least one pair of adjacent circuit forming regions separated by at least one opening defined in substrate material between each pair of adjacent circuit forming regions. At least a portion of interconnection regions along singulation axes are removed to singulate the circuit forming regions.Type: GrantFiled: December 2, 2003Date of Patent: May 3, 2005Assignee: Micron Technology, Inc.Inventors: Zane Drussel, Derek Hinkle
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Patent number: 6885108Abstract: A method for forming protective layers on a plurality of semiconductor device components carried by a fabrication substrate includes applying a layer of protective material to surfaces of the semiconductor device components. The layer of protective material is then severed and the fabrication substrate is at least partially severed. Cracks and delaminated regions that are formed during severing are then healed. The protective material may be applied as a preformed sheet or in a liquid form, then at least partially cured or hardened. If a curable polymer is employed as the protective material, it may be partially cured before severing is effected, then self-healed before being fully cured. Alternatively, a thermoplastic material may be used as the protective material, with healing being effected by heating at least regions of the thermoplastic material. Semiconductor device components, including chip-scale packages, which are formed by the method are also disclosed.Type: GrantFiled: March 18, 2003Date of Patent: April 26, 2005Assignee: Micron Technology, Inc.Inventors: Shijian Luo, Tongbi Jiang, S. Derek Hinkle
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Publication number: 20040198023Abstract: A method for forming protective layers on a plurality of semiconductor device components carried by a fabrication substrate includes applying a layer of protective material to surfaces of the semiconductor device components. The layer of protective material is then severed and the fabrication substrate is at least partially severed. Cracks and delaminated regions that are formed during severing are then healed. The protective material may be applied as a preformed sheet or in a liquid form, then at least partially cured or hardened. If a curable polymer is employed as the protective material, it may be partially cured before severing is effected, then self-healed before being fully cured. Alternatively, a thermoplastic material may be used as the protective material, with healing being effected by heating at least regions of the thermoplastic material. Semiconductor device components, including chip-scale packages, which are formed by the method are also disclosed.Type: ApplicationFiled: April 19, 2004Publication date: October 7, 2004Inventors: Shijian Luo, Tongbi Jiang, S. Derek Hinkle
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Publication number: 20040183210Abstract: A method for forming protective layers on a plurality of semiconductor device components carried by a fabrication substrate includes applying a layer of protective material to surfaces of the semiconductor device components. The layer of protective material is then severed and the fabrication substrate is at least partially severed. Cracks and delaminated regions that are formed during severing are then healed. The protective material may be applied as a preformed sheet or in a liquid form, then at least partially cured or hardened. If a curable polymer is employed as the protective material, it may be partially cured before severing is effected, then self-healed before being fully cured. Alternatively, a thermoplastic material may be used as the protective material, with healing being effected by heating at least regions of the thermoplastic material. Semiconductor device components, including chip-scale packages, which are formed by the method are also disclosed.Type: ApplicationFiled: March 18, 2003Publication date: September 23, 2004Inventors: Shijian Luo, Tongbi Jiang, S. Derek Hinkle
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Publication number: 20040107570Abstract: A circuit board substrate assembly includes a generally planar circuit board substrate material having a longitudinal axis extending along a length of the substrate material between a first end and a second end thereof. The circuit board substrate material further has a first edge and a second edge extending along the length of the circuit board substrate material between the first end and the second end. A plurality of openings are defined in the substrate material. Each opening extends between a first distance from the first edge of the circuit board substrate and a second distance from the second edge of the circuit board substrate. Further, each opening separates adjacent circuit forming regions lying along the longitudinal axis and has first and second opposing end portions.Type: ApplicationFiled: December 2, 2003Publication date: June 10, 2004Applicant: MICRON TECHNOLOGY, INC.Inventors: Zane Drussel, Derek Hinkle
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Patent number: 6664480Abstract: A circuit board substrate assembly includes a generally planar circuit board substrate material having a longitudinal axis extending along a length of the substrate material between a first end and a second end thereof. The circuit board substrate material further has a first edge and a second edge extending along the length of the circuit board substrate material between the first end and the second end. A plurality of openings are defined in the substrate material. Each opening extends between a first distance from the first edge of the circuit board substrate and a second distance from the second edge of the circuit board substrate. Further, each opening separates adjacent circuit forming regions lying along the longitudinal axis and has first and second opposing end portions.Type: GrantFiled: May 25, 2001Date of Patent: December 16, 2003Assignee: Micron Technology, Inc.Inventors: Zane Drussel, Derek Hinkle
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Publication number: 20030205790Abstract: A multi-part lead frame die assembly is disclosed including a die bonded to a die paddle. A second lead frame including leads is superimposed and bonded onto the first lead frame. Also disclosed is a method for fabricating the multi-part lead frame assembly which utilizes equipment designed for single lead frame processing. If desired, the materials for the multi-part lead frame may be dissimilar.Type: ApplicationFiled: May 22, 2003Publication date: November 6, 2003Inventors: S. Derek Hinkle, Jerry M. Brooks, David J. Corisis
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Patent number: 6570244Abstract: A multi-part lead frame die assembly is disclosed including a die bonded to a die paddle. A second lead frame including leads is superimposed and bonded onto the first lead frame. Also disclosed is a method for fabricating the multi-part lead frame assembly which utilizes equipment designed for single lead frame processing. If desired, the materials for the multi-part lead frame may be dissimilar.Type: GrantFiled: November 16, 1999Date of Patent: May 27, 2003Assignee: Micron Technology, Inc.Inventors: S. Derek Hinkle, Jerry M. Brooks, David J. Corisis
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Publication number: 20020076857Abstract: A multi-part lead frame die assembly is disclosed including a die bonded to a die paddle. A second lead frame including leads is superimposed and bonded onto the first lead frame. Also disclosed is a method for fabricating the multi-part lead frame assembly which utilizes equipment designed for single lead frame processing. If desired, the materials for the multi-part lead frame may be dissimilar.Type: ApplicationFiled: February 14, 2002Publication date: June 20, 2002Inventors: S. Derek Hinkle, Jerry M. Brooks, David J. Corisis
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Patent number: 6362022Abstract: A multi-part lead frame die assembly is disclosed including a die bonded to a die paddle. A second lead frame including leads is superimposed and bonded onto the first lead frame. Also disclosed is a method for fabricating the multi-part lead frame assembly which utilizes equipment designed for single lead frame processing. If desired, the materials for the multi-part lead frame may be dissimilar.Type: GrantFiled: October 30, 2000Date of Patent: March 26, 2002Assignee: Micron Technology, Inc.Inventors: S. Derek Hinkle, Jerry M. Brooks, David J. Corisis
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Publication number: 20020023774Abstract: A circuit board substrate assembly includes a generally planar circuit board substrate material having a longitudinal axis extending along a length of the substrate material between a first end and a second end thereof. The circuit board substrate material further has a first edge and a second edge extending along the length of the circuit board substrate material between the first end and the second end. A plurality of openings are defined in the substrate material. Each opening extends between a first distance from the first edge of the circuit board substrate and a second distance from the second edge of the circuit board substrate. Further, each opening separates adjacent circuit forming regions lying along the longitudinal axis and has first and second opposing end portions.Type: ApplicationFiled: May 25, 2001Publication date: February 28, 2002Inventors: Zane Drussel, Derek Hinkle
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Patent number: 6239380Abstract: A circuit board substrate assembly includes a generally planar circuit board substrate material having a longitudinal axis extending along a length of the substrate material between a first end and a second end thereof. The circuit board substrate material further has a first edge and a second edge extending along the length of the circuit board substrate material between the first end and the second end. A plurality of openings are defined in the substrate material. Each opening extends between a first distance from the first edge of the circuit board substrate and a second distance from the second edge of the circuit board substrate. Further, each opening separates adjacent circuit forming regions lying along the longitudinal axis and has first and second opposing end portions.Type: GrantFiled: August 24, 1999Date of Patent: May 29, 2001Assignee: Micron Technology, Inc.Inventors: Zane Drussel, Derek Hinkle
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Patent number: 6140154Abstract: A multi-part lead frame die assembly is disclosed including a die bonded to a die paddle. A second lead frame including leads is superimposed and bonded onto the first lead frame. Also disclosed is a method for fabricating the multi-part lead frame assembly which utilizes equipment designed for single lead frame processing. If desired, the materials for the multi-part lead frame may be dissimilar.Type: GrantFiled: June 23, 1999Date of Patent: October 31, 2000Assignee: Micron Technology, Inc.Inventors: S. Derek Hinkle, Jerry M. Brooks, David J. Corisis
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Patent number: 6072228Abstract: A multi-leadframe die assembly is disclosed including a die bonded to a die paddle. A second lead frame including leads is superimposed and bonded onto the first lead frame. Also disclosed is a method for fabricating the multi part lead frame assembly which utilizes equipment designed for single lead frame processing. If desired, the materials for the multi part lead frame may be dissimilar.Type: GrantFiled: October 25, 1996Date of Patent: June 6, 2000Assignee: Micron Technology, Inc.Inventors: S. Derek Hinkle, Jerry M. Brooks, David J. Corisis
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Patent number: 6047470Abstract: A circuit board substrate assembly includes a generally planar circuit board substrate material having a longitudinal axis extending along a length of the substrate material between a first end and a second end thereof. The circuit board substrate material further has a first edge and a second edge extending along the length of the circuit board substrate material between the first end and the second end. A plurality of openings are defined in the substrate material. Each opening extends between a first distance from the first edge of the circuit board substrate and a second distance from the second edge of the circuit board substrate. Further, each opening separates adjacent circuit forming regions lying along the longitudinal axis and has first and second opposing end portions.Type: GrantFiled: August 20, 1997Date of Patent: April 11, 2000Assignee: Micron Technology, Inc.Inventors: Zane Drussel, Derek Hinkle