Abstract: According to one embodiment, a method for placing an adapter card on a system board of a computer system includes, aligning a tool having an adapter card secured therewith to a slot on a system board of a computer system using a positioning member, and seating the adapter card into the slot on the system board. The tool includes a carrier for supporting the adapter card, at least one lower retaining member extending from a lower portion of the carrier for securing the adapter card to the carrier, at least one upper retaining member extending from an upper portion of the carrier for securing the adapter card to the carrier, and the positioning member coupled to the carrier.

Abstract: A system includes a chassis, a plurality of nodes, a coolant distribution unit (CDU), and one or more air movers. The chassis includes multiple node bays, a CDU bay, a coolant supply manifold with an inlet in the CDU bay and an outlet in each node bay, and a coolant return manifold an inlet in each node bay and an outlet in the CDU bay. Each node is received into a node bay with an internal heat exchanger connected between a coolant supply and return manifolds. The CDU is received in the CDU bay and includes an air-to-coolant heat exchanger in fluid communication between the supply and return manifolds, and a pump for circulating a coolant through a coolant loop. The one or more air movers force air across the air-to-coolant heat exchanger of the CDU.

Abstract: A computer memory system comprises non-volatile memory and a memory controller module including a memory controller. The memory controller module is selectively secured in a memory module socket of a motherboard to provide the memory controller in communication with a memory module bus using a memory bus standard. The memory controller includes one or more ports for communication with the non-volatile memory using a data storage protocol, wherein the memory controller controls read and write operations for the non-volatile memory. The memory system further comprises one or more cables connecting the one or more ports of the memory controller to the non-volatile memory, wherein the non-volatile memory is not on the memory controller module. Optionally, the non-volatile memory may be included in a separate memory module or a solid state drive.

Abstract: A system includes a chassis, a plurality of nodes, a coolant distribution unit (CDU), and one or more air movers. The chassis includes multiple node bays, a CDU bay, a coolant supply manifold with an inlet in the CDU bay and an outlet in each node bay, and a coolant return manifold an inlet in each node bay and an outlet in the CDU bay. Each node is received into a node bay with an internal heat exchanger connected between a coolant supply and return manifolds. The CDU is received in the CDU bay and includes an air-to-coolant heat exchanger in fluid communication between the supply and return manifolds, and a pump for circulating a coolant through a coolant loop. The one or more air movers force air across the air-to-coolant heat exchanger of the CDU.

Abstract: According to one embodiment, a tool includes a carrier having a substantially pentagonal planar face configured to engage a rectangular side portion of a substantially cuboidal adapter card; at least one lower retaining member comprising a planar surface extending from a lower edge of the carrier, wherein the planar surface is oriented perpendicular to the substantially pentagonal planar face of the carrier; and at least one upper retaining member comprising a second planar surface extending from an upper portion of the carrier, wherein at least a portion of the second planar surface is oriented perpendicular to the substantially pentagonal planar face of the carrier.

Abstract: An apparatus includes a rigid structure having first and second collars, a quick connect connector having first and second shoulders, and a spring biasing the connector toward an extended position with the first shoulder against the first collar and the second shoulder against the second collar. The first collar and the first shoulder form an inwardly and rearwardly angled contact surface there between, and the second collar and the second shoulder form an inwardly and rearwardly angled contact surface there between. The connector is centered in the first and second collars unless acted upon by a force overcoming the spring and pushing the connector to a retracted position with the first and second shoulders out of contact with the first and second collars. When retracted, the connector may adjust its position longitudinally, vertically, laterally or angularly to facilitate coupling with a mating fixed quick connect connector.

Abstract: A method includes securing a primary cold plate to a secondary cold plate, wherein the primary cold plate is biased away from the secondary cold plate. The secondary cold plate is aligned with a circuit board having heat-generating components, wherein the primary cold plate is aligned with a processor. The method secures the aligned secondary cold plate to the circuit board with a first surface in thermal engagement with the heat-generating components, wherein the primary cold plate is pressed against the processor to overcome the bias, move the primary cold plate toward the secondary cold plate, position the primary cold plate in thermal engagement with the processor, and compress a thermal interface material between the primary and secondary cold plates. A cooling liquid is passed through a liquid cooling channel within the primary cold plate to draw heat from the processor and from the secondary cold plate.

Abstract: An apparatus includes a primary cold plate, a secondary cold plate, and spring biased retainers moveably securing the primary cold plate to the secondary cold plate. The secondary cold plate is securable to a circuit board for thermal engagement with heat-generating components on the circuit board. The primary cold plate is aligned for thermal engagement with a processor on the circuit board and includes an internal liquid cooling channel. The apparatus further comprises compressible thermal interface material disposed between the primary cold plate and the secondary cold plate to conduct heat from the secondary cold plate to the primary cold plate and remove the heat in a liquid flowing through the liquid cooling channel. The apparatus provides thermal engagement and cooling of multiple components having different heights.

Abstract: An apparatus includes a rigid structure having first and second collars, a quick connect connector having first and second shoulders, and a spring biasing the connector toward an extended position with the first shoulder against the first collar and the second shoulder against the second collar. The first collar and the first shoulder form an inwardly and rearwardly angled contact surface there between, and the second collar and the second shoulder form an inwardly and rearwardly angled contact surface there between. The connector is centered in the first and second collars unless acted upon by a force overcoming the spring and pushing the connector to a retracted position with the first and second shoulders out of contact with the first and second collars. When retracted, the connector may adjust its position longitudinally, vertically, laterally or angularly to facilitate coupling with a mating fixed quick connect connector.

Abstract: According to one embodiment, a method for placing an adapter card on a system board of a computer system includes, aligning a tool having an adapter card secured therewith to a slot on a system board of a computer system using a positioning member, and seating the adapter card into the slot on the system board. The tool includes a carrier for supporting the adapter card, at least one lower retaining member extending from a lower portion of the carrier for securing the adapter card to the carrier, at least one upper retaining member extending from an upper portion of the carrier for securing the adapter card to the carrier, and the positioning member coupled to the carrier.

Abstract: An apparatus includes a memory module connector assembly physically secured along an edge of a printed circuit board. The printed circuit board includes a first plurality of contacts on a first surface of the printed circuit board and a second plurality of contacts on a second surface of the printed circuit board. The memory module connector assembly includes a first edge connector socket for receiving a first memory module, a second edge connector socket for receiving a second memory module, a first plurality of electrical leads electrically connecting contacts within the first edge connector socket to the first plurality of contacts on the first side of the printed circuit board, and a second plurality of electrical leads electrically connecting contacts within the second edge connector socket to the second plurality of contacts on the second side of the printed circuit board.

Abstract: An apparatus includes a primary cold plate, a secondary cold plate, and spring biased retainers moveably securing the primary cold plate to the secondary cold plate. The secondary cold plate is securable to a circuit board for thermal engagement with heat-generating components on the circuit board. The primary cold plate is aligned for thermal engagement with a processor on the circuit board and includes an internal liquid cooling channel. The apparatus further comprises compressible thermal interface material disposed between the primary cold plate and the secondary cold plate to conduct heat from the secondary cold plate to the primary cold plate and remove the heat in a liquid flowing through the liquid cooling channel. The apparatus provides thermal engagement and cooling of multiple components having different heights.

Abstract: A method includes securing a primary cold plate to a secondary cold plate, wherein the primary cold plate is biased away from the secondary cold plate. The secondary cold plate is aligned with a circuit board having heat-generating components, wherein the primary cold plate is aligned with a processor. The method secures the aligned secondary cold plate to the circuit board with a first surface in thermal engagement with the heat-generating components, wherein the primary cold plate is pressed against the processor to overcome the bias, move the primary cold plate toward the secondary cold plate, position the primary cold plate in thermal engagement with the processor, and compress a thermal interface material between the primary and secondary cold plates. A cooling liquid is passed through a liquid cooling channel within the primary cold plate to draw heat from the processor and from the secondary cold plate.

Abstract: Each pair of memory modules in a memory system are cooled using a shared cooling pipe, such as a heat pipe or liquid flow pipe. An example embodiment includes one pair of memory module sockets on opposite sides of the respective cooling pipe. An inner heat spreader plate is thermally coupled to the cooling pipe and in thermal engagement with a first face of the memory module adjacent to the included cooling pipe. Heat is conducted from the second face of the memory module to the cooling pipe, such as from an outer plate in thermal engagement with an opposing second face of the memory modules and with the inner plate.

Abstract: A cooling system for a memory module comprises a heat conduction assembly for conducting heat from the memory module to liquid-cooled mounting blocks. In one embodiment, each heat conduction assembly includes a frame having opposing first and second supports, first and second heat spreader plates each extending from the first support to the second support, and a pair of flattened heat pipes each extending along a respective one of the heat spreader plates from the first support to the second support. The liquid-cooled mounting blocks releasably support the heat conduction assembly over a memory module socket with the memory module between the heat spreader plates.

Abstract: A liquid-cooled computer memory system includes first and second blocks in fluid communication with a chilled liquid source. A plurality of spaced-apart heat transfer pipes extend along a system board between memory module sockets from the first manifold block to the second manifold block. The heat transfer pipes may be liquid flow pipes circulating the chilled liquid between the memory module sockets. Alternatively, the heat transfer pipes may be closed heat pipes that conduct heat from the memory modules to the liquid-cooled blocks. A separate heat spreader is provided to thermally bridge each memory module to the adjacent heat transfer pipes.

Abstract: Each pair of memory modules in a memory system are cooled using a shared cooling pipe, such as a heat pipe or liquid flow pipe. An example embodiment includes one pair of memory module sockets on opposite sides of the respective cooling pipe. An inner heat spreader plate is thermally coupled to the cooling pipe and in thermal engagement with a first face of the memory module adjacent to the included cooling pipe. Heat is conducted from the second face of the memory module to the cooling pipe, such as from an outer plate in thermal engagement with an opposing second face of the memory modules and with the inner plate.

Abstract: A liquid cooled planer including: one or more computing components mounted on the planer, wherein at least one or more of the computing components is liquid cooled; one or more conductive cooling components mounted on the planer; and one or more convective cooling components mounted on the planer, wherein the convective cooling components are removable from the planer without removing the conductive cooling components from the planer.

Abstract: A liquid-cooled computer memory system includes first and second blocks in fluid communication with a chilled liquid source. A plurality of spaced-apart heat transfer pipes extend along a system board between memory module sockets from the first manifold block to the second manifold block. The heat transfer pipes may be liquid flow pipes circulating the chilled liquid between the memory module sockets. Alternatively, the heat transfer pipes may be closed heat pipes that conduct heat from the memory modules to the liquid-cooled blocks. A separate heat spreader is provided to thermally bridge each memory module to the adjacent heat transfer pipes.

Abstract: A cooling system for a memory module comprises a heat conduction assembly for conducting heat from the memory module to liquid-cooled mounting blocks. In one embodiment, each heat conduction assembly includes a frame having opposing first and second supports, first and second heat spreader plates each extending from the first support to the second support, and a pair of flattened heat pipes each extending along a respective one of the heat spreader plates from the first support to the second support. The liquid-cooled mounting blocks releasably support the heat conduction assembly over a memory module socket with the memory module between the heat spreader plates.