Patents by Inventor DEREK J. WALTERS
DEREK J. WALTERS has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11399153Abstract: A telepresence system that includes a portable telepresence apparatus coupled to a remote control station. The telepresence apparatus comprises a monitor, a camera, a speaker, a microphone and a viewfinder screen coupled to a housing. The view finder screen allows the user to view the image being captured by the camera. The portable telepresence apparatus is a hand held device that can be moved by a holder of the device in response to audio commands from the remote station. The telepresence apparatus can be used by medical personnel to remotely view a patient in a fast and efficient manner.Type: GrantFiled: August 26, 2010Date of Patent: July 26, 2022Assignee: TELADOC HEALTH, INC.Inventors: Kelton Temby, Charles S Jordan, Daniel S Sanchez, Steven E Butner, Derek J Walters, Fuji Lai, Kevin P Hanrahan, Joshua A Bouganim, James Rosenthal
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Patent number: 10631410Abstract: The present disclosure is related to printed circuit board packages and methods of assembly that may be used in the fabrication of electrical devices. Printed circuit board packages may be manufactured by stacking printed circuit board assemblies. Each printed circuit board assembly may have multiple printed circuit boards supported by a resin mold. The printed circuit board assemblies may be shaped to improve space utilization efficiency and to accommodate large electrical components that are attached to the printed circuit board package.Type: GrantFiled: September 20, 2017Date of Patent: April 21, 2020Assignee: Apple Inc.Inventors: Corey S. Provencher, Meng Chi Lee, Derek J. Walters, Ian A. Spraggs, Flynn P. Carson, Shakti S. Chauhan, Daniel W. Jarvis, David A. Pakula, Jun Zhai, Michael V. Yeh, Alex J. Crumlin, Dennis R. Pyper, Amir Salehi, Vu T. Vo, Gregory N. Stephens
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Patent number: 10455738Abstract: A circuit board assembly in an electronic is disclosed. To conserve space in the electronic device, the circuit board assembly includes stacked circuit boards in electrical communication with each other, such as a first circuit board stacked over a second circuit board. Each circuit board may include multiple surfaces that carry operational components. Moreover, the first circuit board may include a first surface and the second circuit board may include a second surface facing the first surface. The first and second surfaces may include operational components in corresponding locations. Also, the operational components may include corresponding shapes such that one component is positioned in another component. The components may electrically connect to each other. Also, the circuit board assembly may include EMI shields around an outer perimeter in order to shield the operational components form EMI and to components in the electronic device from EMI emanating from the operational components.Type: GrantFiled: September 21, 2017Date of Patent: October 22, 2019Assignee: Apple Inc.Inventors: David A. Pakula, Daniel W. Jarvis, Gregory N. Stephens, Ian A. Spraggs, Vu Thanh Vo, Amir Salehi, Dennis R. Pyper, Alex J. Crumlin, Corey S. Provencher, Derek J. Walters, Michael V. Yeh
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Publication number: 20180092213Abstract: The present disclosure is related to printed circuit board packages and methods of assembly that may be used in the fabrication of electrical devices. Printed circuit board packages may be manufactured by stacking printed circuit board assemblies. Each printed circuit board assembly may have multiple printed circuit boards supported by a resin mold. The printed circuit board assemblies may be shaped to improve space utilization efficiency and to accommodate large electrical components that are attached to the printed circuit board package.Type: ApplicationFiled: September 20, 2017Publication date: March 29, 2018Inventors: Corey S. Provencher, Meng Chi Lee, Derek J. Walters, Ian A. Spraggs, Flynn P. Carson, Shakti S. Chauhan, Daniel W. Jarvis, David A. Pakula, Jun Zhai, Michael V. Yeh, Alex J. Crumlin, Dennis R. Pyper, Amir Salehi, Vu T. Vo, Gregory N. Stephens
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Publication number: 20180084636Abstract: A circuit board assembly in an electronic is disclosed. To conserve space in the electronic device, the circuit board assembly includes stacked circuit boards in electrical communication with each other, such as a first circuit board stacked over a second circuit board. Each circuit board may include multiple surfaces that carry operational components. Moreover, the first circuit board may include a first surface and the second circuit board may include a second surface facing the first surface. The first and second surfaces may include operational components in corresponding locations. Also, the operational components may include corresponding shapes such that one component is positioned in another component. The components may electrically connect to each other. Also, the circuit board assembly may include EMI shields around an outer perimeter in order to shield the operational components form EMI and to components in the electronic device from EMI emanating from the operational components.Type: ApplicationFiled: September 21, 2017Publication date: March 22, 2018Inventors: David A. PAKULA, Daniel W. JARVIS, Gregory N. STEPHENS, Ian A. SPRAGGS, Vu Thanh VO, Amir SALEHI, Dennis R. PYPER, Alex J. CRUMLIN, Corey S. PROVENCHER, Derek J. WALTERS, Michael V. YEH
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Patent number: 9520645Abstract: A wireless electronic device may be provided with components such as electrical and structural components. During transmission of radio-frequency signals, antennas and wireless communications circuitry of the wireless electronic device may produce associated time-varying magnetic fields. One or more components may be covered with magnetic-resistant shield structures that protect the components from the time-varying magnetic fields by preventing magnetic-induced vibrations. The magnetic-resistant shield structures may include a conductive base layer such a layer of brass. A magnetic-resistant layer may be plated onto the conductive base layer. The magnetic-resistant layer may be formed from an amorphous nickel-phosphorous alloy. The amorphous nickel-phosphorous alloy may be produced by controlling the manufacturing temperature and proportion of phosphorous in the alloy while performing the plating operations within a length of time that ensures non-equilibrium conditions during the plating operations.Type: GrantFiled: April 25, 2014Date of Patent: December 13, 2016Assignee: Apple Inc.Inventors: Derek J. Walters, Michael Eng, Brian S. Tryon, Connor R. Duke, Kieran Poulain, Nicholas J. Kunst, Shaohai Chen, Shaoqing Xiang, Sung Woo Yoo, Chun Cheng Teo, Paul Nangeroni, Eric Steven Jol
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Publication number: 20150070236Abstract: A wireless electronic device may be provided with components such as electrical and structural components. During transmission of radio-frequency signals, antennas and wireless communications circuitry of the wireless electronic device may produce associated time-varying magnetic fields. One or more components may be covered with magnetic-resistant shield structures that protect the components from the time-varying magnetic fields by preventing magnetic-induced vibrations. The magnetic-resistant shield structures may include a conductive base layer such a layer of brass. A magnetic-resistant layer may be plated onto the conductive base layer. The magnetic-resistant layer may be formed from an amorphous nickel-phosphorous alloy. The amorphous nickel-phosphorous alloy may be produced by controlling the manufacturing temperature and proportion of phosphorous in the alloy while performing the plating operations within a length of time that ensures non-equilibrium conditions during the plating operations.Type: ApplicationFiled: April 25, 2014Publication date: March 12, 2015Applicant: Apple Inc.Inventors: Derek J. Walters, Michael Eng, Brian S. Tryon, Connor R. Duke, Kieran Poulain, Nicholas J. Kunst, Shaohai Chen, Shaoqing Xiang, Sung Woo Yoo, Chun Cheng Teo, Paul Nangeroni, Eric Steven Jol
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Publication number: 20110213210Abstract: A telepresence system that includes a portable telepresence apparatus coupled to a remote control station. The telepresence apparatus comprises a monitor, a camera, a speaker, a microphone and a viewfinder screen coupled to a housing. The view finder screen allows the user to view the image being captured by the camera. The portable telepresence apparatus is a hand held device that can be moved by a holder of the device in response to audio commands from the remote station. The telepresence apparatus can be used by medical personnel to remotely view a patient in a fast and efficient manner.Type: ApplicationFiled: August 26, 2010Publication date: September 1, 2011Applicant: INTOUCH TECHNOLOGIES, INC.Inventors: KELTON TEMBY, CHARLES S. JORDAN, DANIEL S. SANCHEZ, STEVEN E. BUTNER, DEREK J. WALTERS, FUJI LAI, KEVIN P. HANRAHAN, JOSHUA A. BOUGANIM, JAMES ROSENTHAL