Abstract: A removable assembly for quickly inserting and removing a mass storage device from a compartment situated on the case of a portable computing device is described. The removable assembly is made of a mass storage device, a bracket which serves as a carrier for the mass storage device, and a metal plate. In some embodiments, the mass storage device is a solid state drive (SSD) card. The bracket is a single-piece plastic structure that is deflected for snap insertion into the compartment and snap removal from the compartment. The metal plate conducts heat from the solid state drive (SSD) card to prevent the SSD from overheating.

Abstract: The disclosed embodiments relate to a system that facilitates thermal conductance in a system that includes a module comprising a circuit board with integrated circuits, such as a solid-state drive. A thermal-coupling material between one side of the circuit board and an adjacent baseplate is used to increase thermal conduction between the circuit board and the baseplate. Furthermore, the module may include another thermal-coupling material between the baseplate and a housing that at least in part surrounds the circuit board, thereby increasing thermal conduction between the baseplate and the housing. In these ways, the baseplate and/or the housing may be used as a heat-transfer surfaces or heat spreaders that reduce hotspots associated with operation of the integrated circuits.

Abstract: The disclosed embodiments relate to a system that facilitates thermal conductance in a system that includes a module comprising a circuit board with integrated circuits, such as a solid-state drive. A thermal-coupling material between one side of the circuit board and an adjacent baseplate is used to increase thermal conduction between the circuit board and the baseplate. Furthermore, the module may include another thermal-coupling material between the baseplate and a housing that at least in part surrounds the circuit board, thereby increasing thermal conduction between the baseplate and the housing. In these ways, the baseplate and/or the housing may be used as a heat-transfer surfaces or heat spreaders that reduce hotspots associated with operation of the integrated circuits.

Abstract: Systems and methods for reducing the effects of stray magnetic flux are provided. For example, an electronic device can employ the system and can include a first audio component configured to have a first acoustic phase and a first magnetic phase. The electronic device can also include a second audio component configured to have the first acoustic phase and a second magnetic phase that is opposite the first magnetic phase. The first audio component can be positioned with respect to the second audio component, such that any stray magnetic flux from the first audio component enters the second audio component during operation of the first and second audio components.

Abstract: A portable computing device can include one or more speakers integrated with internal components. In one embodiment, the speakers can be configured to produce audio output signals and direct at least a portion of the audio signals through vents disposed on a base portion of the portable computing device. In one embodiment, the vents can also direct cooling air into the base portion. In one embodiment, the speakers can also be configured to direct a portion of the audio signal through a speaker grille disposed on the base portion. One embodiment of a speaker enclosure can include a resonant cavity for a first audio transducer formed by the speaker enclosure in cooperation with the base portion of the portable computing device and a second audio transducer configured to direct an audio signal beneath a keyboard.

Abstract: A removable assembly for quickly inserting and removing a mass storage device from a compartment situated on the case of a portable computing device is described. The removable assembly is made of a mass storage device, a bracket which serves as a carrier for the mass storage device, and a metal plate. The mass storage device can be a solid state drive (SSD) card. The bracket is a single-piece plastic structure that can be deflected for snap insertion into the compartment and snap removal from the compartment. The metal plate conducts heat from the solid state drive (SSD) card to prevent it from overheating.

Abstract: A portable computing device can include one or more speakers integrated with internal components. In one embodiment, the speakers can be configured to produce audio output signals and direct at least a portion of the audio signals through vents disposed on a base portion of the portable computing device. In one embodiment, the vents can also direct cooling air into the base portion. In one embodiment, the speakers can also be configured to direct a portion of the audio signal through a speaker grille disposed on the base portion. One embodiment of a speaker enclosure can include a resonant cavity for a first audio transducer formed by the speaker enclosure in cooperation with the base portion of the portable computing device and a second audio transducer configured to direct an audio signal beneath a keyboard.

Abstract: The disclosed embodiments relate to a system that facilitates thermal conductance in a system that includes a module comprising a circuit board with integrated circuits, such as a solid-state drive. A thermal-coupling material between one side of the circuit board and an adjacent baseplate is used to increase thermal conduction between the circuit board and the baseplate. Furthermore, the module may include another thermal-coupling material between the baseplate and a housing that at least in part surrounds the circuit board, thereby increasing thermal conduction between the baseplate and the housing. In these ways, the baseplate and/or the housing may be used as a heat-transfer surfaces or heat spreaders that reduce hotspots associated with operation of the integrated circuits.

Abstract: Systems and methods for reducing the effects of stray magnetic flux are provided. For example, an electronic device can employ the system and can include a first audio component configured to have a first acoustic phase and a first magnetic phase. The electronic device can also include a second audio component configured to have the first acoustic phase and a second magnetic phase that is opposite the first magnetic phase. The first audio component can be positioned with respect to the second audio component, such that any stray magnetic flux from the first audio component enters the second audio component during operation of the first and second audio components.