Patents by Inventor Derek John Witkowicki
Derek John Witkowicki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10770339Abstract: A cluster tool assembly includes a vacuum transfer module, a process module having a first side connected to the vacuum transfer module. An isolation valve having a first side and a second side, the first side of the isolation valve coupled to a second side of the process module. A replacement station is coupled to the second side of the isolation valve. The replacement station includes an exchange handler and a part buffer. The part buffer includes a plurality of compartments to hold new or used consumable parts. The process module includes a lift mechanism to enable placement of a consumable part installed in the process module to a raised position. The raised position provides access to the exchange handler to enable removal of the consumable part from the process module and store in a compartment of the part buffer. The exchange handler of the replacement station is configured to provide a replacement for the consumable part from the part buffer back to the process module.Type: GrantFiled: April 29, 2019Date of Patent: September 8, 2020Assignee: Lam Research CorporationInventors: Damon Tyrone Genetti, Jon McChesney, Alex Paterson, Derek John Witkowicki, Austin Ngo
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Patent number: 10427307Abstract: A cluster tool assembly includes a vacuum transfer module, a process module having a first side connected to the vacuum transfer module. An isolation valve having a first side and a second side, the first side of the isolation valve coupled to a second side of the process module. A replacement station is coupled to the second side of the isolation valve. The replacement station includes an exchange handler and a part buffer. The part buffer includes a plurality of compartments to hold new or used consumable parts. The process module includes a lift mechanism to enable placement of a consumable part installed in the process module to a raised position. The raised position provides access to the exchange handler to enable removal of the consumable part from the process module and store in a compartment of the part buffer. The exchange handler of the replacement station is configured to provide a replacement for the consumable part from the part buffer back to the process module.Type: GrantFiled: August 2, 2017Date of Patent: October 1, 2019Assignee: Lam Research CorporationInventors: Damon Tyrone Genetti, Jon McChesney, Alex Paterson, Derek John Witkowicki, Austin Ngo
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Publication number: 20190252234Abstract: A cluster tool assembly includes a vacuum transfer module, a process module having a first side connected to the vacuum transfer module. An isolation valve having a first side and a second side, the first side of the isolation valve coupled to a second side of the process module. A replacement station is coupled to the second side of the isolation valve. The replacement station includes an exchange handler and a part buffer. The part buffer includes a plurality of compartments to hold new or used consumable parts. The process module includes a lift mechanism to enable placement of a consumable part installed in the process module to a raised position. The raised position provides access to the exchange handler to enable removal of the consumable part from the process module and store in a compartment of the part buffer. The exchange handler of the replacement station is configured to provide a replacement for the consumable part from the part buffer back to the process module.Type: ApplicationFiled: April 29, 2019Publication date: August 15, 2019Inventors: Damon Tyrone Genetti, Jon McChesney, Alex Paterson, Derek John Witkowicki, Austin Ngo
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Patent number: 10304717Abstract: A cluster tool assembly includes a vacuum transfer module, a process module having a first side connected to the vacuum transfer module. An isolation valve having a first side and a second side, the first side of the isolation valve coupled to a second side of the process module. A replacement station is coupled to the second side of the isolation valve. The replacement station includes an exchange handler and a part buffer. The part buffer includes a plurality of compartments to hold new or used consumable parts. The process module includes a lift mechanism to enable placement of a consumable part installed in the process module to a raised position. The raised position provides access to the exchange handler to enable removal of the consumable part from the process module and store in a compartment of the part buffer. The exchange handler of the replacement station is configured to provide a replacement for the consumable part from the part buffer back to the process module.Type: GrantFiled: August 3, 2017Date of Patent: May 28, 2019Assignee: Lam Research CorporationInventors: Damon Tyrone Genetti, Jon McChesney, Alex Paterson, Derek John Witkowicki, Austin Ngo
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Patent number: 10297480Abstract: A buffer for use in semiconductor processing tools is disclosed. The buffer may be used to temporarily store wafers after processing operations are performed on those wafers. The buffer may include two side walls and a back wall interposed between the side walls. The side walls and the back wall may generally define an area within which the wafers may be stored in a stacked arrangement. Wafer support fins extending from the side walls and the back wall may extend into a wafer support region that overlaps with the edges of the wafers. Purge gas may be introduced in between each pair of wafers via purge gas ports located in one of the walls.Type: GrantFiled: January 19, 2018Date of Patent: May 21, 2019Assignee: Lam Research CorporationInventors: Martin Robert Maraschin, Richard Howard Gould, Derek John Witkowicki
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Patent number: 10190865Abstract: Methods, kits, systems, and apparatuses, for measuring and/or verifying end effector flatness using electrical continuity are provided.Type: GrantFiled: March 31, 2016Date of Patent: January 29, 2019Assignee: Lam Research CorporationInventors: Silvia Rocio Aguilar Amaya, Derek John Witkowicki, Damon Tyrone Genetti
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Patent number: 10124492Abstract: A cluster tool assembly includes a vacuum transfer module, a process module having a first side connected to the vacuum transfer module. An isolation valve having a first side and a second side, the first side of the isolation valve coupled to a second side of the process module. A replacement station is coupled to the second side of the isolation valve. The replacement station includes an exchange handler and a part buffer. The part buffer includes a plurality of compartments to hold new or used consumable parts. The process module includes a lift mechanism to enable placement of a consumable part installed in the process module to a raised position. The raised position provides access to the exchange handler to enable removal of the consumable part from the process module and store in a compartment of the part buffer. The exchange handler of the replacement station is configured to provide a replacement for the consumable part from the part buffer back to the process module.Type: GrantFiled: February 19, 2016Date of Patent: November 13, 2018Assignee: Lam Research CorporationInventors: Damon Tyrone Genetti, Jon McChesney, Alex Paterson, Derek John Witkowicki, Austin Ngo
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Patent number: 10062590Abstract: A pod for exchanging consumable parts with a process module includes a base plate having a front side, a back side, and first and second lateral sides. A first support column is disposed on the first lateral side proximal to the front side. A second support column is disposed on the second lateral side proximal to the front side. A third support column is disposed on the first lateral side proximal to back side and a fourth support column is disposed on the second lateral side proximal to the back side. Each of the support columns includes a plurality of support fingers distributed lengthwise and directed inward. A first hard stop column is disposed parallel to the third support column and a second hard stop column is disposed parallel to the fourth support column. A shell structure connected to the base plate is configured to enclose the first, second third and fourth support columns, top plate and first and second hard stop columns and includes a front opening disposed on the front side of the base plate.Type: GrantFiled: August 14, 2017Date of Patent: August 28, 2018Assignee: Lam Research CorporationInventors: Scott Wong, Damon Tyrone Genetti, Derek John Witkowicki, Alex Paterson, Richard H. Gould, Austin Ngo, Marc Estoque
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Patent number: 10062589Abstract: A pod for exchanging consumable parts with a process module includes a base plate having a front side, a back side, and first and second lateral sides. A first support column is disposed on the first lateral side proximal to the front side. A second support column is disposed on the second lateral side proximal to the front side. A third support column is disposed on the first lateral side proximal to back side and a fourth support column is disposed on the second lateral side proximal to the back side. Each of the support columns includes a plurality of support fingers distributed lengthwise and directed inward. A first hard stop column is disposed parallel to the third support column and a second hard stop column is disposed parallel to the fourth support column. A shell structure connected to the base plate is configured to enclose the first, second third and fourth support columns, top plate and first and second hard stop columns and includes a front opening disposed on the front side of the base plate.Type: GrantFiled: August 9, 2017Date of Patent: August 28, 2018Assignee: Lam Research CorporationInventors: Scott Wong, Damon Tyrone Genetti, Derek John Witkowicki, Alex Paterson, Richard H. Gould, Austin Ngo, Marc Estoque
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Patent number: 10062599Abstract: A cluster tool assembly includes a vacuum transfer module, a process module having a first side connected to the vacuum transfer module. An isolation valve having a first side and a second side, the first side of the isolation valve coupled to a second side of the process module. A replacement station is coupled to the second side of the isolation valve. The replacement station includes an exchange handler and a part buffer. The part buffer includes a plurality of compartments to hold new or used consumable parts. The process module includes a lift mechanism to enable placement of a consumable part installed in the process module to a raised position. The raised position provides access to the exchange handler to enable removal of the consumable part from the process module and store in a compartment of the part buffer. The exchange handler of the replacement station is configured to provide a replacement for the consumable part from the part buffer back to the process module.Type: GrantFiled: February 19, 2016Date of Patent: August 28, 2018Assignee: Lam Research CorporationInventors: Damon Tyrone Genetti, Jon McChesney, Alex Paterson, Derek John Witkowicki, Austin Ngo
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Publication number: 20180144965Abstract: A buffer for use in semiconductor processing tools is disclosed. The buffer may be used to temporarily store wafers after processing operations are performed on those wafers. The buffer may include two side walls and a back wall interposed between the side walls. The side walls and the back wall may generally define an area within which the wafers may be stored in a stacked arrangement. Wafer support fins extending from the side walls and the back wall may extend into a wafer support region that overlaps with the edges of the wafers. Purge gas may be introduced in between each pair of wafers via purge gas ports located in one of the walls.Type: ApplicationFiled: January 19, 2018Publication date: May 24, 2018Inventors: Martin Robert Maraschin, Richard Howard Gould, Derek John Witkowicki
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Publication number: 20180068879Abstract: A pod for exchanging consumable parts with a process module includes a base plate having a front side, a back side, and first and second lateral sides. A first support column is disposed on the first lateral side proximal to the front side. A second support column is disposed on the second lateral side proximal to the front side. A third support column is disposed on the first lateral side proximal to back side and a fourth support column is disposed on the second lateral side proximal to the back side. Each of the support columns includes a plurality of support fingers distributed lengthwise and directed inward. A first hard stop column is disposed parallel to the third support column and a second hard stop column is disposed parallel to the fourth support column. A shell structure connected to the base plate is configured to enclose the first, second third and fourth support columns, top plate and first and second hard stop columns and includes a front opening disposed on the front side of the base plate.Type: ApplicationFiled: August 14, 2017Publication date: March 8, 2018Inventors: Scott Wong, Damon Tyrone Genetti, Derek John Witkowicki, Alex Paterson, Richard H. Gould, Austin Ngo, Marc Estoque
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Publication number: 20180040492Abstract: A pod for exchanging consumable parts with a process module includes a base plate having a front side, a back side, and first and second lateral sides. A first support column is disposed on the first lateral side proximal to the front side. A second support column is disposed on the second lateral side proximal to the front side. A third support column is disposed on the first lateral side proximal to back side and a fourth support column is disposed on the second lateral side proximal to the back side. Each of the support columns includes a plurality of support fingers distributed lengthwise and directed inward. A first hard stop column is disposed parallel to the third support column and a second hard stop column is disposed parallel to the fourth support column. A shell structure connected to the base plate is configured to enclose the first, second third and fourth support columns, top plate and first and second hard stop columns and includes a front opening disposed on the front side of the base plate.Type: ApplicationFiled: August 14, 2017Publication date: February 8, 2018Inventors: Scott Wong, Damon Tyrone Genetti, Derek John Witkowicki, Alex Paterson, Richard H. Gould, Austin Ngo, Marc Estoque
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Patent number: 9881820Abstract: A pod for exchanging consumable parts with a process module includes a base plate having a front side, a back side, and first and second lateral sides. A first support column is disposed on the first lateral side proximal to the front side. A second support column is disposed on the second lateral side proximal to the front side. A third support column is disposed on the first lateral side proximal to back side and a fourth support column is disposed on the second lateral side proximal to the back side. Each of the support columns includes a plurality of support fingers distributed lengthwise and directed inward. A first hard stop column is disposed parallel to the third support column and a second hard stop column is disposed parallel to the fourth support column. A shell structure connected to the base plate is configured to enclose the first, second third and fourth support columns, top plate and first and second hard stop columns and includes a front opening disposed on the front side of the base plate.Type: GrantFiled: April 25, 2016Date of Patent: January 30, 2018Assignee: Lam Research CorporationInventors: Scott Wong, Damon Tyrone Genetti, Derek John Witkowicki, Alex Paterson, Richard H. Gould, Austin Ngo, Marc Estoque
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Patent number: 9881826Abstract: A buffer for use in semiconductor processing tools is disclosed. The buffer may be used to temporarily store wafers after processing operations are performed on those wafers. The buffer may include two side walls and a back wall interposed between the side walls. The side walls and the back wall may generally define an area within which the wafers may be stored in a stacked arrangement. Wafer support fins extending from the side walls and the back wall may extend into a wafer support region that overlaps with the edges of the wafers. Purge gas may be introduced in between each pair of wafers via purge gas ports located in one of the walls.Type: GrantFiled: October 24, 2014Date of Patent: January 30, 2018Assignee: Lam Research CorporationInventors: Martin Robert Maraschin, Richard Howard Gould, Derek John Witkowicki
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Publication number: 20180019142Abstract: A pod for exchanging consumable parts with a process module includes a base plate having a front side, a back side, and first and second lateral sides. A first support column is disposed on the first lateral side proximal to the front side. A second support column is disposed on the second lateral side proximal to the front side. A third support column is disposed on the first lateral side proximal to back side and a fourth support column is disposed on the second lateral side proximal to the back side. Each of the support columns includes a plurality of support fingers distributed lengthwise and directed inward. A first hard stop column is disposed parallel to the third support column and a second hard stop column is disposed parallel to the fourth support column. A shell structure connected to the base plate is configured to enclose the first, second third and fourth support columns, top plate and first and second hard stop columns and includes a front opening disposed on the front side of the base plate.Type: ApplicationFiled: August 9, 2017Publication date: January 18, 2018Inventors: Scott Wong, Damon Tyrone Genetti, Derek John Witkowicki, Alex Paterson, Richard H. Gould, Austin Ngo, Marc Estoque
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Publication number: 20170334074Abstract: A cluster tool assembly includes a vacuum transfer module, a process module having a first side connected to the vacuum transfer module. An isolation valve having a first side and a second side, the first side of the isolation valve coupled to a second side of the process module. A replacement station is coupled to the second side of the isolation valve. The replacement station includes an exchange handler and a part buffer. The part buffer includes a plurality of compartments to hold new or used consumable parts. The process module includes a lift mechanism to enable placement of a consumable part installed in the process module to a raised position. The raised position provides access to the exchange handler to enable removal of the consumable part from the process module and store in a compartment of the part buffer. The exchange handler of the replacement station is configured to provide a replacement for the consumable part from the part buffer back to the process module.Type: ApplicationFiled: August 2, 2017Publication date: November 23, 2017Inventors: Damon Tyrone Genetti, Jon McChesney, Alex Paterson, Derek John Witkowicki, Austin Ngo
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Publication number: 20170330786Abstract: A cluster tool assembly includes a vacuum transfer module, a process module having a first side connected to the vacuum transfer module. An isolation valve having a first side and a second side, the first side of the isolation valve coupled to a second side of the process module. A replacement station is coupled to the second side of the isolation valve. The replacement station includes an exchange handler and a part buffer. The part buffer includes a plurality of compartments to hold new or used consumable parts. The process module includes a lift mechanism to enable placement of a consumable part installed in the process module to a raised position. The raised position provides access to the exchange handler to enable removal of the consumable part from the process module and store in a compartment of the part buffer. The exchange handler of the replacement station is configured to provide a replacement for the consumable part from the part buffer back to the process module.Type: ApplicationFiled: August 3, 2017Publication date: November 16, 2017Inventors: Damon Tyrone Genetti, Jon McChesney, Alex Paterson, Derek John Witkowicki, Austin Ngo
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Publication number: 20170211922Abstract: Methods, kits, systems, and apparatuses, for measuring and/or verifying end effector flatness using electrical continuity are provided.Type: ApplicationFiled: March 31, 2016Publication date: July 27, 2017Inventors: Silvia Rocio Aguilar Amaya, Derek John Witkowicki, Damon Tyrone Genetti
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Publication number: 20170125272Abstract: Systems and techniques for forming buffer gas microclimates around semiconductor wafers in environments external to a semiconductor processing chamber are disclosed. Such systems may include slot doors that may allow for single wafers to be removed from a multi-wafer stack while limiting outflow of buffer gas from a multi-wafer storage system, as well as buffer gas distributors that move in tandem with robot arms used to transport wafers for at least some of the movements of such robot arms.Type: ApplicationFiled: October 5, 2016Publication date: May 4, 2017Inventors: James Stephen van Gogh, Candi Kristoffersen, Mohsen Salek, Brandon Senn, Harmeet Singh, Derek John Witkowicki, Richard M. Blank, Richard Howard Gould, Efrain Quiles