Patents by Inventor Derek Keefer

Derek Keefer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • MITIGATING PROXIMITY EFFECTS OF DEEP TRENCH VIAS
    Publication number: 20250324697
    Abstract: Disclosed herein are IC structures and devices that aim to mitigate proximity effects of deep trench vias. An example IC structure may include a device region having a first face and a second face, the second face being opposite the first face, and further include a conductive via extending between the first face and the second face, wherein the conductive via includes an electrically conductive material, and wherein a concentration of titanium at sidewalls of the conductive via is below about 1015 atoms per cubic centimeter.
    Type: Application
    Filed: June 27, 2025
    Publication date: October 16, 2025
    Inventors: Avijit Barik, Tao Chu, Minwoo Jang, Tofizur RAHMAN, Conor P. Puls, Ariana E. Bondoc, Diane Lancaster, Chi-Hing Choi, Derek Keefer
  • MITIGATING PROXIMITY EFFECTS OF DEEP TRENCH VIAS
    Publication number: 20250098249
    Abstract: Disclosed herein are IC structures and devices that aim to mitigate proximity effects of deep trench vias. An example IC structure may include a device region having a first face and a second face, the second face being opposite the first face, and further include a conductive via extending between the first face and the second face, wherein the conductive via includes an electrically conductive material, and wherein a concentration of titanium at sidewalls of the conductive via is below about 1015 atoms per cubic centimeter.
    Type: Application
    Filed: September 15, 2023
    Publication date: March 20, 2025
    Applicant: Intel Corporation
    Inventors: Avijit Barik, Tao Chu, Minwoo Jang, Tofizur RAHMAN, Conor P. Puls, Ariana E. Bondoc, Diane Lancaster, Chi-Hing Choi, Derek Keefer